Patents by Inventor Kenshi KAI

Kenshi KAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9204559
    Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: December 1, 2015
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Rikihiro Maruyama, Kenshi Kai, Nobuyuki Kanzawa, Mitsutoshi Sawano
  • Publication number: 20140317896
    Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.
    Type: Application
    Filed: March 11, 2014
    Publication date: October 30, 2014
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Rikihiro MARUYAMA, Kenshi KAI, Nobuyuki KANZAWA, Mitsutoshi SAWANO