Abstract: A modular liquid-cooled thermal heat sink device configured to thermally engage with a thermal substrate. The device comprises a housing assembly having a body defining a volume, the housing assembly comprising a thermal cooling plate configured to be in thermal contact with the thermal substrate, a fluid inlet and a fluid outlet, the housing assembly being configured to facilitate fluid circulation within the body to effect an operative cooling of the thermal substrate through the thermal cooling plate, the body comprising a plurality of first engaging features spaced about a perimeter of the body.

Abstract: A cooling device for cooling electronic components comprising a primary electronic component, and one or more secondary electronic components of a circuit board is provided. The cooling device comprises a first cooling component. The first cooling component comprises a first cooling member configured to contact a surface of the primary electronic component. The first cooling member is configured to be in fluid communication with a fluid to effect an operative convection cooling of the surface of the primary electronic component. The cooling device further comprises a second cooling component. The second cooling component comprises a second cooling member configured to contact a respective thermal surface of the one or more secondary electronic components to effect an operative conduction cooling of the one or more secondary electronic components. The second cooling member is thermally coupled to the first cooling member.