Patents by Inventor Kensuke KAMOSHIDA

Kensuke KAMOSHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210340377
    Abstract: A thermoplastic resin composition containing 3 to 10 parts by mass of a modified polyolefin (B) having a melt flow rate (MFR) at a temperature of 240° C. and under a load of 2.16 kg of 0.1 to 0.6 g/10 min, relative to 100 parts by mass of a thermoplastic resin (A) having a melting point of 270° C. or higher therein. Preferably, the modified polyolefin (B) has a 1% decomposition temperature of 300 to 450° C. Preferably, the thermoplastic resin (A) is a polyamide resin.
    Type: Application
    Filed: September 4, 2019
    Publication date: November 4, 2021
    Applicant: KURARAY CO., LTD.
    Inventors: Nobuhiro OYA, Kensuke KAMOSHIDA, Atsushi NANYA
  • Patent number: 10995197
    Abstract: Provided are a polyamide resin composition prepared by blending a polyamide resin (A) and a polyalcohol (B), wherein the proportion of the number of the amide groups to the number of the carbon atoms in the polyamide resin (A) is 0.080 to 0.140 and the blending amount of the polyalcohol (B) is 1 to 10 parts by mass relative to 100 parts by mass of the polyamide resin (A); and a molded article of the resin composition.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: May 4, 2021
    Assignee: KURARAY CO., LTD.
    Inventors: Kensuke Kamoshida, Hideaki Takeda, Go Tazaki
  • Publication number: 20180009965
    Abstract: Provided are a polyamide resin composition prepared by blending a polyamide resin (A) and a polyalcohol (B), wherein the proportion of the number of the amide groups to the number of the carbon atoms in the polyamide resin (A) is 0.080 to 0.140 and the blending amount of the polyalcohol (B) is 1 to 10 parts by mass relative to 100 parts by mass of the polyamide resin (A); and a molded article of the resin composition.
    Type: Application
    Filed: December 16, 2015
    Publication date: January 11, 2018
    Applicant: KURARAY CO., LTD.
    Inventors: Kensuke KAMOSHIDA, Hideaki TAKEDA, Go TAZAKI