Patents by Inventor Kenneth S. Komisarek
Kenneth S. Komisarek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11177571Abstract: Phased array antenna systems with antenna elements having substrates with varying dielectric constants selected to reduce the self-return signal of corner elements in the array. In one example, a phase array antenna system includes a plurality of stacked-patch microstrip antenna elements arranged in a two-dimensional array, each stacked-patch microstrip antenna element of the plurality of stacked-patch microstrip antenna elements including a pair of conductive patches disposed above a ground plane on a dielectric substrate. The dielectric substrate of corner stacked-patch microstrip antenna elements in the array has a dielectric constant lower than a dielectric constant of the dielectric substrate of non-corner stacked-patch microstrip antenna elements in the array.Type: GrantFiled: October 24, 2019Date of Patent: November 16, 2021Assignee: RAYTHEON COMPANYInventors: David Liu, Kenneth S. Komisarek, John Yorko
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Publication number: 20210044020Abstract: Phased array antenna systems with antenna elements having substrates with varying dielectric constants selected to reduce the self-return signal of corner elements in the array. In one example, a phase array antenna system includes a plurality of stacked-patch microstrip antenna elements arranged in a two-dimensional array, each stacked-patch microstrip antenna element of the plurality of stacked-patch microstrip antenna elements including a pair of conductive patches disposed above a ground plane on a dielectric substrate. The dielectric substrate of corner stacked-patch microstrip antenna elements in the array has a dielectric constant lower than a dielectric constant of the dielectric substrate of non-corner stacked-patch microstrip antenna elements in the array.Type: ApplicationFiled: October 24, 2019Publication date: February 11, 2021Inventors: David Liu, Kenneth S. Komisarek, John Yorko
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Patent number: 9306262Abstract: A turnstile antenna element and balun for use in a phased array are described. The antenna includes a plurality of stacked bowtie radiators. Each stacked bowtie radiator includes a driven conductor and a passive conductor separated by a dielectric. The balun includes a central member having dielectric slabs symmetrically disposed on external surfaces thereof. At least one end of the balun is provided having a shape such that conductors on the dielectric slabs of the balun can be coupled to the driven radiator conductors.Type: GrantFiled: August 1, 2013Date of Patent: April 5, 2016Assignee: Raytheon CompanyInventors: Angelo M. Puzella, Kenneth S. Komisarek, James A. Robbins
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Publication number: 20140218253Abstract: A turnstile antenna element and balun for use in a phased array are described. The antenna includes a plurality of stacked bowtie radiators. Each stacked bowtie radiator includes a driven conductor and a passive conductor separated by a dielectric. The balun includes a central member having dielectric slabs symmetrically disposed on external surfaces thereof. At least one end of the balun is provided having a shape such that conductors on the dielectric slabs of the balun can be coupled to the driven radiator conductors.Type: ApplicationFiled: August 1, 2013Publication date: August 7, 2014Applicant: Raytheon CompanyInventors: Angelo M. Puzella, Kenneth S. Komisarek, James A. Robbins
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Patent number: 8279131Abstract: A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.Type: GrantFiled: June 15, 2009Date of Patent: October 2, 2012Assignee: Raytheon CompanyInventors: Angelo M Puzella, Joseph A. Licciardello, Patricia S. Dupuis, John B. Francis, Kenneth S. Komisarek, Donald A. Bozza, Roberto W. Alm
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Patent number: 8217852Abstract: An array antenna is provided that operates at high-band and low-band, comprising a first array of high-band radiators and a second array of low-band radiators, each respective low-band radiator disposed so as to be interleaved between the high-band radiators so as to share an aperture with the high-band radiators. Each low-band radiator comprises a coaxial section, a dielectric section, a waveguide, and a planar section. The dielectric section is formed of a continuous piece of dielectric material and includes a hollow opening formed perpendicular to the coaxial section, and a plurality of step transitions, wherein at least one of the step transitions is disposed within and partially fills the waveguide operably coupled to the planar section. The planar section is oriented to the portion of high-band radiators such that the output of the respective low-band radiator is disposed between and within the spacing between adjacent high-band-radiators.Type: GrantFiled: June 26, 2009Date of Patent: July 10, 2012Assignee: Raytheon CompanyInventors: Yueh-Chi Chang, Kenneth S. Komisarek, Gregory M. Fagerlund, Landon L. Rowland, Kaichiang Chang, Benjamin L. Caplan
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Publication number: 20100328188Abstract: An array antenna is provided that operates at high-band and low-band, comprising a first array of high-band radiators and a second array of low-band radiators, each respective low-band radiator disposed so as to be interleaved between the high-band radiators so as to share an aperture with the high-band radiators. Each low-band radiator comprises a coaxial section, a dielectric section, a waveguide, and a planar section. The dielectric section is formed of a continuous piece of dielectric material and includes a hollow opening formed perpendicular to the coaxial section, and a plurality of step transitions, wherein at least one of the step transitions is disposed within and partially fills the waveguide operably coupled to the planar section. The planar section is oriented to the portion of high-band radiators such that the output of the respective low-band radiator is disposed between and within the spacing between adjacent high-band-radiators.Type: ApplicationFiled: June 26, 2009Publication date: December 30, 2010Applicant: Raytheon CompanyInventors: Yueh-Chi Chang, Kenneth S. Komisarek, Gregory M. Fagerlund, Landon L. Rowland, Kaichiang Chang, Benjamin L. Caplan
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Publication number: 20100066631Abstract: A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.Type: ApplicationFiled: June 15, 2009Publication date: March 18, 2010Applicant: Raytheon CompanyInventors: Angelo M. Puzella, Joseph A. Licciardello, Patricia S. Dupuis, John B. Francis, Kenneth S. Komisarek, Donald A. Bozza, Roberto W. Alm