Patents by Inventor Kenneth S. Bentz

Kenneth S. Bentz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4700044
    Abstract: Fine wires are soldered without flux to solder pads on a flexible circuit of a workpiece by a laser. The laser beam is aligned and moved over the solder pad to describe a rectangle by movement of mirrors on a programmed, motor driven X-Y-Z linear table. Wires are deeply sunk into the solder pads by the weight of a cone brought against the wire carried by the X-Y-Z table. Vaporized insulation is restrained within the cone to maintain a clean microelectronic workpiece.
    Type: Grant
    Filed: July 31, 1986
    Date of Patent: October 13, 1987
    Assignee: Hutchinson Technology Inc.
    Inventors: John M. Hokanson, Kenneth S. Bentz, Terrence G. Field, David A. Ziegler