Abstract: This invention relates to a broad beam ion deposition apparatus (100) including an ion source (101), a target (102), a tillable substrate table (103) and an auxiliary port (104). The target (102) is in the form of a carousel which carries a number of targets and the ion source (101) is configured to produce a substantially rectangular section beam (105).

Abstract: This invention relates to an Ion gun (10) which comprises of plasma generator (11) driven from an RF source (12), a plasma or source chamber (13), having an outlet (14), across which is mounted an accelerator grid (15). The accelerator grid (15) comprises four individual grids. The first grid (16), which is closest to the outlet (14), is maintained at a positive voltage by a DC source (16a), the second grid (17) is maintained strongly negative by DC source (17a). The third grid (18) is maintained at a negative voltage, which is much lower than that of the second grid (17), by DC source (18a) and the fourth grid is grounded. Means of mounting these grids are also described.

Abstract: This invention relates to a broad beam ion deposition apparatus (100) including an ion source (101), a target (102), a tillable substrate table (103) and an auxiliary port (104). The target (102) is in the form of a carousel which carries a number of targets and the ion source (101) is configured to produce a substantially rectangular section beam (105).

Abstract: This invention relates to an Ion gun (10) which comprises of plasma generator (11) driven from an RF source (12), a plasma or source chamber (13), having an outlet (14), across which is mounted an accelerator grid (15). The accelerator grid (15) comprises four individual grids. The first grid (16), which is closest to the outlet (14), is maintained at a positive voltage by a DC source (16a), the second grid (17) is maintained strongly negative by DC source (17a). The third grid (18) is maintained at a negative voltage, which is much lower than that of the second grid (17), by DC source (18a) and the fourth grid is grounded. Means of mounting these grids are also described.

Abstract: A substrate processing system as illustrated at (1). A substrate (2) lies upon a piston (3) shown in both the loading position (3a) and in a processing position (3b). The substrate is loaded via a port (4) through a door (5). The loading area (7a), and/or the hole chamber (7) may be pumped out via a vacuum exhaust pipe (6) connected to a pump (not shown). A linear drive mechanism shown diagrammatically at (8) lifts the piston and the substrate in the chamber such that a process volume (7b) of the chamber is defined with poor gas conduction between the piston and the walls of the chamber.

Abstract: A computer Input/Output system having a fabric, a control unit (CU) and a host computer including a channel, the channel having a channel port connected by a first link to a channel neighbor port of the fabric, and the control unit having a CU port connected by a second link to a CU neighbor port on the fabric. Then an error is detected in the link or protocol between the channel and the control unit, error data are reported to the channel by the channel, the channel port, the channel neighbor port, the control unit, the CU port and the CU neighbor port and sent to the channel. The error data are provided to the host computer for analysis.

Abstract: A computer Input/Output system having a fabric, a control unit (CU) and a host computes including a channel, the channel having a channel port connected by a first link to a channel neighbor port of the fabric, and the control unit having a CU port connected by a second link to a CU neighbor port on the fabric. When an error is detected in the link or protocol between the channel and the control unit, after a retry of the failing operation is performed, error data are reported to the channel by the channel, the channel port, the channel neighbor port, the control unit, the Cu port and the CU neighbor port and sent to the channel. The error data are provided to the host computer for analysis.

Abstract: Provided are a method, system, and article of manufacture for assigning alias addresses to base addresses. An assignment is provided of base addresses to the devices, wherein the base addresses are used to access the devices assigned to the base addresses. An assignment is provided of a plurality of alias addresses to an alias address pool. The alias addresses in the alias address pool are capable of being dynamically assigned to the devices to service I/O requests to the devices. An Input/Output (I/O) request to access one target device comprising one of the devices is processed. A determination is made as to whether the base address assigned to the target device is available. One alias address is assigned to the target device in response to determining that the base address is not available. The I/O request is issued to the assigned alias address to transmit the request to the target device.

Abstract: A communication-path management system includes a path-detection component for identifying all communications paths between a host computer, through a controller, to a data storage device. Once identified, the communication paths are incorporated into a logical-path mask. The path-detection component recognizes each path as either preferred or non-preferred based on latency, bandwidth, availability, or other user-defined criteria and divides the logical-path mask into a preferred path subset and a non-preferred path subset. If a valid path exists in the preferred path subset, all communications from the host computer to the data storage device transit paths belonging to this subset. Otherwise, active control is given to the non-preferred path subset. A channel subsystem manages actual communication based on resource allocation and contention using the currently active subset.

Abstract: This invention relates to a shutter for use in physical vapour deposition apparatus having a chamber. The shutter, generally indicated at 5, is located in a side housing 6 of the vacuum chamber 7, whilst sputtering is taking place. Once the substrate 2 is treated, the substrate is removed from the chamber and the shutter is brought in to an operative position above a wafer pedestal or support 1. The shutter is mounted on an arm 8 using a fixing boss 10, the arm and the boss being magnetically coupled.

Abstract: A magnetic assembly (15) is mounted on a lead screw (12) on one side of a spunter target (14). A further lead screw (11) carries a counter weight (16). The lead screws can be rotated by a stepper motor (13) to adjust the lateral positions of assembly (15) and weight (16). The stepper motor and hence the assembly (15), can be rotated about a vertical axis by shaft (17) and motor (18) so that a magnetic field can be swept around the target (14). The position of the assembly (15) is varied in accordance with a process characteristic.

Abstract: This invention relates to a shutter for use in physical vapour deposition apparatus having a chamber. The shutter, generally indicated at 5, is located in a side housing 6 of the vacuum chamber 7, whilst sputtering is taking place. Once the substrate 2 is treated, the substrate is removed from the chamber and the shutter is brought in to an operative position above a wafer pedestal or support 1. The shutter is mounted on an arm 8 using a fixing boss 10, the arm and the boss being magnetically coupled.

Abstract: A pedestal for mounting semiconductor fabrication equipment within a clean room. The pedestal includes a base frame sitting on a waffle slab and utility connections. The equipment can readily be connected to the utility connections when positioned on the pedestal. The utility connections are located at the periphery of or across part of a face of the pedestal to thereby define a service area within the periphery.

Abstract: A seal is formed between two parts of a high pressured chamber by means of a rigid ring, which is formed with curved surfaces, that engage with an anvil and an enclosure part, the anvil having a similar curved projection. At least one of the engaging surfaces is coated with a soft metal e.g. silver.

Abstract: A seal is formed between two parts of a high pressured chamber by means of a rigid ring, which is formed with curved surfaces, that engage with an anvil and an enclosure part, the anvil having a similar curved projection. At least one of the engaging surfaces is coated with a soft metal e.g. silver.

Abstract: A seal is formed between two parts of a high pressured chamber by means of a rigid ring (13), which is formed with curved surfaces (17), that engage with an anvil (14) and an enclosure part (10), the anvil (14) having a similar curved projection (18). At least one of the engaging surfaces is coated with a soft metal e.g. silver.