Abstract: In one embodiment, an interposer may include a top surface, a bottom surface, a ground plane disposed between the top surface and bottom surface, an array of top contacts on the top surface, a corresponding array of bottom contacts on the bottom surface, a plurality of through connections between corresponding top and bottom contacts, and a plurality of ground conductors interspersed with the plurality of through connections. The array of top contacts may be configured to interface with a first component above the interposer. The array of bottom contacts may be configured to interface with a second component beneath the interposer. The ground conductors may extend orthogonally through, and be electrically connected to, the ground plane.

Abstract: An interposer comprising an array of top contacts on the top surface configured to interface with an integrated circuit package, a corresponding array of bottom contacts on the bottom surface configured to interface with a component beneath the interposer, through connections between corresponding top and bottom contacts and a plurality of signal probe points on the edge surface. The interposer may include an electrical pathway connecting a first through connection to a first signal probe point. The electrical pathway may contact the first through connection at a first intersection. A resistor may be disposed along the electrical pathway, between the first intersection and the first signal probe point. The electrical pathway from the first intersection to the resistor may be an unconditioned signal pathway. The electrical pathway from the resistor to the first signal contact may be a conditioned signal pathway. The unconditioned signal pathway may have a length of not greater than 0.20 inch.

Abstract: An interposer comprising an array of top contacts on the top surface configured to interface with an integrated circuit package, a corresponding array of bottom contacts on the bottom surface configured to interface with a component beneath the interposer, through connections between corresponding top and bottom contacts and a plurality of signal probe points on the edge surface. The interposer may include an electrical pathway connecting a first through connection to a first signal probe point. The electrical pathway may contact the first through connection at a first intersection. A resistor may be disposed along the electrical pathway, between the first intersection and the first signal probe point. The electrical pathway from the first intersection to the resistor may be an unconditioned signal pathway. The electrical pathway from the resistor to the first signal contact may be a conditioned signal pathway. The unconditioned signal pathway may have a length of not greater than 0.20 inch.

Abstract: An interposer is shown with contact points on a lateral edge. When assembled between a board under test and an integrated circuit, traces of the interposer carry signals between the board under test and the integrated circuit and also between signal lines of the integrated circuit and the lateral edge contact points. The signals can then be accessed by test equipment at the lateral edge contact points. The interposer may include additional components connected to the traces.

Abstract: A test assembly that may provide access to signals of a circuit that includes an integrated circuit. The test assembly may include structural members that limit movement of components relative to each other.

Abstract: A component interposer provides access to signals communicated between an integrated circuit and control circuit board. The component interposer may include a signal circuit board and a socket. The board may include one or more electrical contacts that may be used to sample a signal. The socket may include first and second portions. The first portion may include a surface that contacts with the control circuit board. The first portion may have a first width and first length. The second portion may have a surface that contacts the signal board. The second portion may have a second width and second length. The first length may be smaller than the second length, the first width may be smaller than the second width, or both. The socket may include an overhang that defines a space or void. The socket may include one or more pins for aligning the signal board and the socket. The component interposer may include one or more fasteners.

Abstract: A test assembly that may provide access to signals of a circuit that includes an integrated circuit. The test assembly may include structural members that limit movement of components relative to each other.

Abstract: The process of molding a component of a sole unit for an athletic shoe comprising the steps of supporting a core of a first plastic material in a cavity of a mold, the core defining an integral part of the component and extending within a heel region toward a forefoot region, supporting at least one rigid plug member within the cavity juxtaposed and in partially surrounding relation to the core, injecting a second plastic material into the cavity to fill the cavity, to form a shell around the core, at least partially curing the injected plastic material, removing the plug member, and injecting a third plastic material which upon curing forms a second resilient plastic material having a hardness (Shore A) greater than that of the material of the core into the cavity to fill the area heretofore occupied by the plug member, the plug member being shaped such that the third plastic material forms a set of posts.

Abstract: The invention is in a sole unit for footwear including a midsole/wedge component (16, 30, 40, 60) of plastic material. The midsole/wedge component includes a core (26, 36, 46, 62) which may be characterized as a V-channel within a central longitudinal portion extending away from the back of the heel along substantially the longitudinal axis of the component. A pair of posts (22 and 24, 32 and 34, 42 and 44, 64 and 66) describing a lateral and medial post extend along the component at least to the region of the heel seat of the wedge. The density of the medial post (Shore A) may be equal to or greater than the density of the lateral post, and both posts have a density (Shore A) greater than that of the core to minimize excessive rear foot motion and instability.The invention also envisions several process for forming the midsole/wedge component.

Abstract: The manufacture of a sole unit for footwear, such as an athletic shoe including an integral midsole/wedge or a separable wedge for use with a midsole. The integral midsole/wedge unit and the separable wedge comprise a shell and a core at least partially encapsulated within the shell. In the manufacture the core is supported in a mold by a plurality of pins extending from an upper and lower mold half toward a parting line; or the core is supported on one or the other of an outsole or insole of the sole unit and closed in the mold. The material of the shell is poured or injected into the mold.

Abstract: The manufacture of a sole unit for footwear, such as an athletic shoe including an integral midsole/wedge or a separable wedge for use with a midsole. The integral midsole/wedge unit and the separable wedge comprise a shell and a core at least partially encapsulated within the shell. In the manufacture the core is supported in a mold by a plurality of pins extending from an upper and lower mold half toward a parting line; or the core is supported on one or the other of an outsole or insole of the sole unit and closed in the mold. The material of the shell is poured or injected into the mold.

Abstract: A sole unit for footwear such as an athletic shoe includes an integral midsole/wedge or a wedge for use with a midsole. The integral midsole/wedge unit and the wedge for use with a midsole both are formed by a shell and an encapsulated core. The shell and core comprise plastic materials which have individual strengths and weaknesses in a shoe construction, yet provide, as a composite improved results in a shock dispersion and memory system. In a second aspect, the integral midsole/wedge is a single density or a two-density unit precompressed from a low density material.

Abstract: A control device for footwear, such as an athletic shoe, including a body having a base with relatively flat upper and lower surfaces and a wall extending upwardly around a heel portion to extend along both a medial and lateral portion to an end. The body is formed of plastic to be yieldable, but relatively sturdy for support of the foot in a neutral plane and control roll of the foot during a running cycle.

Abstract: Apparatus for use in dispensing fluid into individual containers is disclosed. The apparatus comprises a dispensing head and a transport mechanism comprising an endless conveyor, the dispensing head being attached to the conveyor, which conveyor provides means for moving the dispensing head in a predetermined path above an array of sample containers. A drive arrangement is provided for the transport mechanism, there being a detector incorporated in the drive arrangement for indicating when the drive arrangement has driven the transport mechanism so that the conveyor has moved the dispensing head a predetermined distance along the predetermined path.