Patents by Inventor Kenneth R. Hencken
Kenneth R. Hencken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10954931Abstract: In a linear displacement pump, liquid is discharged by driving a piston along at least part of a stroke length. While discharging the liquid, a linear position of the piston is sensed at a plurality of positions along the stroke length, and a plurality of output signals is produced. Based on one or more of the output signals, an operational state of the pump is determined.Type: GrantFiled: December 12, 2014Date of Patent: March 23, 2021Assignee: DH TECHNOLOGIES DEVELOPMENT PTE. LTD.Inventors: Phillip H. Paul, Kenneth R. Hencken
-
Publication number: 20160169223Abstract: In a linear displacement pump, liquid is discharged by driving a piston along at least part of a stroke length. While discharging the liquid, a linear position of the piston is sensed at a plurality of positions along the stroke length, and a plurality of output signals is produced. Based on one or more of the output signals, an operational state of the pump is determined.Type: ApplicationFiled: December 12, 2014Publication date: June 16, 2016Inventors: Phillip H. Paul, Kenneth R. Hencken
-
Publication number: 20130085462Abstract: A wound treatment system includes a patch, first and second fluid reservoirs, an electrokinetic pump assembly, and a controller. The patch is configured to enclose a wound area and includes an inlet and an outlet. The first fluid reservoir is fluidically connected to the inlet and the second fluid reservoir is fluidically connected to the outlet. The electrokinetic pump assembly is configured to pump a first treatment fluid from the first fluid reservoir into the patch through the inlet and to pump fluid from the patch through the outlet and into the second fluid reservoir. The controller is configured to operate the electrokinetic pump assembly and to include an electronic memory containing computer readable instructions for operating the electrokinetic pump assembly to perform a wound therapy protocol in the wound area.Type: ApplicationFiled: October 1, 2012Publication date: April 4, 2013Inventors: Kenneth Kei-ho NIP, Jessica L. Strohmann, Doris Sun-Chia Shieh, Tuan Quoc Mai, Robert B. Lewis, Kenneth R. Hencken, Craig S. Bryant
-
Publication number: 20120282111Abstract: A method of controlling the output of an electrokinetic pump to deliver a target stroke volume includes applying a pump drive signal to the electrokinetic pump for a pump stroke time duration and then determining a volume of a delivery fluid pumped. Then, comparing the volume of the delivery fluid pumped to the target stroke volume; generate a new time interval for applying the pump drive signal. Then apply the pump drive signal to the electrokinetic pump for the new time interval. A system for delivery of fluid includes an electrokinetic pump under the control of an electronic controller. The electronic controller contains computer readable instructions to determine an output of the electrokinetic pump and then generate a stroke time delivery adjustment for precise pumping schemes.Type: ApplicationFiled: May 7, 2012Publication date: November 8, 2012Inventors: Kenneth Kei-ho Nip, Kenneth R. Hencken, Doris Sun-Chia Shieh, Robert B. Lewis, Tuan Quoc Mai
-
Publication number: 20120282112Abstract: An electrokinetic system includes a first electrokinetic pump, a second electrokinetic pump, a reservoir having delivery fluid therein, and a controller. The first electrokinetic pump is configured to provide a first range of flow rates. The second electrokinetic pump is configured to provide a second range of flow rates. The second range includes flow rates that are greater than the flow rates of the first range. The reservoir is fluidically attached to the first electrokinetic pump and the second electrokinetic pump. The controller is configured to apply voltage to one of the first or second electrokinetic pumps and then apply voltage to the other of the first or second electrokinetic pumps so as to vary the flow rate range of delivery fluid pump from the reservoir.Type: ApplicationFiled: May 7, 2012Publication date: November 8, 2012Inventors: Kenneth Kei-ho Nip, Kenneth R. Hencken, Doris Sun-Chia Shieh, Robert B. Lewis, Tuan Quoc Mai
-
Patent number: 8021056Abstract: A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13, 15; 23, 25) or grooves (141, 151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates.Type: GrantFiled: September 1, 2010Date of Patent: September 20, 2011Assignee: AB Sciex, LLCInventors: Don W. Arnold, Kenneth R. Hencken, Sammy S. Datwani, Patrick Pak-Ho Leung, Douglas R. Cyr, Jason E. Rehm
-
Publication number: 20110018259Abstract: A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13, 15; 23, 25) or grooves (141, 151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates.Type: ApplicationFiled: September 1, 2010Publication date: January 27, 2011Applicant: AB SCIEX LLCInventors: Don W. Arnold, Kenneth R. Hencken, Sammy S. Datwani, Patrick Pak-Ho Leung, Douglas R. Cyr, Jason E. Rehm
-
Patent number: 7802923Abstract: A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13,15; 23,25) or grooves (141,151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates.Type: GrantFiled: April 1, 2005Date of Patent: September 28, 2010Assignee: AB Sciex LLCInventors: Don W. Arnold, Kenneth R. Hencken, Sammy S. Datwani, Patrick Pak-Ho Leung, Douglas R. Cyr, Jason E. Rehm
-
Publication number: 20090129728Abstract: A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13,15; 23,25) or grooves (141,151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates.Type: ApplicationFiled: April 1, 2005Publication date: May 21, 2009Applicant: Eksigent Technologies LLCInventors: Don W. Arnold, Kenneth R. Hencken, Sammy S. Datwani, Patrick Pak-Ho Leung, Douglas R. Cyr, Jason E. Rehm
-
Patent number: 6770183Abstract: An electrokinetic pump in which the porous dielectric medium of conventional electrokinetic pumps is replaced by a patterned microstructure. The patterned microstructure is fabricated by lithographic patterning and etching of a substrate and is formed by features arranged so as to create an array of microchannels. The microchannels have dimensions on the order of the pore spacing in a conventional porous dielectric medium. Embedded unitary electrodes are vapor deposited on either end of the channel structure to provide the electric field necessary for electroosmotic flow.Type: GrantFiled: July 26, 2001Date of Patent: August 3, 2004Assignee: Sandia National LaboratoriesInventors: Kenneth R. Hencken, George B. Sartor
-
Patent number: 6572749Abstract: An electrokinetic high pressure hydraulic pump for manipulating fluids in capillary-based system. The pump uses electro-osmotic flow to provide a high pressure hydraulic system, having no moving mechanical parts, for pumping and/or compressing fluids, for providing valve means and means for opening and closing valves, for controlling fluid flow rate, and manipulating fluid flow generally and in capillary-based systems (microsystems), in particular. The compact nature of the inventive high pressure hydraulic pump provides the ability to construct a micro-scale or capillary-based HPLC system that fulfills the desire for small sample quantity, low solvent consumption, improved efficiency, the ability to run samples in parallel, and field portability. Control of pressure and solvent flow rate is achieved by controlling the voltage applied to an electrokinetic pump.Type: GrantFiled: July 23, 2001Date of Patent: June 3, 2003Assignee: Sandia CorporationInventors: Phillip H. Paul, David J. Rakestraw, Don W. Arnold, Kenneth R. Hencken, Joseph S. Schoeniger, David W. Neyer
-
Patent number: 6277257Abstract: An electrokinetic high pressure hydraulic pump for manipulating fluids in capillary-based systems. The pump uses electro-osmotic flow to provide a high pressure hydraulic system, having no moving mechanical parts, for pumping and/or compressing fluids, for providing valve means and means for opening and closing valves, for controlling fluid flow rate, and manipulating fluid flow generally and in capillary-based systems (Microsystems), in particular. The compact nature of the inventive high pressure hydraulic pump provides the ability to construct a micro-scale or capillary-based HPLC system that fulfills the desire for small sample quantity, low solvent consumption, improved efficiency, the ability to run samples in parallel, and field portability. Control of pressure and solvent flow rate is achieved by controlling the voltage applied to an electrokinetic pump.Type: GrantFiled: March 18, 1999Date of Patent: August 21, 2001Assignee: Sandia CorporationInventors: Phillip H. Paul, David J. Rakestraw, Don W. Arnold, Kenneth R. Hencken, Joseph S. Schoeniger, David W. Neyer
-
Patent number: 6224728Abstract: A valve for controlling fluid flows. This valve, which includes both an actuation device and a valve body provides: the ability to incorporate both the actuation device and valve into a unitary structure that can be placed onto a microchip, the ability to generate higher actuation pressures and thus control higher fluid pressures than conventional microvalves, and a device that draws only microwatts of power. An electrokinetic pump that converts electric potential to hydraulic force is used to operate, or actuate, the valve.Type: GrantFiled: August 13, 1999Date of Patent: May 1, 2001Assignee: Sandia CorporationInventors: Michael C. Oborny, Phillip H. Paul, Kenneth R. Hencken, Gregory C. Frye-Mason, Ronald P. Manginell
-
Patent number: 6061641Abstract: This invention pertains generally to a method for improving the accuracy of particle analysis under conditions of discrete particle loading and particularly to a method for improving signal-to-noise ratio and instrument response in laser spark spectroscopic analysis of particulate emissions. Under conditions of low particle density loading (particles/m.sup.3) resulting from low overall metal concentrations and/or large particle size uniform sampling can not be guaranteed. The present invention discloses a technique for separating laser sparks that arise from sample particles from those that do not; that is, a process for systematically "gating" the instrument response arising from "sampled" particles from those responses which do not, is dislosed as a solution to his problem. The disclosed approach is based on random sampling combined with a conditional analysis of each pulse. A threshold value is determined for the ratio of the intensity of a spectral line for a given element to a baseline region.Type: GrantFiled: October 23, 1997Date of Patent: May 9, 2000Inventors: David W. Hahn, Kenneth R. Hencken, Howard A. Johnsen, William L. Flower
-
Patent number: 4441816Abstract: A method for in situ measurement of particle size is described. The size information is obtained by scanning an image of the particle across a double-slit mask and observing the transmitted light. This method is useful when the particle size of primary interest is 3 .mu.m and larger. The technique is well suited to applications in which the particles are non-spherical and have unknown refractive index. It is particularly well suited to high temperature environments in which the particle incandescence provides the light source.Type: GrantFiled: March 25, 1982Date of Patent: April 10, 1984Assignee: The United States of America as represented by the United States Department of EnergyInventors: Kenneth R. Hencken, Daniel A. Tichenor, James C. F. Wang