Abstract: A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.

Abstract: In one embodiment, the method for making a product comprises: contacting a surface of the electroform with a solution having a pH of less than or equal to 6, applying a cathodic current to the electroform, applying a product material to the electroform, curing the product material, and removing the cured material from the electroform to form the product.

Abstract: In one embodiment, the method for making the electroform comprises: attaching a sub-master to a first side of a stiffener plate to form a mounted sub-master, masking sides and a second side of the stiffener plate with polyester tape, passivating the surface to form a passivation layer, plating the surface with a metal to form a metal layer, and removing the metal layer to form the electroform.

Abstract: In one embodiment, the method for making an electroform comprises: passivating a sub-master to form a passivation layer, disposing the passivated sub-master into an initial electroplating solution, applying a first current, depositing a first metal onto the passivated sub-master to form an initial coating on the sub-master, moving the initially coated sub-master from the initial electroplating solution to a subsequent plating solution, applying a second current, depositing a subsequent layer of a second metal onto the initial coating to form a multilayer, and removing the multilayer to form the electroform.

Abstract: Disclosed herein are embossing drums, systems, methods for their use and their maintenance, and films made using the drums. In one embodiment, an embossing drum system can comprise: a mandrel, a primary journal extending from a first end of the mandrel, a secondary journal extending from a second end of the journal, and a seamless sleeve disposed around the mandrel to form a drum. The sleeve comprises a pattern cut into a sleeve outer surface. In one embodiment, a method of making optical films, comprises: introducing a polymer to an embossing drum system, forming the pattern into a surface of the polymer to produce a film, and removing the film from the drum. The embossing drum system comprises a drum with a pattern cut into a drum outer surface. The film has a continuous, seamless pattern having a length that is greater than the drum circumference.

Abstract: In one embodiment, the method for making an electroform comprises: attaching a sub-master to a first side of a stiffener plate to form a mounted sub-master, wherein the stiffener plate is longer and/or wider than the sub-master such that, when the sub-master is attached to the stiffener plate, the stiffener plate forms a boarder around the sub-master, disposing conductive rim on the stiffener plate in physical contact with the boarder and with the edges of the sub-master, masking edges and a second side of the stiffener plate, passivating the surface to form a passivation layer, plating the surface and non-masked areas of the conductive rim with a metal to form a metal layer, and removing the metal layer to form the electroform.

Abstract: In one embodiment, a method for making an electroform, comprises passivating a sub-master to form a passivation layer. The passivation comprises contacting at least a surface of the sub-master with a solution comprising an oxidizing agent and applying an anodic current to the sub-master. The surface of the sub-master can be plated with a metal to form a metal layer. The metal layer can be removed to form the electroform.

Abstract: Disclosed herein is a method comprising inspecting a mold for a defect; determining a type of defect present on the mold; sorting the mold by type of defect present; treating the mold with a cleaning process that is suitable to remove the defect; and pressing the mold against a polymeric film to produce a series of defect free light management films; wherein the yield of light management films manufactured from the mold is higher than the yield of light management films that are produced from a comparative mold that has not been treated with the cleaning process.

Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.

Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

Abstract: An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.

Abstract: A curable molding composition is provided having a binder system and a filler system. The molding composition is useful as an electronic material composition for electronic devices.

Abstract: A tack-free composition comprising a functionalized polymer having a having a glass transition temperature greater than about 24° C., a reactive monomer, said reactive monomer having a melting point or softening point greater than about 24° C., a reinforcing filler, and an initiator (curing agent) is provided. The tack-free composition is useful as a molding composition for encapsulation of electronic devices and electronic device components.

Abstract: A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.

Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.

Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.

Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

Abstract: A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.