Abstract: Novel surfactants and drying and/or cleaning compositions containing such surfactants are disclosed. The surfactants are 1:1 primary or secondary amine salts of .gamma..omega.-perfluoro-C.sub.6 -C,.sub.8 -alkyl dihydrogen phosphates and bis(y,co-perfluoro-C.sub.6 -Cis-alkyl) hydrogen phosphates. The surfactants are soluble in, and convert halocarbons, especially HFC 43-10mee (1,1,1,2,2,3,4,5,5,5-decafluoropentane), into highly effective displacement drying and/or cleaning compositions. These compositions have the ability to remove water or aqueous films from the surface of a broad range of substrates.

Abstract: A cleaning composition is disclosed which is suitable for cleaning substrates and particularly for cleaning flux residues from a printed circuit board. The cleaning composition comprises a hydrocarbon component, a compatibilizing agent, a multibasic ester additive, and optionally water. The multibasic ester may be an alkanoic acid ester of a diol or polyol, an alkanoic acid ester of a hydroxy alkanoate alkyl ester, or and alkyl ester of a compound containing two or more carboxylic acid groups and one or more hydroxyl groups which are optionally esterified with an alkanoic acid group. The cleaning composition may be used as a solution or as an emulsion or dispersion to clean a substrate.

Abstract: A high-boiling hydrochlorofluorofluorocarbon (HCFC) solvent comprising a blend of for every 100 parts by weight of a hydrochlorofluorocarbon (e.g., 1,1,1-trifluorodichloroethane or 1,1-dichloro-1-fluoroethane) from about 25 to about 400 parts by weight of a selected organic solvent (e.g., dipropylene glycol monomethyl ether, dipropylene glycol monomethyl ether acetate, or mixture of dimethyladipate, dimethylglutarate, and dimethylsuccinate). Such solvents are useful in liquid/vapor phase cleaning applications even at elevated temperatures above the boiling temperature predicted by Raoult's law.

Abstract: A substrate cleaning process employs a substantially aqueous immiscible cleaning composition and a water rinse followed by phase separation of the cleaning composition and water and reuse of the water.

Abstract: A cleaning composition is disclosed which is suitable for cleaning flux residue from a printed circuit board and comprises dibasic ester, a hydrocarbon solvent, a compatibilizing surfactant and water.

Abstract: A cleaning composition is disclosed which is suitable for cleaning flux residue from a printed circuit board and comprises dibasic ester solvent, a hydrocarbon solvent and a compatibilizing component.

Abstract: A cleaning composition is disclosed which is suitable for cleaning flux residue from a printed circuit board and comprises dibasic ester solvent and a hydrocarbon solvent.

Abstract: A cleaning composition is disclosed which is suitable for cleaning flux residue from a printed circuit board and comprises a terpene compound and dibasic ester solvent.

Abstract: A vapor phase heat transfer process which uses low molecular weight fully fluorinated hexafluoropropylene oxide (HFPO) oligomers having the formula: ##STR1## where n is 9 or less, as heat transfer mediums.

Abstract: Laminate structures comprising a foamed polyurethane or polyisocyanurate resin core with a facer material uniformly adhered thereto with an adhesive material having functional groups capable of interacting chemically with isocyanate groups in the foamed resin core are disclosed. Suitable adhesive materials include .alpha.-olefin-acid copolymers, ethylene vinyl alcohol, polyimides, polyamines and phenolic resins. The bond between the foam core and the facer material has a peel strength of at least 1.5 lbs/in., preferably 5 lbs/in.