Abstract: The present invention relates to an output-current detection IC chip for diode sensors and a diode sensor device, which reduce the influence by a leak current of a protection circuit. The present invention is equipped with a sensor unit in which anodes of N (N being an integer of 2 or more) diode sensors are connected to each other, a common terminal connected to a connection portion where the anodes are connected to each other, N input terminals connected to cathodes of the diode sensors, N+1 protection circuits connected to the input terminals and the common terminal, an I-V conversion circuit which converts an output current of each diode sensor into a voltage, a chopper circuit which switches the polarity of the output current and inputs the same to the I-V conversion circuit, and a dummy protection circuit connected to the input of the I-V conversion circuit.

Abstract: The present invention relates to an output-current detection IC chip for diode sensors and a diode sensor device, which reduce the influence by a leak current of a protection circuit. The present invention is equipped with a sensor unit in which anodes of N (N being an integer of 2 or more) diode sensors are connected to each other, a common terminal connected to a connection portion where the anodes are connected to each other, N input terminals connected to cathodes of the diode sensors, N+1 protection circuits connected to the input terminals and the common terminal, an I-V conversion circuit which converts an output current of each diode sensor into a voltage, a chopper circuit which switches the polarity of the output current and inputs the same to the I-V conversion circuit, and a dummy protection circuit connected to the input of the I-V conversion circuit.

Abstract: A semiconductor device module includes a package and a holder, the package includes, for example, a central processing unit, and the holder accommodates a removable leadless chip carrier. The holder comprising contact leads connected to electrode pads of the package. The leadless chip carrier also includes, for example, an erasable programmable read only memory, whereby the leadless chip carrier can be easily removed from the holder, resulting in easily writing into the erasable programmable read only memory or easy replacement of the leadless chip carrier.