Abstract: An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

Abstract: An oscillator includes an oscillation source, multiple temperature control elements, and a controller adapted to perform control to suppress an increase in current consumed in one or more of the temperature control elements during at least part of a period from when operation of the oscillation source initiates to when the oscillation source reaches a specified temperature.

Abstract: An oscillator includes: an integrated circuit including a circuit for oscillation; a resonator element; a circuit element; a heating element, and a container. The integrated circuit, the resonator element, and the heating element are arranged inside the container. The circuit element is arranged outside the container.

Abstract: An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

Abstract: An integrated circuit device includes a substrate, a joining part provided on the substrate and joined to a vibrator, and a plurality of bonding pads provided on the substrate. The joining part includes an insulating protective film that covers a part of a surface of the substrate, and no insulating protective film is provided between the adjacent bonding pads.

Abstract: A package includes a base member and a first projecting portion that projects from one surface of the base member. The first projecting portion contacts a first substrate on which an electronic component is mounted, and has an insulating property.

Abstract: An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

Abstract: An oscillator includes an oscillation source, multiple temperature control elements, and a controller adapted to perform control to suppress an increase in current consumed in one or more of the temperature control elements during at least part of a period from when operation of the oscillation source initiates to when the oscillation source reaches a specified temperature.

Abstract: An oscillator includes: an integrated circuit including a circuit for oscillation; a resonator element; a circuit element; a heating element, and a container. The integrated circuit, the resonator element, and the heating element are arranged inside the container. The circuit element is arranged outside the container.

Abstract: An oscillator includes: an integrated circuit including a circuit for oscillation; a resonator element; a circuit element; a heating element, and a container. The integrated circuit, the resonator element, and the heating element are arranged inside the container. The circuit element is arranged outside the container.

Abstract: An electronic device includes a resonator provided with a heating element, and a circuit component opposed to the heating element, and provided with at least an oscillating amplifier element, and a distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.5 mm.

Abstract: A method of adjusting a frequency of a resonation device including a resonator element and a heating element includes performing the frequency adjustment of the resonator element while heating the resonator element by the heating element.

Abstract: An oscillator includes an oscillation element; an oscillation circuit which causes the oscillation element to oscillate; a heat generation element which heats the oscillation element; a temperature control circuit which controls the heat generation element; and a temperature correction circuit which corrects frequency-temperature characteristics of an output signal of the oscillation circuit.

Abstract: A quartz crystal vibrator includes a quartz crystal resonator element, a thermistor adapted to detect the temperature, and a package adapted to incorporate the quartz crystal resonator element and the thermistor, a plurality of electrode pads adapted to support the quartz crystal resonator element is disposed on an inner bottom surface of the package, to which the quartz crystal resonator element and the thermistor are installed, and a wiring pattern, which is extracted from at least one electrode pad, and has a thermal conductivity higher than a thermal conductivity of a package base of the package including the inner bottom surface, overlaps the thermistor in a plan view.

Abstract: An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

Abstract: A resonator includes: a package; a support section that is provided on a surface of the package; and a vibration element in which an attachment section, which is disposed between an outer edge of a vibration substrate, in which excitation electrodes are provided on main surfaces thereof, and an outer edge of the excitation electrode, is attached to the support section through a conductive adhesive. The attachment section is disposed in a region S obtained by rotating a virtual line which connects the center of the vibration element and one end of the vibration element, in a range of ?35° to +35° of a rotation angle ? about the center, and an attachment area becomes 0.7 mm2 or more.

Abstract: An oscillator includes an oscillation element; an oscillation circuit which causes the oscillation element to oscillate; a heat generation element which heats the oscillation element; a temperature control circuit which controls the heat generation element; and a temperature correction circuit which corrects frequency-temperature characteristics of an output signal of the oscillation circuit.

Abstract: An electronic device includes a resonator provided with a heating element, and a circuit component opposed to the heating element, and provided with at least an oscillating amplifier element, and a distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.5 mm.

Abstract: An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. The wiring substrate is disposed within the container through the first support and the second support which penetrate the container. Each of the first support and the second support includes a protrusion portion protruding outside the container, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

Abstract: An oscillator includes an oscillation element; an oscillation circuit which causes the oscillation element to oscillate; a heat generation element which heats the oscillation element; a temperature control circuit which controls the heat generation element; and a temperature correction circuit which corrects frequency-temperature characteristics of an output signal of the oscillation circuit.