Abstract: A power module substrate or the like including an insulating substrate with an upper surface and a lower surface, a metal plate with an upper surface and a lower surface, the lower surface facing and being bonded to the upper surface of the insulating substrate, and a first electroplating layer that partly covers the central portion of the upper surface of the metal plate. The first electroplating layer includes at least a silver layer, and the grain size of silver in the silver layer is more than or equal to the grain size of a metal in an upper surface portion of the metal plate.

Abstract: An RFID tag in the present disclosure includes an insulating substrate including an upper surface, a coil conductor disposed in the insulating substrate, a semiconductor element mounted on the upper surface of the insulating substrate, and a mold resin covering the upper surface of the insulating substrate and the semiconductor element. The mold resin contains a plurality of magnetic particles having particle sizes different from each other.

Abstract: A power module substrate or the like including an insulating substrate with an upper surface and a lower surface, a metal plate with an upper surface and a lower surface, the lower surface facing and being bonded to the upper surface of the insulating substrate, and a first electroplating layer that partly covers the central portion of the upper surface of the metal plate. The first electroplating layer includes at least a silver layer, and the grain size of silver in the silver layer is more than or equal to the grain size of a metal in an upper surface portion of the metal plate.

Abstract: An RFID tag in the present disclosure includes an insulating substrate including an upper surface, a coil conductor disposed in the insulating substrate, a semiconductor element mounted on the upper surface of the insulating substrate, and a mold resin covering the upper surface of the insulating substrate and the semiconductor element. The mold resin contains a plurality of magnetic particles having particle sizes different from each other.

Abstract: A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.

Abstract: A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating sheet made of metal and joined to a second principal surface of the insulating substrate, the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet is at least 3.75 times the thickness of the metal circuit sheet. The size of metal grains contained in the heat dissipating sheet is smaller than the size of metal grains contained in the metal circuit sheet, and decreases with increasing distance from the second principal surface of the insulating substrate.

Abstract: A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.

Abstract: A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating sheet made of metal and joined to a second principal surface of the insulating substrate, the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet is at least 3.75 times the thickness of the metal circuit sheet. The size of metal grains contained in the heat dissipating sheet is smaller than the size of metal grains contained in the metal circuit sheet, and decreases with increasing distance from the second principal surface of the insulating substrate.

Abstract: The invention relates to a microstructure apparatus in which a microstructure is hermetically sealed. The microstructure apparatus includes a first substrate having a first surface on which the microstructure and an electrode electrically connected to the microstructure are formed; a second substrate having a second surface; an electrically-insulating sealing material surrounding the microstructure between the first surface and the second surface to hermetically seal the microstructure; a first conductor disposed on the second surface; a second conductor disposed on the second surface and electrically connected to the first conductor; and a first conductive circuit formed in an interior of the second substrate and having a portion of which is led to the second surface, connected to the second conductor and overlapped the sealing material in a plan view thereof.