Abstract: Disclosed are methods and apparatus for testing opto-electronic devices. Test data is shifted into a first boundary-scan cell. A test is then launched from the first boundary-scan cell by outputting the shifted test data to a signal generator. The signal generator, in turn, provides conditioned test data to an opto-electronic transmitter, in response to the shifted test data and at least one constraint for operating the opto-electronic transmitter. Finally, a response to the test is captured.

Abstract: Disclosed are methods and apparatus for testing opto-electronic devices. Test data is shifted into a first boundary-scan cell. A test is then launched from the first boundary-scan cell by outputting the shifted test data to a signal generator. The signal generator, in turn, provides conditioned test data to an opto-electronic transmitter, in response to the shifted test data and at least one constraint for operating the opto-electronic transmitter. Finally, a response to the test is captured.

Abstract: A method and apparatus is disclosed for testing integrated circuit interconnect and measuring the value of passive component interconnecting the IC's. Each IC includes both analog and digital circuitry and is provided with a test access port and boundary scan architecture for selectively connecting components to an analog test bus and for testing for the integrity of interconnections. When connected with the test bus, a constant current is supplied to the component and the resulting voltage developed across the bus is used for identifying the value of the component. In a second embodiment each IC includes a pair of buses which permits measurement of the impedance of the switches connecting the components to the test bus.