Patents by Inventor Kensuke Matsuzawa
Kensuke Matsuzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250246523Abstract: A semiconductor device includes: a semiconductor chip; a sealing resin provided to seal the semiconductor chip; a first terminal extending from the sealing resin in a first direction so as to have a first connection part projecting to an outside of the sealing resin; and a second terminal extending from the sealing resin in the first direction so as to have a second connection part projecting to the outside of the sealing resin, wherein the first terminal and the second terminal have rectangular opposed parts separately opposed to each other between the first connection part and the second connection part, and the respective opposed parts have a width in a range of 1 millimeter or greater and 13 millimeters or smaller in a second direction perpendicular to the first direction.Type: ApplicationFiled: November 27, 2024Publication date: July 31, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventor: Kensuke MATSUZAWA
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Publication number: 20250157892Abstract: A semiconductor device includes: a conductive substrate; a plurality of semiconductor chips provided on the conductive substrate; a printed wiring board including a first conductive layer provided on the conductive substrate, an insulating layer provided on the first conductive layer, and a second conductive layer provided on the insulating layer and electrically connected to respective first electrodes of the semiconductor chips; and a first external terminal provided on the second conductive layer to extend upward from the second conductive layer.Type: ApplicationFiled: September 27, 2024Publication date: May 15, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventors: Takahiro KOYAMA, Kensuke MATSUZAWA, Taisuke FUKUDA, Daisuke INOUE
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Patent number: 12249556Abstract: A cooler includes a top plate, one surface of which serves as a heat dissipation surface, a bottom plate disposed so as to face the top plate and having a larger thickness than that of the top plate, a plurality of fins provided between the top plate and the bottom plate, and a circumferential wall part provided so as to surround the plurality of fins along outer circumferential edges of the bottom plate. The plurality of fins and the outer circumferential wall part are provided between the top plate and the bottom plate and bonded to the heat dissipation surface of the top plate. A flow path for a coolant is formed by a space enclosed by the top plate, the bottom plate, the plurality of fins, and the circumferential wall part. The top plate has an electric potential higher than that of the bottom plate.Type: GrantFiled: October 29, 2021Date of Patent: March 11, 2025Assignee: FUJI ELECTRIC CO., LTD.Inventors: Kensuke Matsuzawa, Takahiro Koyama, Hiromichi Gohara
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Publication number: 20250014981Abstract: A semiconductor device includes: an insulated circuit substrate including an insulating plate and a conductive plate provided on a top surface side of the insulating plate; a semiconductor chip provided on a top surface side of the conductive plate; a first external terminal electrically connected to the semiconductor chip; a first insulating member including a covering part covering a part of the first external terminal and a first engagement part provided on a top surface side of the covering part; a second external terminal provided on a top surface side of the first external terminal with the covering part interposed, and including a second engagement part so as to engage with the first engagement part; and a sealing resin provided to seal the semiconductor chip and partly seal each of the first external terminal, the first insulating member, and the second external terminal.Type: ApplicationFiled: May 28, 2024Publication date: January 9, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventor: Kensuke MATSUZAWA
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Publication number: 20240170376Abstract: A semiconductor device includes: a conductive substrate; a plurality of semiconductor chips each having a first main electrode on a bottom surface side and a second main electrode on a top surface side, the plural semiconductor chips being arranged to form a first column and a second column connected parallel to each other on the conductive substrate; and a control wiring substrate including an insulating layer, a plurality of top-surface conductive layers provided on a top surface of the insulating layer, and a plurality of bottom-surface conductive layers each having a narrower width than the insulating layer and provided on a bottom surface of the insulating layer, the bottom-surface conductive layers being arranged on the conductive substrate between the first column and the second column of the semiconductor chips.Type: ApplicationFiled: October 26, 2023Publication date: May 23, 2024Applicant: FUJI ELECTRIC CO., LTD.Inventors: Kensuke MATSUZAWA, Taisuke FUKUDA
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Patent number: 11664296Abstract: Provided is a semiconductor module including semiconductor devices and a cooling apparatus, wherein the semiconductor device has semiconductor chips and a circuit board with the semiconductor chips implemented thereon; the cooling apparatus has a top plate, a side wall, a bottom plate, a coolant flow portion, an inlet, an outlet and a plurality of fins; the top plate and the bottom plate have three through holes that are through holes for inserting fastening members that fasten the semiconductor module to an external apparatus, penetrating the top plate and the bottom plate in one direction respectively; and a geometric center of gravity of a aperture of at least one of the inlet and the outlet may also be positioned inside a virtual triangle with the three through holes being vertexes in planar view.Type: GrantFiled: February 24, 2021Date of Patent: May 30, 2023Assignee: FUJI ELECTRIC CO., LTD.Inventors: Kensuke Matsuzawa, Takahiro Koyama, Hiromichi Gohara
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Publication number: 20220173013Abstract: A cooler includes a top plate, one surface of which serves as a heat dissipation surface, a bottom plate disposed so as to face the top plate and having a larger thickness than that of the top plate, a plurality of fins provided between the top plate and the bottom plate, and a circumferential wall part provided so as to surround the plurality of fins along outer circumferential edges of the bottom plate. The plurality of fins and the outer circumferential wall part are provided between the top plate and the bottom plate and bonded to the heat dissipation surface of the top plate. A flow path for a coolant is formed by a space enclosed by the top plate, the bottom plate, the plurality of fins, and the circumferential wall part. The top plate has an electric potential higher than that of the bottom plate.Type: ApplicationFiled: October 29, 2021Publication date: June 2, 2022Applicant: FUJI ELECTRIC CO., LTD.Inventors: Kensuke MATSUZAWA, Takahiro KOYAMA, Hiromichi GOHARA
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Publication number: 20210313249Abstract: Provided is a semiconductor module including semiconductor devices and a cooling apparatus, wherein the semiconductor device has semiconductor chips and a circuit board with the semiconductor chips implemented thereon; the cooling apparatus has a top plate, a side wall, a bottom plate, a coolant flow portion, an inlet, an outlet and a plurality of fins; the top plate and the bottom plate have three through holes that are through holes for inserting fastening members that fasten the semiconductor module to an external apparatus, penetrating the top plate and the bottom plate in one direction respectively; and a geometric center of gravity of a aperture of at least one of the inlet and the outlet may also be positioned inside a virtual triangle with the three through holes being vertexes in planar view.Type: ApplicationFiled: February 24, 2021Publication date: October 7, 2021Inventors: Kensuke MATSUZAWA, Takahiro KOYAMA, Hiromichi GOHARA
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Patent number: 9618843Abstract: A resist composition including: a base component (A) that exhibits changed solubility in a developing solution by action of acid; and an acid generator component (B) that generates acid upon exposure, wherein the base component (A) includes a resin component (A1) containing a structural unit (a0) represented by general formula (a0-1) shown below or general formula (a0-2) shown below; and the acid generator component (B) includes an acid generator (B1) including a compound represented by general formula (b0-1) or (b0-2) shown below.Type: GrantFiled: March 19, 2012Date of Patent: April 11, 2017Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Jun Iwashita, Kensuke Matsuzawa
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Patent number: 9104101Abstract: A resist composition including a resin component which generates acid upon exposure and exhibits changed solubility in a developing solution under the action of acid, the resin component including a resin component having a structural unit represented by a general formula (a0-0-1) shown below in which R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms, R0-1 represents a single bond or a divalent linking group, each of R2, R3 and R4 independently represents a linear, branched or cyclic alkyl group which may have a non-aromatic substituent, or R3 and R4 may be bonded to each other to form a ring together with the sulfur atom, and X represents a non-aromatic divalent linking group or a single bond.Type: GrantFiled: February 22, 2012Date of Patent: August 11, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Kensuke Matsuzawa, Jun Iwashita, Yoshitaka Komuro, Masatoshi Arai
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Patent number: 9040220Abstract: A resist composition including a base component which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component which generates acid upon exposure, the acid-generator including an acid generator consisting of a compound represented by general formula (b1-1) shown below: In which RX represents a hydrocarbon group which may have a substituent exclusive of a nitrogen atom; each of Q2 and Q3 independently represents a single bond or a divalent linkage group; Y1 represents an alkylene group or fluorinated alkyl group of 1 to 4 carbon atoms; and Z+ represents an organic cation exclusive of an ion represented by general formula (w-1).Type: GrantFiled: March 2, 2012Date of Patent: May 26, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Hideo Hada, Yoshiyuki Utsumi, Keita Ishiduka, Kensuke Matsuzawa, Fumitake Kaneko, Kyoko Ohshita, Hiroaki Shimizu, Yasuhiro Yoshii
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Patent number: 9034556Abstract: A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) consisting of a compound represented by general formula (b1-1) shown below: wherein RX represents a hydrocarbon group which may have a substituent exclusive of a nitrogen atom; each of Q2 and Q3 independently represents a single bond or a divalent linkage group; Y1 represents an alkylene group or fluorinated alkyl group of 1 to 4 carbon atoms; and Z+ represents an organic cation exclusive of an ion represented by general formula (w-1).Type: GrantFiled: December 18, 2008Date of Patent: May 19, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Hideo Hada, Yoshiyuki Utsumi, Keita Ishiduka, Kensuke Matsuzawa, Fumitake Kaneko, Kyoko Ohshita, Hiroaki Shimizu, Yasuhiro Yoshii
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Patent number: 8956801Abstract: A resist composition including a base component which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, and an organic solvent component, the base component containing a resin component having a structural unit which generates acid, and the organic solvent component containing an organic solvent component including a compound represented by general formula (s-1) shown below in which X represents a single bond or an alkylene group of 1 to 3 carbon atoms; and n represents an integer of 0 to 3.Type: GrantFiled: February 14, 2013Date of Patent: February 17, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventor: Kensuke Matsuzawa
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Patent number: 8795948Abstract: A resist composition including a base component (A) which generates acid upon exposure and exhibits changed solubility in a developing solution under the action of acid, the base component (A) containing a polymeric compound (A1) including a structural unit (a0) represented by general formula (a0-1) shown below, a structural unit (a1) containing an acid decomposable group which exhibits increased polarity by the action of acid and a structural unit (a6) which generates acid upon exposure (wherein R1 represents a hydrogen atom, an alkyl group or a halogenated alkyl group; W represents —COO—, —CONH— or a divalent aromatic hydrocarbon group; Y1 and Y2 represents a divalent linking group or a single bond; R?1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms; R?2 represents a monovalent aliphatic hydrocarbon group; and R2 represents an —SO2— containing cyclic group).Type: GrantFiled: March 19, 2013Date of Patent: August 5, 2014Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takahiro Dazai, Yoshiyuki Utsume, Jun Iwashita, Kensuke Matsuzawa, Kenri Konno
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Publication number: 20130252180Abstract: A resist composition including a base component (A) which generates acid upon exposure and exhibits changed solubility in a developing solution under the action of acid, the base component (A) containing a polymeric compound (A1) including a structural unit (a0) represented by general formula (a0-1) shown below, a structural unit (a1) containing an acid decomposable group which exhibits increased polarity by the action of acid and a structural unit (a6) which generates acid upon exposure (wherein R1 represents a hydrogen atom, an alkyl group or a halogenated alkyl group; W represents —COO—, —CONH— or a divalent aromatic hydrocarbon group; Y1 and Y2 represents a divalent linking group or a single bond; represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms; R?2 represents a monovalent aliphatic hydrocarbon group; and R2 represents an —SO2— containing cyclic group).Type: ApplicationFiled: March 19, 2013Publication date: September 26, 2013Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takahiro Dazai, Yoshiyuki Utsumi, Jun Iwashita, Kensuke Matsuzawa, Kenri Konno
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Patent number: 8367299Abstract: A resist composition including: a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid; and an acid-generator component (B) which generates acid upon exposure, wherein said acid-generator component (B) comprises an acid generator (B1) including a compound represented by general formula (b1-11) shown below: wherein R7? to R9? each independently represent an aryl group or an alkyl group, wherein two of R7? to R9? may be bonded to each other to form a ring with the sulfur atom, and at least one of R7? to R9? represents a substituted aryl group having a group represented by general formula (I) shown below as a substituent; X? represents an anion; and Rf represents a fluorinated alkyl group.Type: GrantFiled: September 15, 2011Date of Patent: February 5, 2013Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akiya Kawaue, Yoshiyuki Utsumi, Takehiro Seshimo, Tsuyoshi Nakamura, Naoto Motoike, Hiroaki Shimizu, Kensuke Matsuzawa, Hideo Hada
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Patent number: 8338076Abstract: A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) containing a compound having a cation moiety comprising a group represented by general formula (I) (in the formula, R5 represents an organic group having a carbonyl group, an ester bond or a sulfonyl group; and Q represents a divalent linking group).Type: GrantFiled: November 25, 2009Date of Patent: December 25, 2012Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akiya Kawaue, Yoshiyuki Utsumi, Hideo Hada, Takehiro Seshimo, Kensuke Matsuzawa, Keita Ishiduka, Kotaro Endo
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Publication number: 20120282551Abstract: A resist composition including a resin component which generates acid upon exposure and exhibits changed solubility in a developing solution under the action of acid, the resin component including a resin component having a structural unit represented by a general formula (a0-0-1) shown below in which R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms, R0-1 represents a single bond or a divalent linking group, each of R2, R3 and R4 independently represents a linear, branched or cyclic alkyl group which may have a non-aromatic substituent, or R3 and R4 may be bonded to each other to form a ring together with the sulfur atom, and X represents a non-aromatic divalent linking group or a single bond.Type: ApplicationFiled: February 22, 2012Publication date: November 8, 2012Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Kensuke MATSUZAWA, Jun IWASHITA, Yoshitaka KOMURO, Masatoshi ARAI
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Publication number: 20120251951Abstract: A resist composition including: a base component (A) that exhibits changed solubility in a developing solution by action of acid; and an acid generator component (B) that generates acid upon exposure, wherein the base component (A) includes a resin component (A1) containing a structural unit (a0) represented by general formula (a0-1) shown below or general formula (a0-2) shown below; and the acid generator component (B) includes an acid generator (B1) including a compound represented by general formula (b0-1) or (b0-2) shown below:Type: ApplicationFiled: March 19, 2012Publication date: October 4, 2012Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Jun Iwashita, Kensuke Matsuzawa
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Patent number: 8252505Abstract: A resist composition including a base component (A) that exhibits changed solubility in an alkali developing solution under the action of acid, and an acid generator component (B) that generates acid upon exposure, wherein the acid generator component (B) includes an acid generator (B1) consisting of a compound represented by general formula (b1-2) shown below: [Chemical Formula 1] A+Z???(b1-2) wherein A+ represents an organic cation; and Z? represents an anionic cyclic group, wherein the cyclic group includes an ester linkage within the ring structure, two mutually different groups are bonded to the ring structure, one of these groups includes an ester linkage in which a carbon atom that constitutes part of the ester linkage is bonded directly to the ring structure, and the other group includes an anion moiety.Type: GrantFiled: February 16, 2009Date of Patent: August 28, 2012Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akiya Kawaue, Keita Ishiduka, Kensuke Matsuzawa, Yoshiyuki Utsumi, Hiroaki Shimizu