Abstract: A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and method for making the same provides relatively large edge connectors mechanically constrained in the edge of a circuit substrate.

Abstract: A method of forming trimmable resistors, resistor ray be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, so that the resistor may be trimmed to a desired resistance level. Alternatively, a portion of a resistor may be embedded into a substrate, with another portion of the resistor being disposed on the outer surface of the substrate. The portion of the resistor on the outer surface may be trimmed to adjust the resistance of the resistor to a desired level.

Abstract: A first fixture holds a plurality of circuit components backside up in a substantially coplanar relationship. An adhesive applying device, such as screen printer, applies adhesive to the backside of each circuit component. A second fixture is aligned with and placed on the first fixture. The fixtures are then flipped so that the circuit components are supported in a right side up position by the second fixture. A device such as a pick and place machine, may then be used to transfer the circuit components from the second fixture to a substrate.

Abstract: A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and method for making the same provides relatively large edge connectors mechanically constrained in the edge of a circuit substrate.

Abstract: A resistor may be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, for instance, so that the resistor may be trimmed to a desired resistance level. Alternatively, a portion of a resistor may be embedded into a substrate, with another portion of the resistor being disposed on the outer surface of the substrate. The portion of the resistor on the outer surface may be trimmed to adjust the resistance of the resistor to a desired level.

Abstract: A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and method for making the same provides relatively large edge connectors mechanically constrained in the edge of a circuit substrate.

Abstract: A technique is utilized for coupling a circuit component to a substrate. The circuit component, such as a die, includes a plurality of contacts on one of its surfaces. The contacts may take the form of gold bumps. Solder is placed between the contacts of the circuit component and the contact pads of a substrate. The substrate is heated to about the melting point of the solder, and pressure and ultrasonic energy are used to cause the solder to couple the contacts of the circuit component to the contact pads of the substrate.

Abstract: A resistor may be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, for instance, so that the resistor may be trimmed to a desired resistance level. Alternatively, a portion of a resistor may be embedded into a substrate, with another portion of the resistor being disposed on the outer surface of the substrate. The portion of the resistor on the outer surface may be trimmed to adjust the resistance of the resistor to a desired level.

Abstract: A sub-assembly module for surface mounting on an implantable medical device hybrid module is provided. The sub-assembly module includes one or more electronic components mounted on a substrate. Interconnection between the electronic components and the hybrid module is established by bond pads on the upper and lower surfaces of the substrate and thru-substrate conducting plugs connecting respective upper and lower bond pads. The electronic components are encapsulated in a layer of insulating material. The electronic components may be chip-and-wire mounted to the sub-assembly module and the sub-assembly module may, in turn, be surface mounted to the hybrid module, permitting the integration of chip-and-wire and surface mount processing for a given hybrid module.