Patents by Inventor Kenneth Reilly

Kenneth Reilly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of applying a pattern of particles to a substrate
    Patent number: 7585549
    Abstract: A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means by exposing the substrate to particles in a fluid medium to electrokinetically or electrostatically deposit the particles onto the substrate.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: September 8, 2009
    Assignee: Fry's Metals, Inc.
    Inventors: Brian G. Lewis, Bawa Singh, Robert H. Detig, Gerard R. Minogue, Dietmar C. Eberlein, Kenneth Reilly, Michael Marczi
  • Deposition and patterning process
    Publication number: 20050106329
    Abstract: A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.
    Type: Application
    Filed: July 9, 2004
    Publication date: May 19, 2005
    Inventors: Brian Lewis, Gerard Minogue, Robert Detig, Dietmar Eberlein, Bawa Singh, Michael Marczi, Kenneth Reilly