Abstract: An implantable intraocular physiological sensor for measuring a physiological characteristic, such as intraocular pressure. The implantable intraocular physiological sensor may include a tubular main body configured to house one or more electrical components. The implantable intraocular physiological sensor may also include a sensor cap configured to be inserted into a first end of the tubular main body with a moisture barrier seal. The implantable intraocular physiological sensor may wirelessly transmit measurements to an external device.

Abstract: An implantable intraocular physiological sensor for measuring a physiological characteristic, such as intraocular pressure. The implantable intraocular physiological sensor may include a tubular main body configured to house one or more electrical components. The implantable intraocular physiological sensor may also include a sensor cap configured to be inserted into a first end of the tubular main body with a moisture barrier seal. The implantable intraocular physiological sensor may wirelessly transmit measurements to an external device.

Abstract: An implantable intraocular physiological sensor for measuring a physiological characteristic, such as intraocular pressure. The implantable intraocular physiological sensor may include a tubular main body configured to house one or more electrical components. The implantable intraocular physiological sensor may also include a sensor cap configured to be inserted into a first end of the tubular main body with a moisture barrier seal. The implantable intraocular physiological sensor may wirelessly transmit measurements to an external device.

Abstract: An implantable intraocular physiological sensor for measuring a physiological characteristic, such as intraocular pressure. The implantable intraocular physiological sensor may include a tubular main body configured to house one or more electrical components. The implantable intraocular physiological sensor may also include a sensor cap configured to be inserted into a first end of the tubular main body with a moisture barrier seal. The implantable intraocular physiological sensor may wirelessly transmit measurements to an external device.

Abstract: A device includes a semiconductor substrate having a plurality of doped layers forming first and second junctions. The semiconductor substrate includes a first surface and a second surface opposite the first surface. The device includes a plurality of waveguides defined by a plurality of glass inlaid channels defined within the first surface. Each of the plurality of glass inlaid channels extends through the second junction. The device includes a pattern of reflective elements associated with sidewalls of the plurality of glass inlaid channels to reflect light into the plurality of waveguides. A first electrically-conductive layer is disposed on the first surface and covers the plurality of glass inlaid channels.

Abstract: An implantable intraocular physiological sensor for measuring a physiological characteristic, such as intraocular pressure. The implantable intraocular physiological sensor may include a tubular main body configured to house one or more electrical components. The implantable intraocular physiological sensor may also include a sensor cap configured to be inserted into a first end of the tubular main body with a moisture barrier seal. The implantable intraocular physiological sensor may wirelessly transmit measurements to an external device.

Abstract: A two-dimensional gas chromatography system having first and second separation columns, a thermal modulator disposed between the first and second columns and having a plurality of stage channels, and a micro heater monolithically integrated in the thermal modulator. The thermal modulator is operable to trap and focus gas/vapor species within the plurality of stage channels upon cooling and release the gas/vapor species to the second column upon heating by the micro heater.

Abstract: A microsystem comprising a substrate having an aperture formed therethrough. The aperture includes a first cross-section and a second cross-section—the first cross-section being smaller than the second cross-section to define a ledge therebetween. A probe member is disposed within the aperture of the substrate, such that a backend of the probe member defines a cross-section that is greater than the first cross-section of the aperture and smaller than the second cross-section such that the probe member engages the ledge. A plurality of probe shanks extend from the probe member. Each of the probe shanks includes a plurality of leads disposed there along. Each of the leads extending from the probe shanks to an opposing side of the probe member.

Abstract: A device includes a first device structure having a semiconductor platform, and a second device structure having a microstructure spaced from the semiconductor platform. The device further includes a cable having a plurality of beams to couple the microstructure to the first device structure. Each beam of the plurality of beams has a polymer coating and a serpentine-shaped region.

Abstract: A two-dimensional gas chromatography system having first and second separation columns, a thermal modulator disposed between the first and second columns and having a plurality of stage channels, and a micro heater monolithically integrated in the thermal modulator. The thermal modulator is operable to trap and focus gas/vapor species within the plurality of stage channels upon cooling and release the gas/vapor species to the second column upon heating by the micro heater.

Abstract: A device includes a first device structure having a semiconductor platform, and a second device structure having a microstructure spaced from the semiconductor platform. The device further includes a cable having a plurality of beams to couple the microstructure to the first device structure. Each beam of the plurality of beams has a polymer coating and a serpentine-shaped region.

Abstract: Disclosed herein is a method of fabricating a device having a microstructure. The method includes forming a connector on a semiconductor substrate, coating the connector with a polymer layer, and immersing the semiconductor substrate and the coated connector in an etchant solution to form the microstructure from the semiconductor substrate and to release the coated connector and the microstructure from the semiconductor substrate such that the microstructure remains coupled to a further element of the device via the coated connector. In some cases, the microstructure is defined by forming an etch stop in the semiconductor substrate, and the microstructure and the semiconductor substrate are coated with a polymer layer, which may then be selectively patterned. The microstructure may then be released from the semiconductor substrate in accordance with the etch stop.

Abstract: A microsystem comprising a substrate having an aperture formed therethrough. The aperture includes a first cross-section and a second cross-section—the first cross-section being smaller than the second cross-section to define a ledge therebetween. A probe member is disposed within the aperture of the substrate, such that a backend of the probe member defines a cross-section that is greater than the first cross-section of the aperture and smaller than the second cross-section such that the probe member engages the ledge. A plurality of probe shanks extend from the probe member. Each of the probe shanks includes a plurality of leads disposed there along. Each of the leads extending from the probe shanks to an opposing side of the probe member.

Abstract: Disclosed herein is a stent device useful for maintaining the patency of a lumen while monitoring an intraluminal characteristic. The device includes a structure having a set of extendible bands that are capable of plastic deformation to form a scaffolding having an inductance, and further includes a capacitance coupled to the set of extendible bands and responsive to the intraluminal characteristic. The capacitance and the inductance form a tank circuit after the plastic deformation of the set of extendible bands to enable wireless transmission of an indication of the intraluminal characteristic.

Abstract: A microvalve device includes a semiconductor-based valve housing that defines a flow passage, and a valve face disposed within the valve housing and in fluid communication with the flow passage. The microvalve device further includes a thermal expansion actuator that drives movement of the valve face from a first position to a second position relative to the flow passage, and a capacitor that holds the valve face in the second position. The microvalve may also include an insulating layer disposed on portions of the semiconductor-based valve housing, and a capacitance sensor for monitoring a capacitance level to determine when the valve face reaches the second position. Once the sensor indicates that the second position has been reached, power is no longer applied to the thermal expansion actuator such that power is only substantially consumed during the transition from the first position to the second position.

Abstract: A method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure in the microcavity and method and system for trimming resonant frequency of a microstructure in the microcavity are provided. The microcavity has an initial base pressure therein after the microcavity is locally sealed at an access passageway. The monitoring and control methods include measuring pressure in the microcavity and providing a signal when the pressure exceeds a maximum desired level. The control method also includes reducing the pressure in the microcavity to a pressure at or below the maximum desired level in response to the signal to compensate for vacuum degradation within the vacuum microcavity.

Abstract: A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.

Abstract: A high-sensitivity, separation microcolumn assembly for a microgas chromatograph and the like is provided. The assembly has an ultra-low mass complete with integrated heaters. The assembly uses multiple zones for temperature control, and microstructures that permit very rapid heating and cooling of the microcolumn.

Abstract: A high-performance separation microcolumn assembly and method for making such an assembly are provided. The assembly includes high-performance Si-glass &mgr;GC separation columns having integrated heaters and temperatures sensors for temperature programming and integrated pressure sensors for flow control. These columns, integrated on a die, are fabricated using a silicon-on-glass dissolved-wafer-process. The TCR of the temperature sensors and the sensitivity of the pressure sensors satisfy the requirements needed to achieve reproducible separations in a &mgr;GC system. Using these columns, highly-resolved multiple-component separations were obtained with analysis times a factor of two faster than isothermal responses.

Abstract: A semiconductor device (20) comprises a substrate (24), a first semiconductor region including a recessed area defining a first cavity (36) between the substrate (24) and the first semiconductor region, an electrical transducer (30) positioned within the first cavity (36), a second semiconductor.region including a recessed area defining a second cavity (40) between the substrate (24) and the second semiconductor region, an electrical circuit (34) positioned within the second cavity (40), and at least one electrode connecting the electrical transducer (30) and the electrical device (34). The semiconductor device (20) includes a first external electrode and a second external electrode formed on the substrate (24) and a sealing layer extending around the perimeter of the cavities and sealing the semiconductor regions to the substrate (24). The sealing layer (78) includes a first electrical connection region and a second electrical connection region that are electrically isolated from each other.