Patents by Inventor Kenneth Minnerly

Kenneth Minnerly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070089865
    Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.
    Type: Application
    Filed: November 20, 2006
    Publication date: April 26, 2007
    Inventors: John Rosenfeld, Kenneth Minnerly
  • Publication number: 20050236143
    Abstract: A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.
    Type: Application
    Filed: May 13, 2005
    Publication date: October 27, 2005
    Inventors: Scott Garner, James Lindemuth, Jerome Toth, John Rosenfeld, Kenneth Minnerly
  • Publication number: 20050217826
    Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
    Type: Application
    Filed: May 13, 2005
    Publication date: October 6, 2005
    Inventors: Peter Dussinger, Thomas Myers, John Rosenfeld, Kenneth Minnerly
  • Publication number: 20050205243
    Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.
    Type: Application
    Filed: May 2, 2005
    Publication date: September 22, 2005
    Inventors: John Rosenfeld, Kenneth Minnerly
  • Publication number: 20050189091
    Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets. provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.
    Type: Application
    Filed: April 6, 2005
    Publication date: September 1, 2005
    Inventors: John Rosenfeld, Kenneth Minnerly
  • Publication number: 20050167086
    Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets. provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.
    Type: Application
    Filed: February 10, 2005
    Publication date: August 4, 2005
    Inventors: John Rosenfeld, Kenneth Minnerly
  • Publication number: 20050145374
    Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
    Type: Application
    Filed: March 1, 2005
    Publication date: July 7, 2005
    Inventors: Peter Dussinger, Thomas Myers, John Rosenfeld, Kenneth Minnerly
  • Publication number: 20050022975
    Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets. provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.
    Type: Application
    Filed: June 26, 2003
    Publication date: February 3, 2005
    Inventors: John Rosenfeld, Kenneth Minnerly
  • Publication number: 20050011633
    Abstract: A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internally facing surface. The grooved, sintered wick comprises a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said at least two adjacent lands that comprises less than about six average particle diameters.
    Type: Application
    Filed: July 14, 2003
    Publication date: January 20, 2005
    Inventors: Scott Garner, James Lindemuth, Jerome Toth, John Rosenfeld, Kenneth Minnerly