Patents by Inventor Kenneth SEUFER

Kenneth SEUFER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printable non-curable thixotropic hot melt composition
    Patent number: 11859093
    Abstract: A printable non-curable thixotropic hot melt composition is described. The composition comprises non-curable holt melt waxes transformed into a thixotropic composition by the use of thickeners. The thickeners can be added separately to the hot melt wax or formed in-situ, either before or after application to the substrate. A process of forming such printable non-curable thixotropic hot melt composition is described.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: January 2, 2024
    Assignee: TE CONNECTIVITY SOLUTIONS GMBH
    Inventors: Lei Wang, Martin W Bayes, Ting Gao, Kenneth Seufer, Philip Singer, James Zeigler
  • Printable Non-Curable Thixotropic Hot Melt Composition
    Publication number: 20220306884
    Abstract: A printable non-curable thixotropic hot melt composition is described. The composition comprises non-curable holt melt waxes transformed into a thixotropic composition by the use of thickeners. The thickeners can be added separately to the hot melt wax or formed in-situ, either before or after application to the substrate. A process of forming such printable non-curable thixotropic hot melt composition is described.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 29, 2022
    Applicant: TE Connectivity Solutions GMBH
    Inventors: Lei WANG, Martin W. BAYES, Ting GAO, Kenneth SEUFER, Philip SINGER, James ZEIGLER