Abstract: Solubilizing compositions are provided that include a 3-(alkyl dimethyl ammonia) propane sulfonate zwitterionic surfactant and a polyethylene glycol alkyl ether nonionic surfactant, provided that the zwitterionic surfactant and the nonionic surfactant are not simultaneously and respectively 3-(decyl dimethyl ammonia) propane sulfonate and polyoxyethylene (4) lauryl ether. Also provided are methods for solubilizing cells and/or tissue of a subject in vivo and methods for recovering proteins from skin cells of a subject in vivo using the solubilizing compositions.

Abstract: Solubilizing compositions are provided. The compositions comprise 3-(decyl dimethyl ammonio) propane sulfonate and polyoxyethylene (4) lauryl ether. The compositions may be useful to solubilize or lyse cells and/or tissue. The compositions may be further useful to preserve and recover proteins, including cytosolic proteins, nuclear proteins, and surface proteins contained within the solubilized or lysed cells and/or tissue.

Abstract: A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.

Abstract: A method for manufacturing a light set with surface mounted light emitting components is disclosed. A rod having a predetermined length and a winding control architecture with corresponding driving spindles are prepared first. The rod is driven to rotate by a winding machine via driving spindles to wind conducting wires. The insulating layer of each conducting wire is then ground along an axial direction of the rod to expose the conductor of each conducting wire to form contact-pad area. A conductive paste is applied to each contact-pad area, and the surface mounted light emitting components are straddled thereon. Each lead of the surface mounted light emitting components is respectively positioned corresponding to the contact-pad areas, and is electrically connected to the conductors by the conductive paste. The contact-pad areas and the surface mounted light emitting component are then covered with a package.

Abstract: Apparatus and methods for detecting residue on a glass substrate and method of use are disclosed. The apparatus comprises a substrate support, a sensor, a controller and a peripheral device in communication with the controller. The apparatus measures the height or thickness of a main surface and an edge delete surface of a substrate to determine if film residue is present on the edge delete surface.

Abstract: A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.

Abstract: A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.

Abstract: A light set with surface mounted light emitting components includes a first conducting wire and a second conducting wire disposed adjacent to the first conducting wire. The first and second conducting wires are correspondingly formed at a predetermined interval with a plurality of first and second contact-pad areas, respectively, at where a first and a second conductor of the first and the second conducting wire, respectively, are exposed. At least one surface mounted light emitting component is straddled on and between the corresponding first and the second contact-pad areas with two leads of the light emitting component electrically connected to the first and the second conductor via a conductive material, so that the surface mounted light emitting component and the first and second conducting wires are in an electrical contact state.

Abstract: A method of manufacturing an LED light string using a jig having a main body and a plurality of spiral grooves formed thereon adjacent to each other is provided. The method includes winding an electrical wire in each of the grooves, removing portions of the electrical wires to provide a plurality of spaced exposed segments at successive locations on each of the electrical wires, placing LED chips on at least some of the plurality of exposed segments formed in one of the electrical wires, connecting each LED chip to a corresponding exposed segment on a different electrical wire by a connector, and sealing each LED chip and connector. A jig for attaching one or more LED chips to a plurality of electrical wires is also provided.

Abstract: A method for manufacturing a light set with surface mounted light emitting components is disclosed. A rod having a predetermined length and a winding control architecture with corresponding driving spindles are prepared first. The rod is driven to rotate by a winding machine via driving spindles to wind conducting wires. The insulating layer of each conducting wire is then ground along an axial direction of the rod to expose the conductor of each conducting wire to form contact-pad area. A conductive paste is applied to each contact-pad area, and the surface mounted light emitting components are straddled thereon. Each lead of the surface mounted light emitting components is respectively positioned corresponding to the contact-pad areas, and is electrically connected to the conductors by the conductive paste. The contact-pad areas and the surface mounted light emitting component are then covered with a package.

Abstract: The LED bulb assembly includes a connector, an LED including two conductive wires, and means for attaching the LED to the connector and preventing the two conductive wires from contacting each other. The means for attaching the LED to the connector and preventing the two conductive wires from contacting each other may include a plate in the connector, and each of the two conductive wires extends along different sides of the plate. Alternatively, the means for attaching the LED to the connector and preventing the two conductive wires from contacting each other may include each of the conductive wires having a thickness such that the two conductive wires supports the LED while maintaining a gap between the two conductive wires.

Abstract: Apparatus and methods for detecting residue on a glass substrate and method of use are disclosed. The apparatus comprises a substrate support, a sensor, a controller and a peripheral device in communication with the controller. The apparatus measures the height or thickness of a main surface and an edge delete surface of a substrate to determine if film residue is present on the edge delete surface.

Abstract: A light set with surface mounted light emitting components includes a first conducting wire and a second conducting wire disposed adjacent to the first conducting wire. The first and second conducting wires are correspondingly formed at a predetermined interval with a plurality of first and second contact-pad areas, respectively, at where a first and a second conductor of the first and the second conducting wire, respectively, are exposed. At least one surface mounted light emitting component is straddled on and between the corresponding first and the second contact-pad areas with two leads of the light emitting component electrically connected to the first and the second conductor via a conductive material, so that the surface mounted light emitting component and the first and second conducting wires are in an electrical contact state.

Abstract: The LED bulb assembly includes a connector, an LED including two conductive wires, and means for attaching the LED to the connector and preventing the two conductive wires from contacting each other. The means for attaching the LED to the connector and preventing the two conductive wires from contacting each other may include a plate in the connector, and each of the two conductive wires extends along different sides of the plate. Alternatively, the means for attaching the LED to the connector and preventing the two conductive wires from contacting each other may include each of the conductive wires having a thickness such that the two conductive wires supports the LED while maintaining a gap between the two conductive wires.

Abstract: A method of manufacturing an LED light string using a jig having a main body and a plurality of spiral grooves formed thereon adjacent to each other is provided. The method includes winding an electrical wire in each of the grooves, removing portions of the electrical wires to provide a plurality of spaced exposed segments at successive locations on each of the electrical wires, placing LED chips on at least some of the plurality of exposed segments formed in one of the electrical wires, connecting each LED chip to a corresponding exposed segment on a different electrical wire by a connector, and sealing each LED chip and connector. A jig for attaching one or more LED chips to a plurality of electrical wires is also provided.

Abstract: A target sputtering apparatus capable of monitoring target erosion has a sputtering chamber having a sputtering target with a sputtering surface. The apparatus can have a wireless receiver to receive a wireless signal and a controller to control the receiver and components of the sputtering chamber to sputter-deposit material on a substrate, and monitor erosion of the sputtering surface of the sputtering target. The controller also has a target erosion monitoring code that includes detection wafer transport program code to transport a detection wafer onto the support in the chamber, wherein the detection wafer generates a wireless signal in relation to an extent of erosion of the sputtered surface, and erosion determination code to analyze the wireless signal received by the wireless receiver and originating from the detection wafer to determine an extent of erosion of the sputtering surface of the sputtering target.

Abstract: A method of refurbishing a deposition target having a surface with an eroded region involves measuring a depth profile of the eroded region. A target material is then provided to the eroded region in relation to the measured depth profile to refurbish the target by filling the eroded region with the target material. The process provides improved refurbishment of eroded target surfaces with higher refurbishing precision and less waste of valuable target material.

Abstract: A method of forming a coating on a component surface comprises placing a shield about the component surface to define a process zone, controlling the level of oxygen present in the process zone, generating an electric arc in the process zone to form a liquefied material from an electrode, and injecting a carrier gas into the process zone to direct the liquefied material toward the component surface. The level of oxygen present in the process zone is controlled by (i) filling the process zone with a non-oxidizing gas and maintaining a pressure p1 in the process zone higher than a pressure p2 of an ambient environment external to the process zone, and (ii) lining the process zone with an oxygen-absorbing material. Additionally, an arc spray apparatus comprises the shield comprising the oxygen-absorbing material and a consumable electrode extending into the process zone.

Abstract: A substrate retaining clamp for a substrate processing chamber has a ring having an annular portion that surrounds a substrate in the chamber. The ring also has an overhang ledge to cover a periphery of the substrate. The retaining clamp has a knurled exposed surface of the overhang ledge that has spaced apart knurled ridges and furrows. In one version, the knurled ridges and furrows are concentric and radially spaced apart. The knurled exposed surface having the knurled ridges and furrows provides improved performance in the processing of substrates, and especially in high temperature processes.

Abstract: A guard for an electrostatic chuck includes a ceramic annulus that has an inner surface shaped to fit around a circumference of the electrostatic chuck, and an outer surface having (i) a top portion with a recessed trench and (ii) a side portion. A metal coating is provided on the top portion of the outer surface.