Abstract: Low impedance means are provided for coupling a common circuit ground of a microwave circuit to the ground potential. The low impedance means include a plurality of resonators, each having a distinct resonant frequency at which it displays a minimum impedance. The resonant frequencies of the resonators are chosen and arranged such that the resonators together operate to provide a low impedance band in the frequency spectrum within which low impedance coupling between the common circuit ground and the ground potential is achieved. In a preferred embodiment, resonators include capacitors connected in series with inductive bonding wires, and different resonant frequencies are obtained by using capacitors with different capacitance.

Abstract: A plastic package for microwave applications up to 14 Ghz is disclosed. The plastic package includes a plastic platform, a lead frame embedded on the surface of the platform and, in one embodiment, a plastic cap mounted on the platform so as to seal the chip within the package. The lead frame includes a baseplate for mounting at least one semiconductor chip, at least one ground lead attached to the baseplate and extending outwardly therefrom, and at least one signal lead for conducting signals to or from such semiconductor chip. The signal lead and at least one ground lead are configured as a microwave transmission line such as microwave coplanar strips, or microwave coplanar waveguide for transmitting microwave frequency signals. The package offers a low inductance ground path, good thermal characteristics, and low parasitic inductance and capacitance. It can be applied for high speed and high frequency applications.