Patents by Inventor Kenneth R. Hencken

Kenneth R. Hencken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10954931
    Abstract: In a linear displacement pump, liquid is discharged by driving a piston along at least part of a stroke length. While discharging the liquid, a linear position of the piston is sensed at a plurality of positions along the stroke length, and a plurality of output signals is produced. Based on one or more of the output signals, an operational state of the pump is determined.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: March 23, 2021
    Assignee: DH TECHNOLOGIES DEVELOPMENT PTE. LTD.
    Inventors: Phillip H. Paul, Kenneth R. Hencken
  • Publication number: 20160169223
    Abstract: In a linear displacement pump, liquid is discharged by driving a piston along at least part of a stroke length. While discharging the liquid, a linear position of the piston is sensed at a plurality of positions along the stroke length, and a plurality of output signals is produced. Based on one or more of the output signals, an operational state of the pump is determined.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Phillip H. Paul, Kenneth R. Hencken
  • Publication number: 20130085462
    Abstract: A wound treatment system includes a patch, first and second fluid reservoirs, an electrokinetic pump assembly, and a controller. The patch is configured to enclose a wound area and includes an inlet and an outlet. The first fluid reservoir is fluidically connected to the inlet and the second fluid reservoir is fluidically connected to the outlet. The electrokinetic pump assembly is configured to pump a first treatment fluid from the first fluid reservoir into the patch through the inlet and to pump fluid from the patch through the outlet and into the second fluid reservoir. The controller is configured to operate the electrokinetic pump assembly and to include an electronic memory containing computer readable instructions for operating the electrokinetic pump assembly to perform a wound therapy protocol in the wound area.
    Type: Application
    Filed: October 1, 2012
    Publication date: April 4, 2013
    Inventors: Kenneth Kei-ho NIP, Jessica L. Strohmann, Doris Sun-Chia Shieh, Tuan Quoc Mai, Robert B. Lewis, Kenneth R. Hencken, Craig S. Bryant
  • Publication number: 20120282111
    Abstract: A method of controlling the output of an electrokinetic pump to deliver a target stroke volume includes applying a pump drive signal to the electrokinetic pump for a pump stroke time duration and then determining a volume of a delivery fluid pumped. Then, comparing the volume of the delivery fluid pumped to the target stroke volume; generate a new time interval for applying the pump drive signal. Then apply the pump drive signal to the electrokinetic pump for the new time interval. A system for delivery of fluid includes an electrokinetic pump under the control of an electronic controller. The electronic controller contains computer readable instructions to determine an output of the electrokinetic pump and then generate a stroke time delivery adjustment for precise pumping schemes.
    Type: Application
    Filed: May 7, 2012
    Publication date: November 8, 2012
    Inventors: Kenneth Kei-ho Nip, Kenneth R. Hencken, Doris Sun-Chia Shieh, Robert B. Lewis, Tuan Quoc Mai
  • Publication number: 20120282112
    Abstract: An electrokinetic system includes a first electrokinetic pump, a second electrokinetic pump, a reservoir having delivery fluid therein, and a controller. The first electrokinetic pump is configured to provide a first range of flow rates. The second electrokinetic pump is configured to provide a second range of flow rates. The second range includes flow rates that are greater than the flow rates of the first range. The reservoir is fluidically attached to the first electrokinetic pump and the second electrokinetic pump. The controller is configured to apply voltage to one of the first or second electrokinetic pumps and then apply voltage to the other of the first or second electrokinetic pumps so as to vary the flow rate range of delivery fluid pump from the reservoir.
    Type: Application
    Filed: May 7, 2012
    Publication date: November 8, 2012
    Inventors: Kenneth Kei-ho Nip, Kenneth R. Hencken, Doris Sun-Chia Shieh, Robert B. Lewis, Tuan Quoc Mai
  • Patent number: 8021056
    Abstract: A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13, 15; 23, 25) or grooves (141, 151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: September 20, 2011
    Assignee: AB Sciex, LLC
    Inventors: Don W. Arnold, Kenneth R. Hencken, Sammy S. Datwani, Patrick Pak-Ho Leung, Douglas R. Cyr, Jason E. Rehm
  • Publication number: 20110018259
    Abstract: A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13, 15; 23, 25) or grooves (141, 151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates.
    Type: Application
    Filed: September 1, 2010
    Publication date: January 27, 2011
    Applicant: AB SCIEX LLC
    Inventors: Don W. Arnold, Kenneth R. Hencken, Sammy S. Datwani, Patrick Pak-Ho Leung, Douglas R. Cyr, Jason E. Rehm
  • Patent number: 7802923
    Abstract: A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13,15; 23,25) or grooves (141,151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates.
    Type: Grant
    Filed: April 1, 2005
    Date of Patent: September 28, 2010
    Assignee: AB Sciex LLC
    Inventors: Don W. Arnold, Kenneth R. Hencken, Sammy S. Datwani, Patrick Pak-Ho Leung, Douglas R. Cyr, Jason E. Rehm
  • Publication number: 20090129728
    Abstract: A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13,15; 23,25) or grooves (141,151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates.
    Type: Application
    Filed: April 1, 2005
    Publication date: May 21, 2009
    Applicant: Eksigent Technologies LLC
    Inventors: Don W. Arnold, Kenneth R. Hencken, Sammy S. Datwani, Patrick Pak-Ho Leung, Douglas R. Cyr, Jason E. Rehm
  • Patent number: 6770183
    Abstract: An electrokinetic pump in which the porous dielectric medium of conventional electrokinetic pumps is replaced by a patterned microstructure. The patterned microstructure is fabricated by lithographic patterning and etching of a substrate and is formed by features arranged so as to create an array of microchannels. The microchannels have dimensions on the order of the pore spacing in a conventional porous dielectric medium. Embedded unitary electrodes are vapor deposited on either end of the channel structure to provide the electric field necessary for electroosmotic flow.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: August 3, 2004
    Assignee: Sandia National Laboratories
    Inventors: Kenneth R. Hencken, George B. Sartor
  • Patent number: 6572749
    Abstract: An electrokinetic high pressure hydraulic pump for manipulating fluids in capillary-based system. The pump uses electro-osmotic flow to provide a high pressure hydraulic system, having no moving mechanical parts, for pumping and/or compressing fluids, for providing valve means and means for opening and closing valves, for controlling fluid flow rate, and manipulating fluid flow generally and in capillary-based systems (microsystems), in particular. The compact nature of the inventive high pressure hydraulic pump provides the ability to construct a micro-scale or capillary-based HPLC system that fulfills the desire for small sample quantity, low solvent consumption, improved efficiency, the ability to run samples in parallel, and field portability. Control of pressure and solvent flow rate is achieved by controlling the voltage applied to an electrokinetic pump.
    Type: Grant
    Filed: July 23, 2001
    Date of Patent: June 3, 2003
    Assignee: Sandia Corporation
    Inventors: Phillip H. Paul, David J. Rakestraw, Don W. Arnold, Kenneth R. Hencken, Joseph S. Schoeniger, David W. Neyer
  • Patent number: 6277257
    Abstract: An electrokinetic high pressure hydraulic pump for manipulating fluids in capillary-based systems. The pump uses electro-osmotic flow to provide a high pressure hydraulic system, having no moving mechanical parts, for pumping and/or compressing fluids, for providing valve means and means for opening and closing valves, for controlling fluid flow rate, and manipulating fluid flow generally and in capillary-based systems (Microsystems), in particular. The compact nature of the inventive high pressure hydraulic pump provides the ability to construct a micro-scale or capillary-based HPLC system that fulfills the desire for small sample quantity, low solvent consumption, improved efficiency, the ability to run samples in parallel, and field portability. Control of pressure and solvent flow rate is achieved by controlling the voltage applied to an electrokinetic pump.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: August 21, 2001
    Assignee: Sandia Corporation
    Inventors: Phillip H. Paul, David J. Rakestraw, Don W. Arnold, Kenneth R. Hencken, Joseph S. Schoeniger, David W. Neyer
  • Patent number: 6224728
    Abstract: A valve for controlling fluid flows. This valve, which includes both an actuation device and a valve body provides: the ability to incorporate both the actuation device and valve into a unitary structure that can be placed onto a microchip, the ability to generate higher actuation pressures and thus control higher fluid pressures than conventional microvalves, and a device that draws only microwatts of power. An electrokinetic pump that converts electric potential to hydraulic force is used to operate, or actuate, the valve.
    Type: Grant
    Filed: August 13, 1999
    Date of Patent: May 1, 2001
    Assignee: Sandia Corporation
    Inventors: Michael C. Oborny, Phillip H. Paul, Kenneth R. Hencken, Gregory C. Frye-Mason, Ronald P. Manginell
  • Patent number: 6061641
    Abstract: This invention pertains generally to a method for improving the accuracy of particle analysis under conditions of discrete particle loading and particularly to a method for improving signal-to-noise ratio and instrument response in laser spark spectroscopic analysis of particulate emissions. Under conditions of low particle density loading (particles/m.sup.3) resulting from low overall metal concentrations and/or large particle size uniform sampling can not be guaranteed. The present invention discloses a technique for separating laser sparks that arise from sample particles from those that do not; that is, a process for systematically "gating" the instrument response arising from "sampled" particles from those responses which do not, is dislosed as a solution to his problem. The disclosed approach is based on random sampling combined with a conditional analysis of each pulse. A threshold value is determined for the ratio of the intensity of a spectral line for a given element to a baseline region.
    Type: Grant
    Filed: October 23, 1997
    Date of Patent: May 9, 2000
    Inventors: David W. Hahn, Kenneth R. Hencken, Howard A. Johnsen, William L. Flower
  • Patent number: 4441816
    Abstract: A method for in situ measurement of particle size is described. The size information is obtained by scanning an image of the particle across a double-slit mask and observing the transmitted light. This method is useful when the particle size of primary interest is 3 .mu.m and larger. The technique is well suited to applications in which the particles are non-spherical and have unknown refractive index. It is particularly well suited to high temperature environments in which the particle incandescence provides the light source.
    Type: Grant
    Filed: March 25, 1982
    Date of Patent: April 10, 1984
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Kenneth R. Hencken, Daniel A. Tichenor, James C. F. Wang