Abstract: The present invention provides a capacitor including a conductive porous base material with a porous part, a dielectric layer and an upper electrode. The porous part, the dielectric layer, and the upper electrode are stacked on top of one another in this order to define a capacitance formation part. The capacitance format ion part is not present at a lateral end part of the porous part.

Abstract: According to an embodiment, system includes transmitter, pump, controller, tank and thermal storage. Pump circulates water through the transmitter. Controller drives the pump, circulates the water while the transmitter is operating, and stops the circulation of the water at a time of a stop of the transmitter. Tank stores the water circulated through the transmitter, and supplies the water to the pump. Thermal storage is provided on a surface of the tank, and stores waste heat of the exothermic part of the transmitter, which was taken in the water via the tank. Thermal storage changes in phase if a temperature of the water in the tank lowers to a predetermined temperature or below, and heats the water by latent heat which occurs.

Abstract: A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

Abstract: A capacitor having a conductive porous substrate with at least two electrostatic capacitance forming sections, each of the at least two electrostatic capacitance forming sections including a porous portion of the conductive porous substrate, a dielectric layer on the porous portion, and an upper electrode on the dielectric layer. The at least two electrostatic capacitance forming sections are electrically connected in series by the conductive porous substrate.

Abstract: A capacitor that includes a conductive base material with high specific surface area, a dielectric layer covering the conductive base material with high specific surface area, and an upper electrode covering the dielectric layer, in which the conductive base material with high specific surface area is formed of a metal sintered body as a whole.

Abstract: A capacitor that includes a conductive base material with high specific surface area, a dielectric layer covering the conductive base material with high specific surface area, and an upper electrode covering the dielectric layer, in which the conductive base material with high specific surface area is formed of a metal sintered body as a whole.

Abstract: The present invention provides a capacitor including a conductive porous base material with a porous part, a dielectric layer and an upper electrode. The porous part, the dielectric layer, and the upper electrode are stacked on top of one another in this order to define a capacitance formation part. The capacitance format ion part is not present at a lateral end part of the porous part.

Abstract: A capacitor having a conductive porous substrate with at least two electrostatic capacitance forming sections, each of the at least two electrostatic capacitance forming sections including a porous portion of the conductive porous substrate, a dielectric layer on the porous portion, and an upper electrode on the dielectric layer. The at least two electrostatic capacitance forming sections are electrically connected in series by the conductive porous substrate.

Abstract: A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

Abstract: According to an embodiment, system includes transmitter, pump, controller, tank and thermal storage. Pump circulates water through the transmitter. Controller drives the pump, circulates the water while the transmitter is operating, and stops the circulation of the water at a time of a stop of the transmitter. Tank stores the water circulated through the transmitter, and supplies the water to the pump. Thermal storage is provided on a surface of the tank, and stores waste heat of the exothermic part of the transmitter, which was taken in the water via the tank. Thermal storage changes in phase if a temperature of the water in the tank lowers to a predetermined temperature or below, and heats the water by latent heat which occurs.

Abstract: According to one embodiment, a pump unit provided for piping which feeds a liquid at a preset unit flow rate includes (n+1) pumps and a constant flow valve. The (n+1) pumps are arranged in series and set to pressurize the liquid so as to achieve the unit flow rate when n pumps are arranged in series. The constant flow valve is installed downstream of the (n+1) pumps. The constant flow valve feeds the fluid at the unit flow rate by giving first resistance to the fluid when the fluid is pressurized by n pumps of the (n+1) pumps. The constant flow valve feeds the fluid at the unit flow rate by giving second resistance larger than the first resistance to the fluid when the fluid is pressurized by the (n+1) pumps.

Abstract: There is provided a novel method for producing a nitride single crystal with both a rapid crystal growth rate and high crystal quality, as well as a novel autoclave that can be used in the method. The invention provides a method for producing a Ga-containing nitride single crystal by an ammonothermal method, comprising introducing at least a starting material, an acidic mineralizer and ammonia into an autoclave, and then growing a Ga-containing nitride single crystal under conditions wherein the temperature (T1) at the single crystal growth site is 600° C. to 850° C., the temperature (T1) at the single crystal growth site and the temperature (T2) at the starting material feeder site are in the relationship T1>T2, and the pressure in the autoclave is 40 MPa to 250 MPa, as well as an autoclave that can be used in the method.

Abstract: A cooling plate structure of a cooling apparatus includes a cooling plate and at least one refrigerant circulating conduit disposed in the cooling plate. The conduit includes refrigerant introducing and discharging ports disposed side by side on an outer surface of the cooling plate in an exposed state, a flow-in part extending from the introducing port to an intermediate position between the introducing port and the discharging port in the cooling plate, and a flow-out part extending along the flow-in part from the intermediate position to the discharging port such that flow-out part is separated from the flow-in part. Heat generating elements are disposed along the circulating conduit at an intermediate portion between a flow-in part corresponding portion and a flow-out part corresponding portion, both corresponding to the flow-in part and flow-out part of the circulating conduit, on the outer surface of the cooling plate.

Abstract: A coolant circulating apparatus includes circulating pumps disposed in parallel to each other and each having inlet and discharge ports and discharging coolant flowing into the inlet port from the discharge port, a coolant selectively introducing unit connected to the inlet ports of the pumps and selectively introducing the coolant into the inlet ports of the pumps, check valves connected to the discharge ports of the pumps. Branched coolant supply pipes extend horizontally or downwardly from the check valves and have extending ends at which the branched pipes are integrated with each other. An integrated coolant supply pipe extends upward from the integrated extending ends of the branched pipes. And, a coolant discharge pipe with an on-off valve extends horizontally or downwardly from the integrated extending ends of the branched pipes.

Abstract: A cooling plate structure of a cooling apparatus includes a cooling plate and at least one refrigerant circulating conduit disposed in the cooling plate. The conduit includes refrigerant introducing and discharging ports disposed side by side on an outer surface of the cooling plate in an exposed state, a flow-in part extending from the introducing port to an intermediate position between the introducing port and the discharging port in the cooling plate, and a flow-out part extending along the flow-in part from the intermediate position to the discharging port such that flow-out part is separated from the flow-in part. Heat generating elements are disposed along the circulating conduit at an intermediate portion between a flow-in part corresponding portion and a flow-out part corresponding portion, both corresponding to the flow-in part and flow-out part of the circulating conduit, on the outer surface of the cooling plate.