Patents by Inventor Kensuke MIKADO

Kensuke MIKADO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 10312171
    Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: June 4, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Kensuke Mikado, Makoto Shibuya, Yasufumi Matsuoka
  • SEMICONDUCTOR DEVICE
    Publication number: 20180096908
    Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.
    Type: Application
    Filed: November 30, 2017
    Publication date: April 5, 2018
    Inventors: Kensuke MIKADO, Makoto SHIBUYA, Yasufumi MATSUOKA
  • Semiconductor device
    Patent number: 9859182
    Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: January 2, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Kensuke Mikado, Makoto Shibuya, Yasufumi Matsuoka
  • SEMICONDUCTOR DEVICE
    Publication number: 20170011978
    Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.
    Type: Application
    Filed: September 19, 2016
    Publication date: January 12, 2017
    Inventors: Kensuke MIKADO, Makoto SHIBUYA, Yasufumi MATSUOKA
  • Semiconductor device
    Patent number: 9490194
    Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: November 8, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Kensuke Mikado, Makoto Shibuya, Yasufumi Matsuoka
  • SEMICONDUCTOR DEVICE
    Publication number: 20160086877
    Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.
    Type: Application
    Filed: December 3, 2015
    Publication date: March 24, 2016
    Inventors: Kensuke MIKADO, Makoto SHIBUYA, Yasufumi MATSUOKA
  • Semiconductor device
    Patent number: 9236317
    Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: January 12, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Kensuke Mikado, Makoto Shibuya, Yasufumi Matsuoka
  • SEMICONDUCTOR DEVICE
    Publication number: 20140306328
    Abstract: The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.
    Type: Application
    Filed: April 15, 2014
    Publication date: October 16, 2014
    Applicant: ROHM CO., LTD.
    Inventors: Kensuke MIKADO, Makoto SHIBUYA, Yasufumi MATSUOKA