Abstract: This invention relates to compositions of matter formulated to work in conjunction with CO2 gas for identifying the exact leak site location of small and large leaks in sealed systems. The leak finding compositions of matter foam, or are in the form of a foam, when applied to the one or more external surfaces of a system, that is closed and pressurized with CO2, where a leak site location is suspected. This foam then changes color from a first color to a second color over the exact leak site.

Abstract: A structural component for use in building construction including a first support material member, a second support material member, an insulating material, and a first securing member. The first support material member may have a first length and a first edge. The second support material member may have a second length and a second edge and may oppose the first support material member. The insulating material may be disposed between the first support material member and the second support material member. The first securing member may be adapted to contact the first edge and the second edge.

Abstract: A structural component for use in building construction including a first support material member, a second support material member, an insulating material, and a first securing member. The first support material member may have a first length and a first edge. The second support material member may have a second length and a second edge and may oppose the first support material member. The insulating material may be disposed between the first support material member and the second support material member. The first securing member may be adapted to contact the first edge and the second edge.

Abstract: A structural component for use in building construction including a first and second support material member, an insulating material, and a first securing member. The first support material member may have a first length, a first side, and an opposing second side. The second support material member may have a second length, a first side, and an opposing second side. The second support material member may oppose the first support material member. The insulating material may be disposed between the first support material member and the second support material member. The first securing member may be adapted to secure the first support material member to the second support material member.

Abstract: A structural component for use in building construction including a first and second support material member, an insulating material, and a first securing member. The first support material member may have a first length, a first side, and an opposing second side. The second support material member may have a second length, a first side, and an opposing second side. The second support material member may oppose the first support material member. The insulating material may be disposed between the first support material member and the second support material member. The first securing member may be adapted to secure the first support material member to the second support material member.

Abstract: A system for generating revenue includes a fee collection station. The fee collection station may include a controller and a fee receiver in communication with the controller for receiving a predetermined fee from a plurality of users. The fee receiver may also receive a predetermined participation fee from the plurality of users that selectively participate in a game. The fee collection station may also comprise an indicator in communication with the controller and adjacent to the fee receiver for indicating to participating users one of a winning indication or a losing indication. The participating users that receive the winning indication may receive a predetermined reward.

Abstract: A system for transferring a vessel between a first body of water having a first water level and a second body of water having a second water level includes a barrier separating the first body of water from the second body of water. The system also includes a transfer structure adjacent the barrier for receiving the vessel to be transferred between the first and second bodies of water, and a transfer apparatus adjacent the barrier for moving the transfer structure between a first position and a second position. The upper portion of the barrier includes a barrier door that is movable between an opened position when the transfer structure is in the second position to allow the vessel to move into and out of the transfer structure, and a closed position when the transfer structure is in the first position.

Abstract: An improved data inserter for inserting data into selected lines, including the vertical blanking interval, of a television or video signal. The data inserter includes a parallel interface for receiving data and a digital signal processor (DSP) for controlling the insertion of that data. A dual port memory structure is used to temporarily store data to be inserted. The dual port memory is associated with and connected to an autobuffer unit. Each video signal received by the inserter is provided to a switch which is also coupled to the autobuffer unit so that the switch may receive data stored in the dual port memory devices. When a selected line in a given video signal is detected by the DSP, it triggers the respective autobuffer unit which, in turn, transfers the data out of the dual port memory to the respective switch for insertion into the selected line of the video signal.

Abstract: A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor device (16). The device may be transfer molded or encapsulated by glob top technology. The metal coating (19) serves as a barrier to the transmission of electromagnetic or radio frequency energy, thereby shielding the semiconductor device (16). The shielded semiconductor package is manufactured by providing a metallization pattern (12 and 14) on a substrate (10) and mechanically attaching and electrically interconnecting a semiconductor device (16) to the metallization pattern. A resin (18) is transfer molded about the semiconductor device, the electrical interconnections (17), and the metallization pattern so as to form an assembly, and a metal coating (19) is applied via vacuum deposition or plating to interconnect with a portion of the metallization pattern.

Abstract: A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array includes contact pads (502) arranged in a first linear grid pattern, and eight aligning pads (504,506,510,514,518), larger than the contact pads (502). Two aligning pads (504,506,510,514,518) are near each of the four outside corners. Each aligning pad (504,506,510,514,518) is positioned off center with respect to the first linear grid pattern such that a tangential line (608,610,612,614) can be drawn between an innermost point of the aligning pad (504,506,510,514,518) and corresponding innermost points of the contact pads (502) that are collinear on the first linear grid pattern. A second pad array (406) is disposed on the surface mount component and arranged in a second linear grid pattern that aligns with the first linear grid pattern.

Abstract: An integrated circuit chip carrier assembly, comprising a semiconductor device (10) having interconnection pads (14) disposed on an active surface (12) of the device. The device (10) is attached by means of electrically conducting bumps (26) to a circuitry pattern (18) on a first side of a circuit carrying substrate (16). The substrate is typically an aramid reinforced organic resin, such as epoxy. The circuitry (18, 20) is electrically connected by conductive through-holes (22) to an array of solder pads on a second side of the substrate. Some or all of the through-holes (22) are covered by the device. The overall length and width of the circuit carrying substrate (16) are each a maximum of about 0.15 inches greater than the equivalent dimensions of the device (10), creating a carrier that is only slightly larger than the semiconductor device itself.

Abstract: Epoxy bonding between an IC chip and a chip carrier is strengthened by creating substantially rougher oxidized surfaces within substantially smooth gold surfaces of a die paddle portion of the chip carrier.

Abstract: A method for applying solder on a substrate (12) comprises the steps of providing a substrate (12) having predefined solder pads (15) and then providing solder spheres (16) for suitable placement on the solder pads. Then applying flux (14) and tacking media (18) between the solder pads (15) and the solder spheres (16) and then placing the solder spheres on the solder pads. Subsequently the solder spheres are heated onto the solder pads of the substrate providing reflowed solder (26) on the solder pads. Then a layer of flux tacking media (28) is applied on the reflowed solder. Next, a component (30 or 40) is placed on the reflowed solder and flux tacking media providing a substrate assembly (10). Finally, the circuit assembly is heated allowing the component to be soldered to the solder pad.

Abstract: A semiconductor device assembly comprises a semiconductor device (10) attached to a substrate (20). The substrate has a metallization pattern (22) on the surface and a polymeric film (24) covering most of the surface and the metallization pattern. A window-frame shaped opening (26) is created in the film, exposing portions of the substrate surface. The semiconductor device is attached to the substrate in such a manner that it lies in the interior perimeter (28) of the window-frame shaped opening in the film. An adhesive material (18) is applied to fill the space between the semiconductor device and the substrate. The window frame opening in the polymeric film serves to confine the adhesive to the area in the opening and underneath the device and prevents unwanted spread of the underfill material by forming an ideal fillet geometry. In another embodiment of the invention, the semiconductor device is in a package and the package is attached directly to the substrate.

Abstract: A method of manufacturing a ceramic substrate with improved mounting pad location tolerances. The method begins with a green non-dimensionally stable ceramic base 10 to which at least one conductive layer 15, 16 such as a tungsten mixture is screen printed. The tungsten layer locationally defines a pattern including pads 15. This composite assembly is subsequently stabilized as in firing and a second insulating ceramic slurry layer with openings 29 located over the relative larger pads is screen printed on the stabilized composite assembly. This method eliminates tolerances in final mounting pad location due to unpredictable shrinkage and yet maintains excellent mounting pad adhesion since the entire pad overlays some portion of the tungsten pad.

Abstract: An electronic component (14) is soldered to a circuit carrying substrate (11) by a method that allows the component to remain in better contact with the flat solder pads of the substrate. The circuit carrying substrate (11) has a plurality of solder pads (12) disposed thereon, each pad consisting of a terminal portion (16), a solder reservoir portion (18), and a bridging portion (17). The terminal portion is connected to the reservoir portion by the bridging portion. The bridging portion is typically a necked down portion of the pad. The electronic component (14) has a plurality of solderable terminals (15) corresponding to the terminal portions (16) of the solder pads (12). Each of the solder pad reservoir portions are coated with a reservoir of solder (23). The amount of solder coated onto the reservoir portion is sufficient to provide a fillet between the component (14) and the solder pad terminal portion (16) during a subsequent heating step.

Abstract: A stackable surface mount electronic component assembly 100 allowing for the stacking of electronic components 108, and 112 is disclosed. The stackable surface mount electronic component assembly 100 includes electronic component carriers 102, and 114, each having an electronic component 108, and 112 respectively. The two carriers 102, and 114, are electrically interconnected by the use of solder balls 106. Electronic component carrier 114 is in turn attached to an external printed circuit board by the use of solder balls 110. Optionally, each of the electronic components 108, 112 can be encapsulated using encapsulation material prior to the joining of the two carriers 102, and 114. In an alternate embodiment recesses 302 are located on top of the elevated peripheral edge 116 allowing for the proper alignment of the two carriers 102, and 114.

Abstract: A soldered electrical interconnection is made between a device and a circuit carrying substrate. A device (200) is formed with two solderable surfaces, the second solderable surface (204) adjacent to, but not touching, the first solderable surface (202). A sphere of solder (206) is placed upon a solderable surface (202) of the device and reflowed. The component and solder sphere assembly is placed on a circuit carrying substrate (210) and reflowed, such that the solder sphere reflows and is wetted to both solderable surfaces on the device.