Patents by Inventor Kenneth Vandenberghe

Kenneth Vandenberghe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8425787
    Abstract: A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: April 23, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alfred I-Tsung Pan, Kenneth Vandenberghe, Dennis Lazaroff
  • Publication number: 20110049092
    Abstract: A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.
    Type: Application
    Filed: August 26, 2009
    Publication date: March 3, 2011
    Inventors: Alfred I-Tsung Pan, Kenneth Vandenberghe, Dennis Lazaroff