Abstract: Techniques for polishing and repairing a device's surface are disclosed. An applicator is coated with a paste using a CNC machine. The applicator is attached to a candle bit of the CNC machine, and a device is disposed on a staging area of the CNC machine. The applicator and/or the staging area are moved using the CNC machine to position the applicator above a selected area of the surface of the device. The applicator is rotated at a predetermined rate using the CNC machine. The applicator and/or the staging area are moved using the CNC machine to cause the applicator to contact the surface. The applicator and/or the staging area are moved using the CNC machine in accordance with a predetermined pattern, which is selected to enable the paste and the applicator to polish the surface of the device, including a scratch on the surface.