Patents by Inventor Kenneth Pettigrew

Kenneth Pettigrew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate containing aperture and methods of forming the same
    Patent number: 8894868
    Abstract: A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: November 25, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Andy Hooper, Daragh Finn, Tim Webb, Lynn Sheehan, Kenneth Pettigrew, Yu Chong Tai
  • SUBSTRATE CONTAINING APERTURE AND METHODS OF FORMING THE SAME
    Publication number: 20130089701
    Abstract: A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.
    Type: Application
    Filed: October 6, 2011
    Publication date: April 11, 2013
    Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
    Inventors: Andy Hooper, Daragh Finn, Tim Webb, Lynn Sheehan, Kenneth Pettigrew, Yu Chong Tai