Patents by Inventor Kenneth Rhyner

Kenneth Rhyner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EXTENDED PLATING TRACE IN FLIP CHIP SOLDER MASK WINDOW
    Publication number: 20090140419
    Abstract: A flip chip in accordance with an exemplary embodiment of the present invention has a ball grid array and a die disposed on the ball grid array, wherein the ball grid array includes conducting pads disposed under the die. Traces connecting conducting pads under the die are accessible to leads on the die by way of a solder mask window. These traces continue through the solder mask window and extend out to the border of the ball grid array and are used for both signaling purposes and electroplating purposes.
    Type: Application
    Filed: November 29, 2007
    Publication date: June 4, 2009
    Inventors: Kenneth Rhyner, Peter Harper