Patents by Inventor Kenneth Neil Kendall

Kenneth Neil Kendall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lightweight thermally responsive mold for resin transfer molding
    Patent number: 5653907
    Abstract: A lightweight thermally responsive mold for use with a resin transfer molding process is provided. The mold includes first and second support frames including a plurality of upstanding intersecting support ribs. First and second substrates are supported by the first and second support frames, respectively, for carrying heating tubes therein. First and second hard shells are supported by the first and second substrates, respectively. The shells cooperate to form a mold cavity therebetween. Each shell is less than approximately 10 mm thick in order to provide a low thermal mass and high thermal responsiveness.
    Type: Grant
    Filed: February 15, 1996
    Date of Patent: August 5, 1997
    Assignee: Ford Motor Company
    Inventors: Kenneth Neil Kendall, Alan Robert Harrison