Patents by Inventor Kenneth S. Lyjak

Kenneth S. Lyjak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160063375
    Abstract: A processor identifies a component included in an assembly. The processor retrieves historical records that indicate which substances are included in the component. The processor determines a probability that the component includes the substances based on at least one historical record. The processor generates a list of substances included in the assembly based on the substances being statistically likely to be present in the component of the assembly.
    Type: Application
    Filed: August 29, 2014
    Publication date: March 3, 2016
    Inventors: Thomas C. Gilgert, Sophia S. Lau, Kenneth S. Lyjak, Richard G. McGee, Fabio D. White
  • Publication number: 20120323806
    Abstract: Embodiments of the invention relate to product and associate product materials, and maintaining compliance with rules and regulations to support interstate and international commerce. As rules and regulations change associated with products and/or raw materials that comprise the product, those changes or messages are monitored and communicated in real-time in order to support continued compliance in the stream of commerce.
    Type: Application
    Filed: June 20, 2011
    Publication date: December 20, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Zachary W. Abrams, Jacklin A. Adams, Louis R. Ferritti, JR., Prasad L. Imandi, Angela Richards Jones, Kenneth S. Lyjak, Sheau Li Ng, Fabio D. White
  • Patent number: 6009620
    Abstract: A method of making a circuitized substrate wherein fill material is forced into the substrate's holes to thus provide additional support for conductive circuitry or the like thereon, thus increasing the final product's circuit density. The fill is provided in a substantially uncured state, following which partial cure occurs. Thereafter, the fill is substantially fully cured and the aforementioned circuit elements may then be provided directly thereon. Alternatively, a dual fill process is used with both quantities of uncured fill being disposed in each hole and then cured by a singular UV exposure step.
    Type: Grant
    Filed: July 15, 1998
    Date of Patent: January 4, 2000
    Assignee: International Business Machines Corporation
    Inventors: Ashwinkumar C. Bhatt, Joseph A. Kotylo, Kenneth S. Lyjak, Amarjit S. Rai, John A. Welsh