Abstract: A semiconductor device includes an electrical insulating layer with superior heat resistance, heat dissipation, and durability, and which is manufactured through a process with good cost performance and process performance. In a semiconductor device including a first substrate to which a semiconductor chip is mounted directly or indirectly, and a white insulating layer formed on a surface of the first substrate and functioning as a reflecting material, the semiconductor chip is an LED, at least the surface of the first substrate is made of a metal, and a stacked structure of the white insulating layer and a metal layer is formed by coating a liquid material, which contains SiO2 in the form of nanoparticles and a white inorganic pigment, over the surface of the first substrate and baking the coated liquid material.

Abstract: An LED illumination module in which LED bare chips are mounted on a mounting substrate at a high density, the module comprising many LED bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the LED bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit LED chip group including a plurality of LED bare chips connected in series is disposed plural, the plural unit LED chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the LED bare chips in the reflection region is 15 mm2/cm2 or more. An LED illumination apparatus including the LED illumination module is also provided.

Abstract: A steam reflow apparatus includes a heating furnace including a preheating zone, a uniform heating zone, a melting zone and a cooling zone to which superheated steams are respectively supplied. The apparatus further includes a furnace-inlet-side dew condensation prevention zone and a furnace-outlet-side dew condensation prevention zone, to which air or nitrogen gas with 100° C. or higher heated by a heater is supplied, respectively adjacently provided with an upstream side of the preheating zone and a downstream side of the cooling zone. Atmospheric pressures of the furnace-inlet-side dew condensation prevention zone and the furnace-outlet-side dew condensation prevention zone are higher than atmospheric pressures of the preheating zone and the cooling zone.

Abstract: A steam reflow apparatus includes a heating furnace including a preheating zone, a uniform heating zone, a melting zone and a cooling zone to which superheated steams are respectively supplied. The apparatus further includes a furnace-inlet-side dew condensation prevention zone and a furnace-outlet-side dew condensation prevention zone, to which air or nitrogen gas with 100° C. or higher heated by a heater is supplied, respectively adjacently provided with an upstream side of the preheating zone and a downstream side of the cooling zone. Atmospheric pressures of the furnace-inlet-side dew condensation prevention zone and the furnace-outlet-side dew condensation prevention zone are higher than atmospheric pressures of the preheating zone and the cooling zone.

Abstract: An LED illumination module in which LED bare chips are mounted on a mounting substrate at a high density, the module comprising many LED bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the LED bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit LED chip group including a plurality of LED bare chips connected in series is disposed plural, the plural unit LED chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the LED bare chips in the reflection region is 15 mm2/cm2 or more. An LED illumination apparatus including the LED illumination module is also provided.

Abstract: A semiconductor device includes an electrical insulating layer with superior heat resistance, heat dissipation, and durability, and which is manufactured through a process with good cost performance and process performance. In a semiconductor device including a first substrate to which a semiconductor chip is mounted directly or indirectly, and a white insulating layer formed on a surface of the first substrate and functioning as a reflecting material, the semiconductor chip is an LED, at least the surface of the first substrate is made of a metal, and a stacked structure of the white insulating layer and a metal layer is formed by coating a liquid material, which contains SiO2 in the form of nanoparticles and a white inorganic pigment, over the surface of the first substrate and baking the coated liquid material.

Abstract: The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the electrode while heating the solder precipitating composition applied. This solder deposition method is suitable for forming large bumps at fine pitches. In particular, it is capable of depositing solder in a desired height precisely and easily, and yet preventing occurrence of voids.

Abstract: The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the electrode while heating the solder precipitating composition applied. This solder deposition method is suitable for forming large bumps at fine pitches. In particular, it is capable of depositing solder in a desired height precisely and easily, and yet preventing occurrence of voids.

Abstract: An electronics package is provided with a substrate on which a patterned circuit is printed, a plurality of conductive leads connected to the patterned circuit along the periphery of the substrate, a first mold body arranged along the periphery of the substrate to reinforce the connection of the conductive leads to the patterned circuit, a plurality of chips attached on the substrate, a plurality of bonding wires connecting an integral circuit formed in each of the chips to the patterned circuit, and a second mold body arranged over the chips and the substrate. The second mold body functions as an insulating protector to protect the chips from an external obstacle and corrosive gases. An electric signal applied to one of the conductive leads is transferred to one of the chips through the patterned circuit and one of the bonding wires. The electric signal is processed in the chip to produce an output signal.

Abstract: A method of mounting an electronic component having a plurality of leads on a printed circuit board. The method includes the steps of roughly observing the position of an electronic component, held by a suction nozzle of a carrier turntable, by a camera constituting part of a recognition unit and determining the rough deviation of the observed position from a desired position, roughly correcting the relative position of the electronic component and the circuit board by relative movement of the circuit board and the suction nozzle in the X and Y directions of the circuit board and the direction .THETA.

Abstract: An electrical component placing apparatus is provided which includes a support body; a first table mounted on the support body; a rotary head which undergoes indexed rotation and includes a pick and place head; an X-Y table which moves a printed circuit board in X-Y directions; a second table mounted on the support body and including an electrical component placing portion; an electrical component supplying device mounted on the second table; and an assembly for laterally reciprocatingly moving the first and second tables independently of one another relative to the support body. The electrical component supplying unit includes a tray supplying unit having at least one tray for containing an electrical component and a sub pick and place head for picking up the electrical component contained in the tray and placing it onto the placing portion of the second table.

Abstract: A tapered surface is formed on a nozzle for picking up an electrical component and placing it on a printed circuit as a light diffusing surface. When a light is radiated to the tapered surface, the light is scattered, and the tapered surface becomes bright. Therefore, the electrical component is clearly observed as a black contour in the bright tapered surface by an observing unit.

Abstract: A mounting apparatus for mounting electronic components, having a head having a pick-up nozzle mounted thereon for rotation in a direction .THETA. around an axis perpendicular to a component held on the nozzle and along a path between the delivery means and an X-axis and Y-axis table means; a motor connected to the mounting head for rotating the nozzle in the direction .THETA.