Patents by Inventor Kenneth R. Dillon
Kenneth R. Dillon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6984935Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.Type: GrantFiled: September 8, 2004Date of Patent: January 10, 2006Assignee: 3M Innovative Properties CompanyInventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
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Patent number: 6802754Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.Type: GrantFiled: July 24, 2003Date of Patent: October 12, 2004Assignee: 3M Innovative Properties CompanyInventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
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Publication number: 20040137175Abstract: An insulating liner for use with exhaust system or pollution control devices such as catalytic converters and diesel particulate filters or traps. The insulating liner is shown in relation to an end cone for use with a catalytic converter. The end cone includes an outer metallic end cone and a free-standing insulating cone positioned within the outer metallic end cone. A substantial portion of the inner surface of the insulating liner is exposed to hot exhaust gas from an internal combustion engine. The insulating liner is preferably formed of a composite containing inorganic fibers and/or particles, which makes the insulating liner rigid, yet capable of withstanding repeated mechanical and thermal shocks.Type: ApplicationFiled: December 22, 2003Publication date: July 15, 2004Applicant: 3M Innovative Properties CompanyInventors: Kenneth R. Dillon, Richard P. Merry, Stephen M. Sanocki
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Patent number: 6726884Abstract: An insulating liner for use with exhaust system or pollution control devices such as catalytic converters and diesel particulate filters or traps. The insulating liner is shown in relation to an end cone for use with a catalytic converter. The end cone includes an outer metallic end cone and a free-standing insulating cone positioned within the outer metallic end cone. A substantial portion of the inner surface of the insulating liner is exposed to hot exhaust gas from an internal combustion engine. The insulating liner is preferably formed of a composite containing inorganic fibers and/or particles, which makes the insulating liner rigid, yet capable of withstanding repeated mechanical and thermal shocks.Type: GrantFiled: June 18, 1996Date of Patent: April 27, 2004Assignee: 3M Innovative Properties CompanyInventors: Kenneth R. Dillon, Richard P. Merry, Stephen M. Sanocki
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Patent number: 6713526Abstract: A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.Type: GrantFiled: January 24, 2002Date of Patent: March 30, 2004Assignee: 3M Innovative Properties CompanyInventors: Kenneth R. Dillon, Kyung H. Moh, Thomas Edward Wood, Raymond C. Chiu, Vincent Wen-Shiuan King, Richard P. Rusin
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Publication number: 20040058614Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.Type: ApplicationFiled: July 24, 2003Publication date: March 25, 2004Applicant: 3M Innovative Properties CompanyInventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
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Patent number: 6616887Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.Type: GrantFiled: October 5, 2001Date of Patent: September 9, 2003Assignee: 3M Innovative Properties CompanyInventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
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Publication number: 20020102411Abstract: A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.Type: ApplicationFiled: January 24, 2002Publication date: August 1, 2002Applicant: 3M Innovative Properties CompanyInventors: Kenneth R. Dillon, Kyung H. Moh, Thomas Edward Wood, Raymond C. Chiu, Vincent Wen-Shiuan King, Richard P. Rusin
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Publication number: 20020038916Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.Type: ApplicationFiled: October 5, 2001Publication date: April 4, 2002Applicant: 3M Innovative Properties CompanyInventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
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Patent number: 6352763Abstract: A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.Type: GrantFiled: December 23, 1998Date of Patent: March 5, 2002Assignee: 3M Innovative Properties CompanyInventors: Kenneth R. Dillon, Kyung H. Moh, Thomas Edward Wood, Raymond C. Chiu, Vincent Wen-Shiuan King, Richard P. Rusin, Timothy Lee Hoopman, Paul Edward Humpal
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Patent number: 6325610Abstract: An apparatus for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.Type: GrantFiled: February 8, 2001Date of Patent: December 4, 2001Assignee: 3M Innovative Properties CompanyInventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
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Publication number: 20010007682Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.Type: ApplicationFiled: February 8, 2001Publication date: July 12, 2001Applicant: 3M Innovative Properties CompanyInventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
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Patent number: 6247986Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.Type: GrantFiled: December 23, 1998Date of Patent: June 19, 2001Assignee: 3M Innovative Properties CompanyInventors: Raymond C. Chiu, Timothy Lee Hoopman, Parul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
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Patent number: 4554218Abstract: A precision molded article, such as a die cavity, is made by combining granules of a first metal or alloy and a second metal or alloy, the second metal or alloy having a homogeneous appearance at some temperature below its melting point, and a higher Rockwell Hardness than the first metal or alloy, mixing the granules with a heat fugitive organic binder, molding the granule-binder mixture into a green molded preform, thermally degrading and removing essentially all the binder to form a skeletal preform, and infiltrating the preform with a third metal or alloy which will wet the second metal or alloy and has a lower Rockwell Hardness than the second metal or alloy, thereby forming a molded article having granules of first metal or alloy the majority of which are fully enveloped within a single skeleton of the second metal or alloy, the skeleton of second metal or alloy being surrounded by layers or matrices of softer metals.Type: GrantFiled: May 18, 1984Date of Patent: November 19, 1985Assignee: Minnesota Mining and Manufacturing CompanyInventors: Richard N. Gardner, Kenneth R. Dillon
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Patent number: 4455354Abstract: The shrinkage normally encountered when molding a mixture of spherical cobalt-containing particles and thermoplastic binder, heating the resulting molded article to degrade the binder and form a porous preform, and infiltrating the same is counteracted by adding finely divided elemental iron or elemental nickel to the spherical cobalt-containing particles. In addition to improving dimensional control, the elemental powder addition increases impact strength while maintaining hardness.Type: GrantFiled: November 14, 1980Date of Patent: June 19, 1984Assignee: Minnesota Mining and Manufacturing CompanyInventors: Kenneth R. Dillon, Richard L. Terchek
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Patent number: 4431449Abstract: A molded, non-refractory metal article is made by molding in a flexible mold a plastic mixture of non-refractory, spherical metal powders and a heat-fugitive binder comprising thermoplastic material to form a green article of predetermined shape and dimensions, heating the green article to remove said binder and consolidate the non-refractory spherical powders in the form of a porous, monolithic skeleton of necked particles of non-refractory metal, infiltrating the skeleton with a molten metal having a melting point that is at least 25.degree. C. less than the melting point of the lowest melting of said spherical, non-refractory metal particles, and cooling the infiltrated skeleton thereby forming a homogeneous, void-free, non-refractory metal article of two intermeshed metal matrices.Type: GrantFiled: June 1, 1983Date of Patent: February 14, 1984Assignee: Minnesota Mining and Manufacturing CompanyInventors: Kenneth R. Dillon, Richard L. Terchek
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Patent number: 4327156Abstract: A precision molded article, such as a die cavity, is made by combining granules of a refractory and granules of a first metal or alloy which has a homogeneous crystalline appearance at a temperature below its melting point and has a lower Rockwell Hardness than the refractory, mixing the granules with a heat fugitive organic binder, molding the granule-binder mixture into a green molded preform, thermally degrading and removing essentially all the binder to form a skeletal preform, and infiltrating the preform with a second metal or alloy which will wet the first metal or alloy and has a lower Rockwell Hardness than the first metal or alloy, thereby forming a molded article having refractory granules fully enveloped within a single skeleton of the first metal or alloy, the refractory granules and skeleton of first metal being surrounded by layers or matrices of softer metals.Type: GrantFiled: May 12, 1980Date of Patent: April 27, 1982Assignee: Minnesota Mining and Manufacturing CompanyInventors: Kenneth R. Dillon, Richard N. Gardner
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Patent number: RE40967Abstract: A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.Type: GrantFiled: March 29, 2006Date of Patent: November 10, 2009Assignee: 3M Innovative Properties CompanyInventors: Kenneth R. Dillon, Kyung H. Moh, Thomas E. Wood, Raymond C. Chiu, Vincent W. King, Richard P. Rusin