Patents by Inventor Kenneth W. Nestor

Kenneth W. Nestor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density thick foil circuitry laminated package
    Patent number: 4081600
    Abstract: Improvements are disclosed in the conventional process for the laminated packaging of etched circuitry consisting of:(1) A unitized form tool which is produced by photomasking a metal plate, with the same pattern master transparency that is used for producing the photoetched circuitry, followed by chemical milling of the exposed areas to a depth equal to the thickness of the circuitry,(2) the manufacturer's low pressure dwell cycle in the press for prepreg containing epoxy resin or polyimide resin is for either resin changed to 210.+-. 15 secs. at 10.+-. 1 psi and 340.degree. F.
    Type: Grant
    Filed: July 28, 1976
    Date of Patent: March 28, 1978
    Assignee: Buss Systems, Inc.
    Inventors: Joseph A. Kueneman, Kenneth W. Nestor, Adolph J. Miera