Patents by Inventor Kensuke Nagata

Kensuke Nagata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967634
    Abstract: A semiconductor device includes a semiconductor element. The semiconductor element has a semiconductor layer, a first-conductivity-type layer, a saturation current suppression layer, a current dispersion layer, a base region, a source region, trench gate structures, an interlayer insulation film, a source electrode, a drain electrode, and a second deep layer. The first-conductivity-type layer is disposed above the semiconductor layer. The saturation current suppression layer disposed above the first-conductivity-type layer includes a first deep layer and a JEFT portion. The base region is disposed above the saturation current suppression layer. The source region and the contact region are disposed above the region. Each of the trench gate structures has a gate trench, a gate insulation film, and a gate electrode. The second deep layer is disposed among the trench gate structures and is connected to the first deep layer.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: April 23, 2024
    Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, MIRISE Technologies Corporation
    Inventors: Kensuke Nagata, Yohei Iwahashi, Ryota Suzuki, Katsuhiko Hamasaki
  • Publication number: 20220384621
    Abstract: A semiconductor device includes a semiconductor element. The semiconductor element has a semiconductor layer, a first-conductivity-type layer, a saturation current suppression layer, a current dispersion layer, a base region, a source region, trench gate structures, an interlayer insulation film, a source electrode, a drain electrode, and a second deep layer. The first-conductivity-type layer is disposed above the semiconductor layer. The saturation current suppression layer disposed above the first-conductivity-type layer includes a first deep layer and a JEFT portion. The base region is disposed above the saturation current suppression layer. The source region and the contact region are disposed above the region. Each of the trench gate structures has a gate trench, a gate insulation film, and a gate electrode. The second deep layer is disposed among the trench gate structures and is connected to the first deep layer.
    Type: Application
    Filed: May 25, 2022
    Publication date: December 1, 2022
    Inventors: Kensuke NAGATA, Yohei IWAHASHI, Ryota SUZUKI, Katsuhiko HAMASAKI
  • Patent number: 11245063
    Abstract: A semiconductor device includes a semiconductor substrate, a polysilicon layer fixed to the semiconductor substrate, and a silicon nitride layer in contact with the polysilicon layer, wherein the polysilicon layer includes an n-type layer and a p-type layer in contact with the n-type layer; a semiconductor device manufacturing method includes forming the polysilicon layer covering at least one hydrogen-containing layer, and heating the polysilicon layer and the hydrogen-containing layer.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: February 8, 2022
    Assignee: DENSO CORPORATION
    Inventors: Kensuke Nagata, Katsutoshi Narita
  • Patent number: 11059281
    Abstract: A laminate material with a metal exposed portion is efficiently produced. A peeling step is performed in which a laser beam L is irradiated on a resin layer 17, 18 of a laminate raw material 10 in which a resin layer 17, 18 is laminated on at least one surface of a metal foil 11 to peel the resin layer 17, 18 and the metal foil 11 to thereby form a peeled portion 21, 22. Thereafter, the resin layers 17 and 18 corresponding to the peeled portions 21 and 22 are cut off to expose the metal foil 11.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: July 13, 2021
    Assignee: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Kensuke Nagata, Tsutomu Ganse
  • Patent number: 10756313
    Abstract: A power storage device includes a positive electrode part including a first metallic foil layer and a positive electrode active material layer partially laminated on one surface of the first metallic foil layer, a negative electrode part including a second metallic foil layer and a negative electrode active material layer partially laminated on one surface of the second metallic foil layer, and a separator arranged between the positive electrode part and the negative electrode part. The positive electrode active material layer is arranged between the first metallic foil layer and the separator, and the negative electrode active material layer is arranged between the second metallic foil layer and the separator. The peripheral regions of the one surfaces of the first and second metallic foil layers in which the positive and negative electrode active material layers are not formed are joined via a peripheral sealing layer containing a thermoplastic resin.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: August 25, 2020
    Assignee: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Koji Minamitani, Yuji Minamibori, Kensuke Nagata, Shunsuke Saito
  • Patent number: 10608211
    Abstract: An outer casing material for a battery 4 is provided, wherein an outer layer 11, a metal foil layer 10 and an inner layer 8 are laminated via an adhesive layer 5; the inner layer 8 comprises a sealant layer 8b and a base material layer 8a; the sealant layer 8b is made from a propylene-ethylene random copolymer wherein a melt flow rate at 230° C. thereof is in a range of 3 to 30 g/10 minutes; the base material layer 8a is made of a resin composition wherein a melt flow rate at 230° C. thereof is in a range of 0.1 to 15 g/10 minutes, xylene-soluble component Xs thereof satisfies the predetermined conditions, and the resin composition comprises 50 to 80% by mass of a propylene component (A) and 50 to 20% by mass of a copolymer component (B) which is an elastomer of a copolymer of propylene and ethylene and/or ?-olefin having 4 to 12 carbons and includes 50 to 85% by mass of a polymerization unit originated from propylene.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: March 31, 2020
    Assignee: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Makoto Karatsu, Kensuke Nagata, Tetsunobu Kuramoto
  • Publication number: 20200052342
    Abstract: A lithium-ion rechargeable battery (1) provided with: a battery unit (100) including a metal substrate (10) and a battery part (20) configured by laminating thin films on the substrate (10); and a shell (200) provided on the surface of the substrate (10), on which the battery part (20) is formed, to seal the substrate (10) and the battery unit (100). The shell (200) includes a laminated film (30) formed by laminating a metal layer (33) and various types of resin layers. Consequently, the thickness of the thin-film type lithium-ion rechargeable battery including a solid electrolyte is reduced.
    Type: Application
    Filed: January 31, 2018
    Publication date: February 13, 2020
    Applicants: SHOWA DENKO K.K., SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Takaki YASUDA, Isao KABE, Koji MINAMITANI, Kensuke NAGATA
  • Patent number: 10559809
    Abstract: A first packaging material, a second packaging material, an electrode body having a positive electrode, a negative electrode, and a separator are provided. A packaging member is formed having an electrode body chamber. A first inner conducting portion allows conduction to a first metal foil and a second inner conducting portion allows conduction to a second metal foil. In the electrode body chamber, electrode body is conducted to a first inner conducting portion in the positive electrode and the electrode body is conducted to a second inner conducting portion in the negative electrode. At least one of the pair of the first metal foil and the positive electrode current collector of the positive electrode and the pair of the second metal foil and the negative electrode current collector of the negative electrode is made of the same metal.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 11, 2020
    Assignee: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Kensuke Nagata, Koji Minamitani
  • Publication number: 20190214611
    Abstract: Provided is a laminate material capable of easily forming a metal exposed portion. The laminate material 1 is a laminate material formed by bonding and laminating a resin layer 17, 18 on at least one surface of a metal foil 11. A recess 27, 28 in which a foil thickness of the metal foil 11 is reduced is formed on a part of a bonding surface of the metal foil. A peeled portion 21, 22 where the resin layer 17, 18 corresponding to the recess 27, 28 has been peeled from the metal foil 11 is formed.
    Type: Application
    Filed: May 30, 2017
    Publication date: July 11, 2019
    Applicant: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Kensuke NAGATA, Tsutomu GANSE
  • Publication number: 20190181324
    Abstract: A semiconductor device includes a semiconductor substrate, a polysilicon layer fixed to the semiconductor substrate, and a silicon nitride layer in contact with the polysilicon layer, wherein the polysilicon layer includes a n-type layer and a p-type layer in contact with the n-type layer.
    Type: Application
    Filed: February 13, 2019
    Publication date: June 13, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kensuke NAGATA, Katsutoshi NARITA
  • Publication number: 20190176457
    Abstract: A laminate material with a metal exposed portion is efficiently produced. A peeling step is performed in which a laser beam L is irradiated on a resin layer 17, 18 of a laminate raw material 10 in which a resin layer 17, 18 is laminated on at least one surface of a metal foil 11 to peel the resin layer 17, 18 and the metal foil 11 to thereby form a peeled portion 21, 22. Thereafter, the resin layers 17 and 18 corresponding to the peeled portions 21 and 22 are cut off to expose the metal foil 11.
    Type: Application
    Filed: May 30, 2017
    Publication date: June 13, 2019
    Applicant: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Kensuke NAGATA, Tsutomu GANSE
  • Patent number: 10243131
    Abstract: A semiconductor device includes a semiconductor substrate, a polysilicon layer fixed to the semiconductor substrate, and a silicon nitride layer in contact with the polysilicon layer, wherein the polysilicon layer includes a n-type layer and a p-type layer in contact with the n-type layer. The semiconductor device manufacturing method includes forming the polysilicon layer covering at least one hydrogen-containing layer, and heating the polysilicon layer and the hydrogen-containing layer.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: March 26, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kensuke Nagata, Katsutoshi Narita
  • Publication number: 20180323410
    Abstract: A power storage device includes a positive electrode part including a first metallic foil layer and a positive electrode active material layer partially laminated on one surface of the first metallic foil layer, a negative electrode part including a second metallic foil layer and a negative electrode active material layer partially laminated on one surface of the second metallic foil layer, and a separator arranged between the positive electrode part and the negative electrode part. The positive electrode active material layer is arranged between the first metallic foil layer and the separator, and the negative electrode active material layer is arranged between the second metallic foil layer and the separator. The peripheral regions of the one surfaces of the first and second metallic foil layers in which the positive and negative electrode active material layers are not formed are joined via a peripheral sealing layer containing a thermoplastic resin.
    Type: Application
    Filed: July 12, 2018
    Publication date: November 8, 2018
    Inventors: Koji MINAMITANI, Yuji MINAMIBORI, Kensuke NAGATA, Shunsuke SAITO
  • Publication number: 20180294473
    Abstract: A first packaging material, a second packaging material, an electrode body having a positive electrode, a negative electrode, and a separator are provided. A packaging member is formed having an electrode body chamber. A first inner conducting portion allows conduction to a first metal foil and a second inner conducting portion allows conduction to a second metal foil. In the electrode body chamber, electrode body is conducted to a first inner conducting portion in the positive electrode and the electrode body is conducted to a second inner conducting portion in the negative electrode. At least one of the pair of the first metal foil and the positive electrode current collector of the positive electrode and the pair of the second metal foil and the negative electrode current collector of the negative electrode is made of the same metal.
    Type: Application
    Filed: September 8, 2016
    Publication date: October 11, 2018
    Applicant: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Kensuke NAGATA, Koji MINAMITANI
  • Patent number: 10079374
    Abstract: A power storage device includes a positive electrode part including a first metallic foil layer and a positive electrode active material layer partially laminated on one surface of the first metallic foil layer, a negative electrode part including a second metallic foil layer and a negative electrode active material layer partially laminated on one surface of the second metallic foil layer, and a separator arranged between the positive electrode part and the negative electrode part. The positive electrode active material layer is arranged between the first metallic foil layer and the separator, and the negative electrode active material layer is arranged between the second metallic foil layer and the separator. The peripheral regions of the one surfaces of the first and second metallic foil layers in which the positive and negative electrode active material layers are not formed are joined via a peripheral sealing layer containing a thermoplastic resin.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: September 18, 2018
    Assignee: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Koji Minamitani, Yuji Minamibori, Kensuke Nagata, Shunsuke Saito
  • Publication number: 20180033943
    Abstract: A semiconductor device includes a semiconductor substrate, a polysilicon layer fixed to the semiconductor substrate, and a silicon nitride layer in contact with the polysilicon layer, wherein the polysilicon layer includes a n-type layer and a p-type layer in contact with the n-type layer.
    Type: Application
    Filed: July 10, 2017
    Publication date: February 1, 2018
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kensuke NAGATA, Katsutoshi NARITA
  • Patent number: 9450215
    Abstract: An outer casing material for a battery is provided which is constituted by laminating an outer layer that includes a heat-resistant resin film, a metal foil layer, and an inner layer that includes a thermoplastic resin film, wherein a melt flow rate of the inner layer is in a range of greater than or equal to 1 and less than 10.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: September 20, 2016
    Assignee: Showa Denko Packaging Co., Ltd.
    Inventor: Kensuke Nagata
  • Publication number: 20160049625
    Abstract: A power storage device includes a positive electrode part including a first metallic foil layer and a positive electrode active material layer partially laminated on one surface of the first metallic foil layer, a negative electrode part including a second metallic foil layer and a negative electrode active material layer partially laminated on one surface of the second metallic foil layer, and a separator arranged between the positive electrode part and the negative electrode part. The positive electrode active material layer is arranged between the first metallic foil layer and the separator, and the negative electrode active material layer is arranged between the second metallic foil layer and the separator. The peripheral regions of the one surfaces of the first and second metallic foil layers in which the positive and negative electrode active material layers are not formed are joined via a peripheral sealing layer containing a thermoplastic resin.
    Type: Application
    Filed: August 18, 2015
    Publication date: February 18, 2016
    Inventors: Koji MINAMITANI, Yuji MINAMIBORI, Kensuke NAGATA, Shunsuke SAITO
  • Patent number: 9257733
    Abstract: Provided is an oxygen permeable membrane for use in an air secondary battery, which excels in oxygen permeability, barrier performance to water, being capable of preventing electrolyte from leaking out. Such an oxygen permeable membrane includes a thermoplastic resin membrane and inorganic particles having pores having pore diameter of 10 ? or less contained in the thermoplastic resin membrane, in which the thermoplastic resin membrane has one surface on which hydrophobic treatment is effected.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: February 9, 2016
    Assignee: SHOWA DENKO PACKAGING CO., LTD.
    Inventor: Kensuke Nagata
  • Patent number: 9011888
    Abstract: Organic-inorganic composite particles includes inorganic oxide particles each of which has a cationic charge on the particle surface and polymer gel molecules which are derived from a natural substance, have an anionic functional group and one or more hydroxyl groups in a molecule and have both a shrinking and a swelling property, the polymer gel molecules are electrostatically bonded to surfaces of the inorganic oxide particles; a process for producing the particles; a dispersion containing the particles; and a cosmetic containing the particles. These organic-inorganic composite particles have good dispersibility not only in aqueous solvents such as water but also in non-aqueous solvents and further have characteristics that aggregation of the particles scarcely occurs.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: April 21, 2015
    Assignee: JGC Catalysts and Chemicals Ltd.
    Inventors: Kensuke Nagata, Michio Komatsu