Abstract: The present invention provides an electrodeposited copper foil having a tensile strength of at least 300 MPa and elongation rate of at least 3.0% after heat treatment at 350° C. for 1 hour and provides a copper foil which prevents the breakage of a current collector (copper foil) while maintaining adhesiveness between the current collector (copper foil) and the active material in response to substantial expansion and contraction of a Si or Sn alloy-based active material. The foil is an electrodeposited copper foil having a roughened surface, the tensile strength of the copper foil being at least 300 MPa after heating at 350° C. for 1 hour, the elongation rate being at least 3.0% after heating at 350° C. for 1 hour, and respective surface area ratios (actual surface area/geometric surface area) of both sides of the copper foil (the side that is roughened and the side that is not roughened) being from 1.6 to 2.2.

Abstract: The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° C. or more. That electrolytic copper alloy foil, which contains tungsten copper, preferably incorporates tungsten into copper foil as a copper alloy, has a tensile strength at ordinary temperature of 650 MPa, has a tensile strength after heat treatment at 300° C. for 1 hour of 450 MPa or more, and has a conductivity of 80% or more. Further preferably, the electrolytic copper foil has an elongation at ordinary temperature of 2.5% or more and an elongation after treatment at 300° C. for 1 hour of 3.5% or more. The electrolytic copper foil is produced by adding a thiourea compound, tungsten salt, and chloride ions to a sulfuric acid-copper sulfate electrolyte and performing electrolytic deposition.

Abstract: To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250 N/mm2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed.

Abstract: Task: To provide an electrodeposited copper alloy foil with large mechanical strength under normal conditions, and that does not easily degrade due to heat when heated to about 300° C. Resolution Means: An electrodeposited copper alloy foil that includes a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, and a method of manufacturing same.

Abstract: A chargeable and dischargeable secondary battery for use in electronic devices, industrial machines, electric-powered vehicles, is provided, along with an anodic electrode and a copper foil for anode current collector. It is an anode for secondary battery that utilizes non-aqueous electrolyte, which comprises a silicon-type active material film formed on one side or both sides of a current collector made of copper foil or copper alloy foil, wherein 1 g/m2 to 14 g/m2 of silicon-type active material film is formed on said current collector, and the lightness Y value in a XYZ colorimetric system (CIE 1931 standard colorimetric system) for the surface of said anode, onto which said silicon-type active material film is formed, is 15 to 50, and the surface roughness (ten point average roughness) Rz specified by the Japanese Industrial Standards (JIS B0601-1994 ten point average roughness) is 1.0 ?m or more and 4.5 ?m or less.

Abstract: Task: To provide an electrodeposited copper alloy foil with large mechanical strength under normal conditions, and that does not easily degrade due to heat when heated to about 300° C. Resolution Means: An electrodeposited copper alloy foil that includes a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, and a method of manufacturing same.

Abstract: The present invention provides an electrodeposited copper foil having a tensile strength of at least 300 MPa and elongation rate of at least 3.0% after heat treatment at 350° C. for 1 hour and provides a copper foil which prevents the breakage of a current collector (copper foil) while maintaining adhesiveness between the current collector (copper foil) and the active material in response to substantial expansion and contraction of a Si or Sn alloy-based active material. The foil is an electrodeposited copper foil having a roughened surface, the tensile strength of the copper foil being at least 300 MPa after heating at 350° C. for 1 hour, the elongation rate being at least 3.0% after heating at 350° C. for 1 hour, and respective surface area ratios (actual surface area/geometric surface area) of both sides of the copper foil (the side that is roughened and the side that is not roughened) being from 1.6 to 2.2.

Abstract: The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° C. or more. That electrolytic copper alloy foil, which contains tungsten copper, preferably incorporates tungsten into copper foil as a copper alloy, has a tensile strength at ordinary temperature of 650 MPa, has a tensile strength after heat treatment at 300° C. for 1 hour of 450 MPa or more, and has a conductivity of 80% or more. Further preferably, the electrolytic copper foil has an elongation at ordinary temperature of 2.5% or more and an elongation after treatment at 300° C. for 1 hour of 3.5% or more. The electrolytic copper foil is produced by adding a thiourea compound, tungsten salt, and chloride ions to a sulfuric acid-copper sulfate electrolyte and performing electrolytic deposition.

Abstract: To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250N/mm2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed.

Abstract: A lithium ion secondary battery, which uses a negative electrode wherein an active material is deposited on a collector, and which is characterized in that no wrinkles are formed on the collector, the collector does not fracture, the adhesion between the active material and the collector is high, and stable performance can be maintained for a long period of time; an electrode for the secondary battery; and an electrolytic copper foil that constitutes the electrode. Specifically disclosed is an electrolytic copper foil for a lithium ion secondary battery, in which a surface-roughened layer of copper or copper alloy particles having a particle diameter of 0.1-3 ?m is formed on both surfaces of an untreated copper foil by roughening treatment by means of electrolysis, and the surface-roughened layers on both surfaces have a surface roughness Rz of 1.0-5 ?m and a surface roughness Ra of 0.25-0.

Abstract: Disclosed is a surface-treated copper foil, which exhibits excellent weldability when copper foils or a copper foil and an other metal are welded with each other by ultrasonic welding. Specifically disclosed is a surface-treated copper foil which is characterized in that an organic antirust coating film is formed on at least one surface of the copper foil and the reciprocal of the electric double layer capacity representing the thickness of one surface (1/C) is 0.3-0.8 cm2/?F. The organic antirust coating film is formed from a triazole compound, a dicarboxylic acid and an amine, or alternatively formed from a tetrazole compound, a dicarboxylic acid and an amine.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit lines, etc. at the time of formation of fine patterns, and superior in heat resistance and electrical characteristics, comprising untreated copper foil roughening treated on its surface, wherein the untreated copper foil before roughening treatment is an electrodeposited copper foil having a surface roughness in terms of 10-point average roughness Rz not more than 2.5 ?m and a minimum distance between peaks of rough pyramid of at least 5 ?m or having further crystal grains of an average particle size of not more than 2 ?m exposed at the surface thereof, and a method of production of the same.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: An electrodeposited copper foil having a rough surface having knob-like projections and a surface roughness of 2 to 4 &mgr;m at part of a surface thereof produced by electrolysis using an electrolyte containing copper as a main component and a compound having mercapto groups, at least one type of another organic compound, and chloride ions and an electrodeposited copper foil obtained by roughening treating an untreated copper foil having a matte side, for bonding with a resin substrate, having knob-like projections and a surface roughness of 2 to 4 &mgr;m by running a predetermined current through it for a predetermined time in an electroforming bath.

Abstract: Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit lines, etc. at the time of formation of fine patterns, and superior in heat resistance and electrical characteristics, comprising untreated copper foil roughening treated on its surface, wherein the untreated copper foil before roughening treatment is an electrodeposited copper foil having a surface roughness in terms of 10-point average roughness Rz not more than 2.5 &mgr;m and a minimum distance between peaks of rough pyramid of at least 5 &mgr;m or having further crystal grains of an average particle size of not more than 2 &mgr;m exposed at the surface thereof, and a method of production of the same.