Patents by Inventor Kensuke IWAKI

Kensuke IWAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11621482
    Abstract: A conductor ground plane provided on a dielectric substrate and provided with a patch antenna and a conductor ground plane provided on the side of a dielectric substrate having a through hole are bonded by solder in a state where the through hole and the patch antenna are arranged to face each other, and a conductor ground plane provided on the back side of the dielectric substrate and a conductor ground plane provided on a dielectric substrate are bonded by solder.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: April 4, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kei Yokokawa, Narihiro Nakamoto, Toru Fukasawa, Hitoshi Arai, Tomohiro Takahashi, Kensuke Iwaki, Takamichi Kono, Keisuke Fujiwara
  • Publication number: 20220209402
    Abstract: A conductor ground plane provided on a dielectric substrate and provided with a patch antenna and a conductor ground plane provided on the side of a dielectric substrate having a through hole are bonded by solder in a state where the through hole and the patch antenna are arranged to face each other, and a conductor ground plane provided on the back side of the dielectric substrate and a conductor ground plane provided on a dielectric substrate are bonded by solder.
    Type: Application
    Filed: June 24, 2019
    Publication date: June 30, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kei YOKOKAWA, Narihiro NAKAMOTO, Toru FUKASAWA, Hitoshi ARAI, Tomohiro TAKAHASHI, Kensuke IWAKI, Takamichi KONO, Keisuke FUJIWARA