Abstract: Methods for determining customized defect detection inspection plans are provided. One method includes fabricating a test chip and generating test chip data from the fabricated test chip. Then, defining systematic signatures from the generated test chip data and identifying a yield relevant systematic signature from the defined systematic signatures. The method includes identifying a layout pattern associated with the yield relevant systematic signature and locating the identified layout pattern on a process module layer of a product chip. Further, the method includes defining a customized defect detection inspection or metrology methodology for detecting systematic defects on the process module layer based on the identified layout pattern associated with the yield relevant systematic signature.

Abstract: A device and method for mass producing reflection holograms. Photosensitive material is drawn across an object to be copied and coherent radiation is scanned across the material and the object. The object may comprise a component which is variable, such as a counter, or a hologram. The exposed photosensitive material is removed from the object, the symbols on the object are changed if desired, fresh material is moved into place, and a new hologram is created. The holograms of the present invention preferably have the capability to be sequentially or individually numbered or otherwise customized with a variety of symbols, for example for security purposes.

Abstract: An outer edge ring of a semiconductor wafer is polished to prevent delamination and peeling-off of at least one layer of material deposited near the outer edge of the semiconductor wafer during fabrication of integrated circuits. The semiconductor wafer is mounted on a wafer chuck, and the wafer chuck holding the semiconductor wafer is rotated such that the semiconductor wafer rotates. A polishing pad is moved toward the semiconductor wafer as the semiconductor wafer is rotating. The polishing pad has a polishing surface that faces and contacts the outer edge ring of the semiconductor wafer as the polishing pad is moved toward the semiconductor wafer to polish the outer edge ring of the semiconductor wafer. The outer edge ring has the at least one layer of material that is polished off by the polishing surface of the polishing pad.

Abstract: A system for converting an image into a hologram formed from diffraction gratings includes obtaining image data for each pixel in an image to be converted, putting the image into digital form and using the image data to control portions of a laser beam split into a reference beam and at least one object beam. The diffraction gratings are formed by an interference pattern of a reference beam and at least one object beam. intersecting on a profitable surface on a pixel-by-pixel basis. Modulation of at least one object beam and adjustment of the angle at which that beam interferes with the reference beam on the profitable surface is used to reflect image data for each pixel of the image being converted into a hologram.

Abstract: An outer edge ring of a semiconductor wafer is polished to prevent delamination and peeling-off of at least one layer of material deposited near the outer edge of the semiconductor wafer during fabrication of integrated circuits. The semiconductor wafer is mounted on a wafer chuck, and the wafer chuck holding the semiconductor wafer is rotated such that the semiconductor wafer rotates. A polishing pad is moved toward the semiconductor wafer as the semiconductor wafer is rotating. The polishing pad has a polishing surface that faces and contacts the outer edge ring of the semiconductor wafer as the polishing pad is moved toward the semiconductor wafer to polish the outer edge ring of the semiconductor wafer. The outer edge ring has the at least one layer of material that is polished off by the polishing surface of the polishing pad.

Abstract: An enclosed ink cup for a pad-type printing machine including a hollow structure defining a reservoir region that is closed around the sides and top, is open only at the bottom, and has a lower edge for sealably contacting an engraved printing plate so as to contain ink within the structure over the plate, and a vacuum port in the structure that communicates with the top of the region for applying a vacuum to the region above the ink to promote sealable contact between the lower edge and the plate.

Abstract: An enclosed ink cup for a pad-type printing machine including a hollow support having a continuous wall surrounding and defining a reservoir region and an opening to the reservoir region at the bottom of the region, and a continuous, sheet metal band disposed around and conforming to an outer vertical surface of the wall, the band having a lower portion extending below the hollow support for sealably contacting an engraved printing plate so as to contain ink within the band over said plate.

Abstract: Apparatus for moving a container from a first container position to a second container position in which the container is spaced from the first position and in a different orientation, the apparatus including a drive member that is rotatable about a first axis between a first drive member position and a second drive member position, the first axis being spaced from the first container position, and a gripper for gripping the container, the gripper being rotatably mounted on the drive member about a second axis that is transverse to the first axis and rotates with the drive member, the gripper being rotatable between a first gripper position and a second gripper position, a container engaged by the gripper being in the first container position when the drive member and gripper are in their respective first positions and in the second container position when the drive member and gripper are in their respective second positions.

Abstract: An apparatus (10) for drying a substance is disclosed. Apparatus (10) includes a pair of side-by-side cylinders (12). Drums (14) are concentrically journalled within cylinders (12). Rows of slightly spiralled chains (40) are attached to drums (14). As the drying substance moves under the influence of gravity and the velocity of a hot gas, it also is forced centrifugally outwardly so as to pass through aperture (25) to impact oncoming drying substance. The drying substance is pulverized and the drying function is accomplished more efficiently.