Abstract: A screen-printable thick film paste composition suitable for forming conductive patterns on a rigid substrate comprising:(a) finely divided particles of a lead-free glass composition having a softening point log (eta)=7.6 poise from 400.degree. C.-650.degree. C., a log (eta.) specific viscosity in a range from 2 at 500.degree. C. to 5 at 700.degree. C. and consisting essentially of, by weight 65-95% Bi.sub.2 O.sub.3, 2-15% SiO.sub.2, 0.1-9% B.sub.2 O.sub.3, 0-5% Al.sub.2 O.sub.3, 0-5% CaO, and 0-20% ZnO; and(b) electrically conductive particles; andall of (a) and (b) being dispersed in (c) an organic medium.

Abstract: A composition for making fired dielectric layers which is especially suitable for laser scribing consisting essentially of finely divided particles of dielectric glass, inorganic filler having a refractive index higher than the glass and cobalt oxide, all being dispersed in organic medium. The composition can be in the form of either thick film paste or green tape.

Abstract: A screen-printable thick film paste composition suitable for forming conductive patterns on a rigid substrate comprising:(a) finely divided particles of a lead-free glass composition having a softening point log (eta)=7.6 poise from 400.degree. C.-650.degree. C., a log (eta.) specific viscosity in a range from 2 at 500.degree. C. to 5 at 700.degree. C. and consisting essentially of, by weight 65-95% Bi.sub.2 O.sub.3, 2-15% SiO.sub.2, 0.1-9% B.sub.2 O.sub.3, 0-5% Al.sub.2 O.sub.3, 0-5% CaO, and 0-20% ZnO; and(b) electrically conductive particles; andall of (a) and (b) being dispersed in (c) an organic medium.

Abstract: An amorphous partially crystallizable alkaline earth zinc silicate glass containing ZrO.sub.2 and optionally small amounts of Al.sub.2 O.sub.3, HfO.sub.2, P.sub.2 O.sub.5 and TiO.sub.2.

Abstract: A dielectric composition comprising an admixture of finely divided particles of(a) 65-94 wt % of a non-reducing amorphous glass comprising of 15-27% ZnO, 8-30% alkaline earth metal oxides including 7-21% BaO, 40-60% SiO.sub.2, 3-14% Al.sub.2 O.sub.3, 0-5% PbO and 0.5-5% of a metal oxide selected from ZrO.sub.2, up to 2.5% P.sub.2 O.sub.5 and mixtures thereof, the composition being crystallizable and non-reducing when fired at 850.degree.-900.degree. C.(b) 30-5 wt % of a metal oxide of Al.sub.2 O.sub.3, ZrSiO.sub.4 and mixtures thereof,(c) 1-5 wt % of a metal oxide kerf additive of CoAl.sub.2 O.sub.4, Co/CrAl.sub.2 O.sub.4, CoO, CoCr.sub.2 O.sub.4, Cr.sub.2 O.sub.3, TiO.sub.2, and mixtures thereof,where the sum of the components a and b does not exceed 35% by weight of the total particulate admixture, and(d) optionally, 1-10 wt % of either a TCE reducing additive of zircon, mullite, silica, and mixtures thereof or a TCE increasing additive of CaZrO.sub.3, quartz, .alpha.-cristobalite and mixtures thereof.

Abstract: Low-expansion devitrifying glass compositions exhibiting a negative-slope temperature coefficient of expansion over a temperature range from about 125.degree. C. to about 500.degree. C. are useful for the fabrication of thick film copper via-fill inks for multilayer printed-circuit boards.

Abstract: An improved dielectric formulation for the fabrication of multilayer, integrated circuits which comprises a devitrifying zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit, a devitrifying zinc-magnesium-barium-aluminum-silicate glass frit, or a devitrifying zinc-magnesium-strontium-aluminum-silicate glass frit which are stabilized by the presence of from about 0.01 to about 1 weight percent each of lead oxide and iron oxide.

Abstract: A dielectric glass composition consisting essentially on a molar basis of 15-27% ZNO, 8-16% BaO, 40-60% SiO.sub.2, 3-14% Al.sub.2 O.sub.3, 0-5% PbO and 0.5-5% of a metal oxide selected from ZrO.sub.2, up to 2.5% P.sub.2 O.sub.5 and mixtures thereof, the composition being crystallizable and non-reducing when fired at 850.degree.-900.degree. C.

Abstract: Improved copper conductor inks useful in the fabrication of multilevel circuits are disclosed. The inks comprise copper powder, a devitrifying glass frit selected from a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit and mixtures thereof, an adhesion promoting oxide, and a suitable organic vehicle. These inks are particularly adapted for applications where superior adhesion between the copper conductor ink and the underlying substrate or dielectric film is required.

Abstract: Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700.degree. C., and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.

Abstract: A novel devitrifying frit is disclosed which has a coefficient of expansion essentially the same as that of silicon. The subject frits have a high softening temperature and excellent reheat stability which make them useful in ink formulations for forming dielectric layers in multilayer circuitry. The frits are also suitable for use as a substrate material for direct mounting of silicon chips or for use in thick film via-fill inks.

Abstract: An improved transfer printing ink for printing indicia on impervious surfaces, such as glass, is comprised of a liquid resin component comprising one or more liquid acrylate monomers, one or more polyfunctional acrylate monomers, one or more polymeric binders and one or more photoinitiators. The transfer ink also is comprised of a solid component comprising one or more pigment materials and a particulate glass frit mixture. The glass frit mixture consists of a pluality of wetting agents and a frit flux. The wetting agents melt at an elevated temperature to fuse the pigments and the frit flux to the glass.

Abstract: An improved dielectric ink for the fabrication of multilayer integrated circuits is disclosed. The subject inks comprise a devitrifying magnesium-barium-aluminum-zirconium-borophosphosilicate glass frit, an organic vehicle and, optionally, a suitable ceramic filler material. Dielectric layers and stand-alone substrates formed from the subject inks are characterized by good mechanical strength, heat resistance and exceptional density. The subject inks are particularly useful in the fabrication of multilayer circuit structures based on copper since their exceptional density renders them resistant to penetration by flux materials from the copper conductor layers.

Abstract: Improved copper conductor inks useful in the fabrication of multilevel circuits are disclosed. The inks comprise copper powder, a devitrifying glass frit selected from a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit and mixtures thereof, an adhesion promoting oxide, and a suitable organic vehicle. These inks are particularly adapted for applications where superior adhesion between the copper conductor ink and underlying substrate or dielectric film is required.

Abstract: An improved copper via-fill ink for forming post-ups in a thick dielectric layer separating two patterned layers of copper conductor in a multilayer circuit assembly is provided. The via-fill ink comprises copper powder, a suitable organic vehicle and a glass frit consisting of a devitrifying glass and a vitreous glass. The devitrifying glass is a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass and the vitreous glass is a barium-calcium-borosilicate glass.

Abstract: Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700.degree. C., and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.

Abstract: An improved dielectric ink for the fabrication of multilayer, integrated circuits is disclosed. The subject inks comprise a devitrifying zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit, a devitrifying zinc-magnesium-barium-aluminum-silicate glass frit, or a devitrifying zinc-magnesium-strotium-aluminum-silicate glass frit, an organic vehicle and, optionally, a suitable ceramic filler material. The subject glass frit containing a suitable ceramic filler can be fabricated into stand-alone substrates useful in a wide variety of electronic applications. The glass frit of the subject inks has a high softening temperature which facilitates complete removal of carbonaceous residues of the vehicle from the dried ink during firing. This is advantageous in that it eliminates the need to incorporate oxygen-generating additives, such as barium nitrate, in the ink or treatment of the ink in an oxidizing or reducing plasma prior to firing.

Abstract: A novel devitrifying frit is disclosed which has a coefficient of expansion essentially the same as that of silicon. The subject frits have a high softening temperature and excellent reheat stability which make them useful in ink formulations for forming dielectric layers in multilayer circuitry. The frits are also suitable for use as a substrate material for direct mounting of silicon chips or for use in thick film via-fill inks.

Abstract: An improved dielectric ink for the fabrication of multilayer, copper-based integrated circuits is disclosed. The subject inks comprise a suitable ceramic filler material, an organic vehicle and a lead-zinc-aluminum-borosilicate glass frit. Dielectric layers formed from the subject inks are characterized by exceptional resistance to the penetration therein by flux materials such as PbO and Bi.sub.2 O.sub.3 from conventional copper conductors during repeated firings.

Abstract: Low-expansion devitrifying glass compositions exhibiting a negative-slope temperature coefficient of expansion over a temperature range from about 125.degree. C. to about 500.degree. C. are useful for the fabrication of thick film copper via-fill inks of multilayer printed-circuit boards.