Patents by Inventor Kensuke Nagata
Kensuke Nagata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11967634Abstract: A semiconductor device includes a semiconductor element. The semiconductor element has a semiconductor layer, a first-conductivity-type layer, a saturation current suppression layer, a current dispersion layer, a base region, a source region, trench gate structures, an interlayer insulation film, a source electrode, a drain electrode, and a second deep layer. The first-conductivity-type layer is disposed above the semiconductor layer. The saturation current suppression layer disposed above the first-conductivity-type layer includes a first deep layer and a JEFT portion. The base region is disposed above the saturation current suppression layer. The source region and the contact region are disposed above the region. Each of the trench gate structures has a gate trench, a gate insulation film, and a gate electrode. The second deep layer is disposed among the trench gate structures and is connected to the first deep layer.Type: GrantFiled: May 25, 2022Date of Patent: April 23, 2024Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, MIRISE Technologies CorporationInventors: Kensuke Nagata, Yohei Iwahashi, Ryota Suzuki, Katsuhiko Hamasaki
-
Publication number: 20220384621Abstract: A semiconductor device includes a semiconductor element. The semiconductor element has a semiconductor layer, a first-conductivity-type layer, a saturation current suppression layer, a current dispersion layer, a base region, a source region, trench gate structures, an interlayer insulation film, a source electrode, a drain electrode, and a second deep layer. The first-conductivity-type layer is disposed above the semiconductor layer. The saturation current suppression layer disposed above the first-conductivity-type layer includes a first deep layer and a JEFT portion. The base region is disposed above the saturation current suppression layer. The source region and the contact region are disposed above the region. Each of the trench gate structures has a gate trench, a gate insulation film, and a gate electrode. The second deep layer is disposed among the trench gate structures and is connected to the first deep layer.Type: ApplicationFiled: May 25, 2022Publication date: December 1, 2022Inventors: Kensuke NAGATA, Yohei IWAHASHI, Ryota SUZUKI, Katsuhiko HAMASAKI
-
Patent number: 11245063Abstract: A semiconductor device includes a semiconductor substrate, a polysilicon layer fixed to the semiconductor substrate, and a silicon nitride layer in contact with the polysilicon layer, wherein the polysilicon layer includes an n-type layer and a p-type layer in contact with the n-type layer; a semiconductor device manufacturing method includes forming the polysilicon layer covering at least one hydrogen-containing layer, and heating the polysilicon layer and the hydrogen-containing layer.Type: GrantFiled: February 13, 2019Date of Patent: February 8, 2022Assignee: DENSO CORPORATIONInventors: Kensuke Nagata, Katsutoshi Narita
-
Patent number: 11059281Abstract: A laminate material with a metal exposed portion is efficiently produced. A peeling step is performed in which a laser beam L is irradiated on a resin layer 17, 18 of a laminate raw material 10 in which a resin layer 17, 18 is laminated on at least one surface of a metal foil 11 to peel the resin layer 17, 18 and the metal foil 11 to thereby form a peeled portion 21, 22. Thereafter, the resin layers 17 and 18 corresponding to the peeled portions 21 and 22 are cut off to expose the metal foil 11.Type: GrantFiled: May 30, 2017Date of Patent: July 13, 2021Assignee: SHOWA DENKO PACKAGING CO., LTD.Inventors: Kensuke Nagata, Tsutomu Ganse
-
Patent number: 10756313Abstract: A power storage device includes a positive electrode part including a first metallic foil layer and a positive electrode active material layer partially laminated on one surface of the first metallic foil layer, a negative electrode part including a second metallic foil layer and a negative electrode active material layer partially laminated on one surface of the second metallic foil layer, and a separator arranged between the positive electrode part and the negative electrode part. The positive electrode active material layer is arranged between the first metallic foil layer and the separator, and the negative electrode active material layer is arranged between the second metallic foil layer and the separator. The peripheral regions of the one surfaces of the first and second metallic foil layers in which the positive and negative electrode active material layers are not formed are joined via a peripheral sealing layer containing a thermoplastic resin.Type: GrantFiled: July 12, 2018Date of Patent: August 25, 2020Assignee: SHOWA DENKO PACKAGING CO., LTD.Inventors: Koji Minamitani, Yuji Minamibori, Kensuke Nagata, Shunsuke Saito
-
Patent number: 10608211Abstract: An outer casing material for a battery 4 is provided, wherein an outer layer 11, a metal foil layer 10 and an inner layer 8 are laminated via an adhesive layer 5; the inner layer 8 comprises a sealant layer 8b and a base material layer 8a; the sealant layer 8b is made from a propylene-ethylene random copolymer wherein a melt flow rate at 230° C. thereof is in a range of 3 to 30 g/10 minutes; the base material layer 8a is made of a resin composition wherein a melt flow rate at 230° C. thereof is in a range of 0.1 to 15 g/10 minutes, xylene-soluble component Xs thereof satisfies the predetermined conditions, and the resin composition comprises 50 to 80% by mass of a propylene component (A) and 50 to 20% by mass of a copolymer component (B) which is an elastomer of a copolymer of propylene and ethylene and/or ?-olefin having 4 to 12 carbons and includes 50 to 85% by mass of a polymerization unit originated from propylene.Type: GrantFiled: January 30, 2013Date of Patent: March 31, 2020Assignee: SHOWA DENKO PACKAGING CO., LTD.Inventors: Makoto Karatsu, Kensuke Nagata, Tetsunobu Kuramoto
-
Publication number: 20200052342Abstract: A lithium-ion rechargeable battery (1) provided with: a battery unit (100) including a metal substrate (10) and a battery part (20) configured by laminating thin films on the substrate (10); and a shell (200) provided on the surface of the substrate (10), on which the battery part (20) is formed, to seal the substrate (10) and the battery unit (100). The shell (200) includes a laminated film (30) formed by laminating a metal layer (33) and various types of resin layers. Consequently, the thickness of the thin-film type lithium-ion rechargeable battery including a solid electrolyte is reduced.Type: ApplicationFiled: January 31, 2018Publication date: February 13, 2020Applicants: SHOWA DENKO K.K., SHOWA DENKO PACKAGING CO., LTD.Inventors: Takaki YASUDA, Isao KABE, Koji MINAMITANI, Kensuke NAGATA
-
Patent number: 10559809Abstract: A first packaging material, a second packaging material, an electrode body having a positive electrode, a negative electrode, and a separator are provided. A packaging member is formed having an electrode body chamber. A first inner conducting portion allows conduction to a first metal foil and a second inner conducting portion allows conduction to a second metal foil. In the electrode body chamber, electrode body is conducted to a first inner conducting portion in the positive electrode and the electrode body is conducted to a second inner conducting portion in the negative electrode. At least one of the pair of the first metal foil and the positive electrode current collector of the positive electrode and the pair of the second metal foil and the negative electrode current collector of the negative electrode is made of the same metal.Type: GrantFiled: September 8, 2016Date of Patent: February 11, 2020Assignee: SHOWA DENKO PACKAGING CO., LTD.Inventors: Kensuke Nagata, Koji Minamitani
-
Publication number: 20190214611Abstract: Provided is a laminate material capable of easily forming a metal exposed portion. The laminate material 1 is a laminate material formed by bonding and laminating a resin layer 17, 18 on at least one surface of a metal foil 11. A recess 27, 28 in which a foil thickness of the metal foil 11 is reduced is formed on a part of a bonding surface of the metal foil. A peeled portion 21, 22 where the resin layer 17, 18 corresponding to the recess 27, 28 has been peeled from the metal foil 11 is formed.Type: ApplicationFiled: May 30, 2017Publication date: July 11, 2019Applicant: SHOWA DENKO PACKAGING CO., LTD.Inventors: Kensuke NAGATA, Tsutomu GANSE
-
Publication number: 20190181324Abstract: A semiconductor device includes a semiconductor substrate, a polysilicon layer fixed to the semiconductor substrate, and a silicon nitride layer in contact with the polysilicon layer, wherein the polysilicon layer includes a n-type layer and a p-type layer in contact with the n-type layer.Type: ApplicationFiled: February 13, 2019Publication date: June 13, 2019Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Kensuke NAGATA, Katsutoshi NARITA
-
Publication number: 20190176457Abstract: A laminate material with a metal exposed portion is efficiently produced. A peeling step is performed in which a laser beam L is irradiated on a resin layer 17, 18 of a laminate raw material 10 in which a resin layer 17, 18 is laminated on at least one surface of a metal foil 11 to peel the resin layer 17, 18 and the metal foil 11 to thereby form a peeled portion 21, 22. Thereafter, the resin layers 17 and 18 corresponding to the peeled portions 21 and 22 are cut off to expose the metal foil 11.Type: ApplicationFiled: May 30, 2017Publication date: June 13, 2019Applicant: SHOWA DENKO PACKAGING CO., LTD.Inventors: Kensuke NAGATA, Tsutomu GANSE
-
Patent number: 10243131Abstract: A semiconductor device includes a semiconductor substrate, a polysilicon layer fixed to the semiconductor substrate, and a silicon nitride layer in contact with the polysilicon layer, wherein the polysilicon layer includes a n-type layer and a p-type layer in contact with the n-type layer. The semiconductor device manufacturing method includes forming the polysilicon layer covering at least one hydrogen-containing layer, and heating the polysilicon layer and the hydrogen-containing layer.Type: GrantFiled: July 10, 2017Date of Patent: March 26, 2019Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Kensuke Nagata, Katsutoshi Narita
-
Publication number: 20180323410Abstract: A power storage device includes a positive electrode part including a first metallic foil layer and a positive electrode active material layer partially laminated on one surface of the first metallic foil layer, a negative electrode part including a second metallic foil layer and a negative electrode active material layer partially laminated on one surface of the second metallic foil layer, and a separator arranged between the positive electrode part and the negative electrode part. The positive electrode active material layer is arranged between the first metallic foil layer and the separator, and the negative electrode active material layer is arranged between the second metallic foil layer and the separator. The peripheral regions of the one surfaces of the first and second metallic foil layers in which the positive and negative electrode active material layers are not formed are joined via a peripheral sealing layer containing a thermoplastic resin.Type: ApplicationFiled: July 12, 2018Publication date: November 8, 2018Inventors: Koji MINAMITANI, Yuji MINAMIBORI, Kensuke NAGATA, Shunsuke SAITO
-
Publication number: 20180294473Abstract: A first packaging material, a second packaging material, an electrode body having a positive electrode, a negative electrode, and a separator are provided. A packaging member is formed having an electrode body chamber. A first inner conducting portion allows conduction to a first metal foil and a second inner conducting portion allows conduction to a second metal foil. In the electrode body chamber, electrode body is conducted to a first inner conducting portion in the positive electrode and the electrode body is conducted to a second inner conducting portion in the negative electrode. At least one of the pair of the first metal foil and the positive electrode current collector of the positive electrode and the pair of the second metal foil and the negative electrode current collector of the negative electrode is made of the same metal.Type: ApplicationFiled: September 8, 2016Publication date: October 11, 2018Applicant: SHOWA DENKO PACKAGING CO., LTD.Inventors: Kensuke NAGATA, Koji MINAMITANI
-
Patent number: 10079374Abstract: A power storage device includes a positive electrode part including a first metallic foil layer and a positive electrode active material layer partially laminated on one surface of the first metallic foil layer, a negative electrode part including a second metallic foil layer and a negative electrode active material layer partially laminated on one surface of the second metallic foil layer, and a separator arranged between the positive electrode part and the negative electrode part. The positive electrode active material layer is arranged between the first metallic foil layer and the separator, and the negative electrode active material layer is arranged between the second metallic foil layer and the separator. The peripheral regions of the one surfaces of the first and second metallic foil layers in which the positive and negative electrode active material layers are not formed are joined via a peripheral sealing layer containing a thermoplastic resin.Type: GrantFiled: August 18, 2015Date of Patent: September 18, 2018Assignee: SHOWA DENKO PACKAGING CO., LTD.Inventors: Koji Minamitani, Yuji Minamibori, Kensuke Nagata, Shunsuke Saito
-
Publication number: 20180033943Abstract: A semiconductor device includes a semiconductor substrate, a polysilicon layer fixed to the semiconductor substrate, and a silicon nitride layer in contact with the polysilicon layer, wherein the polysilicon layer includes a n-type layer and a p-type layer in contact with the n-type layer.Type: ApplicationFiled: July 10, 2017Publication date: February 1, 2018Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Kensuke NAGATA, Katsutoshi NARITA
-
Patent number: 9450215Abstract: An outer casing material for a battery is provided which is constituted by laminating an outer layer that includes a heat-resistant resin film, a metal foil layer, and an inner layer that includes a thermoplastic resin film, wherein a melt flow rate of the inner layer is in a range of greater than or equal to 1 and less than 10.Type: GrantFiled: August 31, 2012Date of Patent: September 20, 2016Assignee: Showa Denko Packaging Co., Ltd.Inventor: Kensuke Nagata
-
Publication number: 20160049625Abstract: A power storage device includes a positive electrode part including a first metallic foil layer and a positive electrode active material layer partially laminated on one surface of the first metallic foil layer, a negative electrode part including a second metallic foil layer and a negative electrode active material layer partially laminated on one surface of the second metallic foil layer, and a separator arranged between the positive electrode part and the negative electrode part. The positive electrode active material layer is arranged between the first metallic foil layer and the separator, and the negative electrode active material layer is arranged between the second metallic foil layer and the separator. The peripheral regions of the one surfaces of the first and second metallic foil layers in which the positive and negative electrode active material layers are not formed are joined via a peripheral sealing layer containing a thermoplastic resin.Type: ApplicationFiled: August 18, 2015Publication date: February 18, 2016Inventors: Koji MINAMITANI, Yuji MINAMIBORI, Kensuke NAGATA, Shunsuke SAITO
-
Patent number: 9257733Abstract: Provided is an oxygen permeable membrane for use in an air secondary battery, which excels in oxygen permeability, barrier performance to water, being capable of preventing electrolyte from leaking out. Such an oxygen permeable membrane includes a thermoplastic resin membrane and inorganic particles having pores having pore diameter of 10 ? or less contained in the thermoplastic resin membrane, in which the thermoplastic resin membrane has one surface on which hydrophobic treatment is effected.Type: GrantFiled: December 12, 2013Date of Patent: February 9, 2016Assignee: SHOWA DENKO PACKAGING CO., LTD.Inventor: Kensuke Nagata
-
Patent number: 9011888Abstract: Organic-inorganic composite particles includes inorganic oxide particles each of which has a cationic charge on the particle surface and polymer gel molecules which are derived from a natural substance, have an anionic functional group and one or more hydroxyl groups in a molecule and have both a shrinking and a swelling property, the polymer gel molecules are electrostatically bonded to surfaces of the inorganic oxide particles; a process for producing the particles; a dispersion containing the particles; and a cosmetic containing the particles. These organic-inorganic composite particles have good dispersibility not only in aqueous solvents such as water but also in non-aqueous solvents and further have characteristics that aggregation of the particles scarcely occurs.Type: GrantFiled: July 30, 2010Date of Patent: April 21, 2015Assignee: JGC Catalysts and Chemicals Ltd.Inventors: Kensuke Nagata, Michio Komatsu