Abstract: The disclosed laminated coating layer includes a metal oxide film formed on a processing target through low-temperature atomic layer deposition. The coating layer includes at least one set of at least two layers of an adhesion layer, a moisture-proof layer, and a waterproof layer, stacked from the surface of the processing target in this order. The adhesion layer is formed of at least one film selected from a metal oxide film and a resin film; the moisture-proof layer is a film containing alumina as a predominant ingredient; and the waterproof layer is formed of at least one film of a resin film and a metal oxide film which is selected from among a silica film, a niobium oxide film, and a zirconium oxide film.

Abstract: Disclosed is a method for forming an oxide thin film on a solid substrate, the method including the steps of placing a solid substrate s a in a reaction container 1, maintaining the solid substrate at a temperature of higher than 0° C. and 150° C. or lower, and filling the reaction container with an organometallic gas containing tetrakis(ethylmethylamino)hafnium or tetrakis(ethylmethylamino)zirconium; discharging the organometallic gas from the reaction container or filling the reaction container with an inert gas; treating a gas containing oxygen and water vapor with plasma, to thereby generate a plasma gas containing excited oxygen and water vapor, and feeding the plasma gas into the reaction container; and discharging the plasma gas from the reaction container or filling the reaction container with an inert gas; and repeating the series of steps.