Abstract: A package for a pharmaceutical product and method of assembly is described that includes a subassembly with a body including a main panel and legs depending downwardly from opposite edges of the main panel, and a sheet of plastic having opposite ends fixed to the body with the sheet of plastic at least partially extending over the main panel. The sheet of plastic is configured to be tensioned over and deformed around one or more primary containers to hold the one or more primary containers in place relative to the main panel of the body.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.

Abstract: A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.

Abstract: Embodiments relate to macro-based customization of electronic maps. A computing device stores a macro representing a map feature. The macro includes a set of textures, and the set of textures includes a height map. The computing device places an instance of the macro in an electronic map. The instance of the macro is visually represented in the electronic map based on a set of textures of the instance of the macro that corresponds to the set of textures of the macro. The computing device edits a texture in the set of textures of the instance of the macro. The computing device updates the visual representation of the instance of the macro based on the edit to the texture.

Abstract: A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.

Abstract: Embodiments relate to macro-based customization of electronic maps. A computing device stores a macro representing a map feature. The macro includes a set of textures, and the set of textures includes a height map. The computing device places an instance of the macro in an electronic map. The instance of the macro is visually represented in the electronic map based on a set of textures of the instance of the macro that corresponds to the set of textures of the macro. The computing device edits a texture in the set of textures of the instance of the macro. The computing device updates the visual representation of the instance of the macro based on the edit to the texture.

Abstract: A sleeve for securing a cryogenic vial includes a cylindrical body sized to receive a vial, the body including a longitudinal axis, a first end, and a second end. A plurality of deformable members are disposed near the first end of the body and are arranged to deform from a first configuration to a second configuration. Each deformable member is displaced outwardly relative to the longitudinal axis of the body in the second configuration.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively. The mechanically actuated modality in one embodiment is configured as a netting configured to be placed over a contact surface of an electroadhesive plate to facilitate the handling of an object.

Abstract: A transistor outline (TO) housing comprising a base part having a mounting area for a thermoelectric cooler, wherein the base part has at least two feedthroughs for connecting an optoelectronic component. A support extends from the upper surface of the base part, which support has at least two conductor traces arranged thereon, each of which is connected to a respective one of the feedthroughs for connecting the optoelectronic component.

Abstract: A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.

Abstract: A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.

Abstract: A sleeve for securing a cryogenic vial includes a cylindrical body sized to receive a vial, the body including a longitudinal axis, a first end, and a second end. A plurality of deformable members are disposed near the first end of the body and are arranged to deform from a first configuration to a second configuration. Each deformable member is displaced outwardly relative to the longitudinal axis of the body in the second configuration.

Abstract: A transistor outline (TO) housing comprising a base part having a mounting area for a thermoelectric cooler, wherein the base part has at least two feedthroughs for connecting an optoelectronic component. A support extends from the upper surface of the base part, which support has at least two conductor traces arranged thereon, each of which is connected to a respective one of the feedthroughs for connecting the optoelectronic component.

Abstract: A system for processing data sets that disagree, comprising: an input for receiving a plurality of data sets of corresponding elements from a respective plurality of corresponding users and to receive amendment input from at least one of the users; a memory for storing the plurality of data sets; a negotiation engine for comparing elements of corresponding elements of the data sets and identifying one or more corresponding elements of the data sets that are not in agreement across all of the data sets; an output for outputting the corresponding elements of the data sets that are not in agreement across all of the data sets to the users; and a prompts and messages engine configured to alert the users to the one or more elements of the respective data set corresponding to the respective user that are not in agreement across all of the data sets.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively.