Patents by Inventor Kenneth Vanhille

Kenneth Vanhille has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THREE-DIMENSIONAL MICROSTRUCTURES
    Publication number: 20200076042
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Application
    Filed: May 23, 2019
    Publication date: March 5, 2020
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Multiband antenna with phase-center co-allocated feed
    Patent number: 10431896
    Abstract: Multiband antenna in the form of a three dimensional solid have a plurality of radiating cavities disposed therein.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: October 1, 2019
    Assignee: CUBIC CORPORATION
    Inventors: Anatoliy Boryssenko, Kenneth Vanhille, Jennifer Arroyo
  • Wafer Scale Test Interface Unit: Low Loss and High Isolation Devices and Methods for High Speed and High Density Mixed Signal Interconnects and Contactors
    Publication number: 20190277910
    Abstract: Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 12, 2019
    Inventors: Rick L. Thompson, Kenneth Vanhille, Anatoliy O. Boryssenko, Jean Marc Rollin
  • Wafer scale test interface unit and contactors
    Patent number: 10310009
    Abstract: Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates. The device comprising a 3D coaxial distribution network structure including a plurality of coaxial transmission lines separated by a first pitch at the input and a second, wider pitch at the output thereof.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: June 4, 2019
    Assignee: NUVOTRONICS, INC
    Inventors: Rick L. Thompson, Kenneth Vanhille, Anatoliy O. Boryssenko, Jean Marc Rollin
  • Three-dimensional microstructures
    Patent number: 10305158
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: May 28, 2019
    Assignee: CUBIC CORPORATION
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Dielectric-free metal-only dipole-coupled radiating array aperture with wide field of view
    Patent number: 10256545
    Abstract: Dielectric-free, metal-only, dipole-coupled radiating array aperture with wide field of view.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: April 9, 2019
    Assignee: NUVOTRONICS, INC
    Inventors: Anatoliy O. Boryssenko, Kenneth Vanhille, Benjamin L. Cannon
  • MULTIBAND ANTENNA WITH PHASE-CENTER CO-ALLOCATED FEED
    Publication number: 20180323510
    Abstract: Multiband antenna in the form of a three dimensional solid have a plurality of radiating cavities disposed therein.
    Type: Application
    Filed: December 8, 2016
    Publication date: November 8, 2018
    Inventors: Anatoliy Boryssenko, Kenneth Vanhille, Jennifer Arroyo
  • DIELECTRIC-FREE METAL-ONLY DIPOLE-COUPLED RADIATING ARRAY APERTURE WITH WIDE FIELD OF VIEW
    Publication number: 20180309205
    Abstract: Dielectric-free, metal-only, dipole-coupled radiating array aperture with wide field of view.
    Type: Application
    Filed: June 25, 2018
    Publication date: October 25, 2018
    Inventors: Anatoliy O. Boryssenko, Kenneth Vanhille, Benjamin L. Cannon
  • Dielectric-free metal-only dipole-coupled broadband radiating array aperture with wide field of view
    Patent number: 10027030
    Abstract: Dielectric-free, metal-only, dipole-coupled broadband radiating array aperture with wide field of view.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: July 17, 2018
    Assignee: NUVOTRONICS, INC
    Inventors: Anatoliy O. Boryssenko, Kenneth Vanhille, Benjamin L. Cannon
  • Dielectric-free metal-only dipole-coupled radiating array aperture with wide field of view
    Patent number: 10008779
    Abstract: Dielectric-free, metal-only, dipole-coupled radiating array aperture with wide field of view.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: June 26, 2018
    Assignee: Nuvotronics, INC
    Inventors: Anatoliy O. Boryssenko, Kenneth Vanhille, Benjamin L. Cannon
  • THREE-DIMENSIONAL MICROSTRUCTURES
    Publication number: 20180069287
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Application
    Filed: November 10, 2017
    Publication date: March 8, 2018
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Three-dimensional microstructures
    Patent number: 9843084
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: December 12, 2017
    Assignee: NUVOTRONICS, INC
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • DIELECTRIC-FREE METAL-ONLY DIPOLE-COUPLED RADIATING ARRAY APERTURE WITH WIDE FIELD OF VIEW
    Publication number: 20170256859
    Abstract: Dielectric-free, metal-only, dipole-coupled radiating array aperture with wide field of view.
    Type: Application
    Filed: May 23, 2017
    Publication date: September 7, 2017
    Inventors: Anatoliy O. Boryssenko, Kenneth Vanhille, Benjamin L. Cannon
  • Dielectric-free metal-only dipole-coupled broadband radiating array aperture with wide field of view
    Patent number: 9666947
    Abstract: Dielectric-free, metal-only, dipole-coupled broadband radiating array aperture with wide field of view.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: May 30, 2017
    Assignee: NUVOTRONICS, INC
    Inventors: Anatoliy O. Boryssenko, Kenneth Vanhille, Benjamin L. Cannon
  • WAFER SCALE TEST INTERFACT UNIT: LOW LOSS AND HIGH ISOLATION DEVICES AND METHODS FOR HIGH SPEED AND HIGH DENSITY MIXED SIGNAL INTERCONNECTS AND CONTACTORS
    Publication number: 20160341790
    Abstract: Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates. The device comprising a 3D coaxial distribution network structure including a plurality of coaxial transmission lines separated by a first pitch at the input and a second, wider pitch at the output thereof.
    Type: Application
    Filed: January 16, 2015
    Publication date: November 24, 2016
    Inventors: Rick L. Thompson, Kenneth Vanhille, Anatoliy O. Boryssenko, Jean Marc Rollin
  • THREE-DIMENSIONAL MICROSTRUCTURES
    Publication number: 20160336639
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Application
    Filed: July 28, 2016
    Publication date: November 17, 2016
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Three-dimensional microstructures
    Patent number: 9413052
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: August 9, 2016
    Assignee: Nuvotronics, Inc.
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • THREE-DIMENSIONAL MICROSTRUCTURES
    Publication number: 20150380795
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Application
    Filed: September 4, 2015
    Publication date: December 31, 2015
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Three-dimensional microstructures
    Patent number: 9136575
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: September 15, 2015
    Assignee: NUVOTRONICS, LLC
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • DIELECTRIC-FREE METAL-ONLY DIPOLE-COUPLED BROADBAND RADIATING ARRAY APERTURE WITH WIDE FIELD OF VIEW
    Publication number: 20150162665
    Abstract: Dielectric-free, metal-only, dipole-coupled broadband radiating array aperture with wide field of view.
    Type: Application
    Filed: December 11, 2014
    Publication date: June 11, 2015
    Inventors: Anatoliy O. Boryssenko, Kenneth Vanhille, Benjamin L. Cannon