Abstract: A multi-chip module interconnect structure is configurable for a desired application. A power/ground layer and one of two signal interconnect layers have a fixed metal pattern and are generated once for multiple applications. A second signal interconnect layer and a bond pad layer are custom designed for the particular application. The fixed interconnect layer has a repeating pattern of horizontal metal strips in rows and of three different lengths. The end points of each row of strips are staggered to increase routeability by reducing vertical blockage. Power distribution and ground rails are periodically positioned in the repeating pattern to provide current to the power/ground layer. A custom router generates the second signal interconnect layer for the particular application involved.