Abstract: The disclosure is directed towards mitigation of qubit crosstalk-induced errors within a quantum computing system (QCS). A compensating signal is provided to one or more qubits. The compensating signal at least partially “cancels-out” (e.g., compensates for) the crosstalk between pairs of qubits. Such crosstalk-induced errors may include leakage of a qubit's quantum state out of the quantum system's computational subspace. Thus, the embodiments may be employed to decrease quantum computational errors occurring from a qubit transitioning (or leaking) to an excited state that is not within the quantum system's computational subspace.

Abstract: The present subject matter provides technical solutions for the technical problems facing quantum computing by improving the accuracy and precision of qubit readout. Technical solutions described herein improves the readout fidelity by reducing the ambiguity between the bright and dark states. In an embodiment, this includes transferring the qubit population that is in the dark quantum state to an auxiliary third state. The auxiliary third state remains dark and reduces the mixing between the logical bright and dark states. This process uses multiple laser pulses to ensure high fidelity population transfer, thus preserving the dark nature of the dark state. Improving readout fidelity of 171Yb+ qubits may improve fidelity by an order of magnitude, such as by improving readout fidelity from 99.9% to 99.99%. This improvement in detection fidelity may substantially increase the computational power of a quantum computer.

Abstract: Aspects of the disclosure relate to dynamically controlling access to linked content in electronic communications. A computing platform may receive, from a user computing device, a request for a uniform resource locator associated with an email message and may evaluate the request using one or more isolation criteria. Based on evaluating the request, the computing platform may identify that the request meets at least one isolation condition associated with the one or more isolation criteria. In response to identifying that the request meets the at least one isolation condition associated with the one or more isolation criteria, the computing platform may initiate a browser mirroring session with the user computing device to provide the user computing device with limited access to a resource corresponding to the uniform resource locator associated with the email message.

Abstract: The techniques described herein relate generally to reconfigurable support pads for fabric image transfers. Specifically, according to one or more embodiments of the present disclosure, reconfigurable support pads are provided for fabric image transfers (e.g., silk screening, heat transfer, direct-to-garment printing, etc.). In particular, the techniques herein provide for various adjustable configurations of portions of the fabric substrate support, which may be changed for different thicknesses of garments, and more particularly, that allow for varied thicknesses found on the same garment. For example, by configuring the support in a first “flat” configuration, a plain tee shirt may lay flat, and then configuring the support in a second “two-tiered” configuration, with one portion lower (or higher) than the other, allows for a hoodie with a thicker pocket portion at the “belly” of the garment to also lay flat.

Abstract: Aspects of the disclosure relate to dynamically controlling access to linked content in electronic communications. A computing platform may receive, from a user computing device, a request for a uniform resource locator associated with an email message and may evaluate the request using one or more isolation criteria. Based on evaluating the request, the computing platform may identify that the request meets at least one isolation condition associated with the one or more isolation criteria. In response to identifying that the request meets the at least one isolation condition associated with the one or more isolation criteria, the computing platform may initiate a browser mirroring session with the user computing device to provide the user computing device with limited access to a resource corresponding to the uniform resource locator associated with the email message.

Abstract: A high-speed, closed-loop fabric printer apparatus is provided, comprising a plurality of consecutive stations that can be managed by a single operator. In particular, shirts or other fabric garments may be individually loaded and secured on a pallet by an operator, and the loaded pallets may then cycle through a plurality of unmanned stations positioned along a contiguous path (e.g., oval). The pallet may be configured to expose a main print area and a neck tag area, to allow for both areas to be printed. The pallet may include a neck tag print plate that may elevate the neck tag area to be at the same level as the main print area. In some embodiments, a top coat printing station may apply a top coat to the main print area and/or neck tag area.

Abstract: Aspects of the disclosure relate to dynamically controlling access to linked content in electronic communications. A computing platform may receive, from a user computing device, a request for a uniform resource locator associated with an email message. Subsequently, the computing platform may identify that the uniform resource locator associated with the email message corresponds to a potentially-malicious site. In response to identifying that the uniform resource locator associated with the email message corresponds to the potentially-malicious site, the computing platform may determine a risk profile associated with the request received from the user computing device. Based on the risk profile associated with the request, the computing platform may execute an isolation method to provide limited access to the uniform resource locator associated with the email message.

Abstract: Aspects of the disclosure relate to dynamically controlling access to linked content in electronic communications. A computing platform may receive, from a user computing device, a request for a uniform resource locator associated with an email message and may evaluate the request using one or more isolation criteria. Based on evaluating the request, the computing platform may identify that the request meets at least one isolation condition associated with the one or more isolation criteria. In response to identifying that the request meets the at least one isolation condition associated with the one or more isolation criteria, the computing platform may initiate a browser mirroring session with the user computing device to provide the user computing device with limited access to a resource corresponding to the uniform resource locator associated with the email message.

Abstract: The present subject matter provides technical solutions for the technical problems facing quantum computing by improving the accuracy and precision of qubit readout. Technical solutions described herein improves the readout fidelity by reducing the ambiguity between the bright and dark states. In an embodiment, this includes transferring the qubit population that is in the dark quantum state to an auxiliary third state. The auxiliary third state remains dark and reduces the mixing between the logical bright and dark states. This process uses multiple laser pulses to ensure high fidelity population transfer, thus preserving the dark nature of the dark state. Improving readout fidelity of 171Yb+ qubits may improve fidelity by an order of magnitude, such as by improving readout fidelity from 99.9% to 99.99%. This improvement in detection fidelity may substantially increase the computational power of a quantum computer.

Abstract: A warpage test system uses a calibration block to calibrate the warpage test system over a temperature profile. The calibration block includes a first metal block bonded to a second metal block. The first metal block includes a first metal and a second different metal. The first metal block includes a CTE different than a CTE of the second metal block. The calibration block is disposed in the warpage test system. A warpage of the calibration block is measured over a temperature profile ranging from 28° C. to 260° C. A deviation between the measured warpage of the calibration block and a known thermal expansion of the calibration block over the temperature profile is recorded. The warpage measurement in a semiconductor package is compensated by the deviation between the measured warpage of the calibration block and the known thermal expansion or warpage of the calibration block over the temperature profile.

Abstract: A warpage test system uses a calibration block to calibrate the warpage test system over a temperature profile. The calibration block includes a first metal block bonded to a second metal block. The first metal block includes a first metal and a second different metal. The first metal block includes a CTE different than a CTE of the second metal block. The calibration block is disposed in the warpage test system. A warpage of the calibration block is measured over a temperature profile ranging from 28° C. to 260° C. A deviation between the measured warpage of the calibration block and a known thermal expansion of the calibration block over the temperature profile is recorded. The warpage measurement in a semiconductor package is compensated by the deviation between the measured warpage of the calibration block and the known thermal expansion or warpage of the calibration block over the temperature profile.

Abstract: A switching converter IC without a built-in power switching device includes a first terminal serving as a power supply positive connection, a second terminal serving as a power supply return connection, a third terminal serving as the switch-driving connection for controlling the switching duty of an external bipolar or MOSFET power switching device and also serving as a conduit for detection of current drawn by the power switching device to thereby provide overcurrent protection. Feedback information is derived from voltage between the first and the second terminals.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; forming an encapsulation covering the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure; mounting a first-external-package-component to the routing structure; and forming a first-external-package-encapsulation covering the first-external-package-component.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; forming an encapsulation covering the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure; mounting a first-external-package-component to the routing structure; and forming a first-external-package-encapsulation covering the first-external-package-component.

Abstract: A switching converter IC without a built-in power switching device includes a first terminal serving as a power supply positive connection, a second terminal serving as a power supply return connection, a third terminal serving as the switch-driving connection for controlling the switching duty of an external bipolar or MOSFET power switching device and also serving as a conduit for detection of current drawn by the power switching device to thereby provide overcurrent protection. Feedback information is derived from voltage between the first and the second terminals.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; and forming an encapsulation that encapsulates the integrated circuit, the routing structure.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; and forming an encapsulation that encapsulates the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure.

Abstract: A capillary tip for a wire bonding tool has a chamfer provided with at least one annular groove. The annular groove is generally oriented in a plane perpendicular to the axis of the capillary. In a sectional view through the capillary axis, the groove profile may be generally part-oval or part circular, such as semicircular or half-oval; or generally rectangular; or generally triangular. In some embodiments the width of the groove profile at the face of the chamfer is at least about one-tenth, more usually at least about one-fifth, the length of the chamfer face; and less than about one-half, more usually less than about one-third, the length of the chamfer face. In some embodiments two or more such grooves are provided. The grooved chamfer can improve the transmission of ultrasonic energy to the wire ball during formation of the bond.

Abstract: A method of marketing incontinence products is disclosed. The method includes creating a product offering of incontinence products. The product offering includes first, second and third segments that are distinguished from one another by display segmentation elements. The first segment is directed to male incontinence consumers, the second segment is directed to female incontinence consumers, and the third segment is directed to caregivers. The product offering is then communicated to a retailer and a product display is created at a retail site that resembles the product offering. Either simultaneously or sequentially, the product offering is communicated to potential purchasers, using multimedia advertisement, to inform them of the availability of such disposable absorbent incontinence products.