Patents by Inventor Kensuke NOTSU

Kensuke NOTSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230331981
    Abstract: A resin molding material of the present invention contains (A) soft magnetic particles, (B) a silica fine powder having an average particle diameter of equal to or more than 0.1 ?m and equal to or less than 2.0 ?m, and (C) a thermosetting resin, in which a content of the soft magnetic particles (A) is equal to or more than 96% by mass, and a content of the silica fine powder (B) is equal to or less than 1.5% by mass.
    Type: Application
    Filed: September 30, 2021
    Publication date: October 19, 2023
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Katsushi YAMASHITA, Kensuke NOTSU
  • Publication number: 20230331980
    Abstract: A resin molding material of the present invention is used for transfer molding or compression molding, the resin molding material containing (A) soft magnetic particles, (B) a silicone compound which is liquid at normal temperature (25° C.) , and (C) a thermosetting resin, in which a content of the soft magnetic particles (A) is equal to or more than 96% by mass.
    Type: Application
    Filed: September 30, 2021
    Publication date: October 19, 2023
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Katsushi YAMASHITA, Kensuke NOTSU
  • Publication number: 20230036342
    Abstract: A solid resin molding material according to the present invention includes a thermosetting resin (A), a curing agent (B), a carboxylic acid-based dispersant (C), and magnetic particles (D).
    Type: Application
    Filed: December 24, 2020
    Publication date: February 2, 2023
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Wakana NOBE, Masaru MIZOHATA, Kensuke NOTSU, Masato YOSHIDA, Katsushi YAMASHITA
  • Publication number: 20220213312
    Abstract: A resin composition for forming a magnetic member of the present invention, which is used for compression molding, includes a thermosetting resin, magnetic particles, and non-magnetic particles having a lower specific gravity and a smaller cumulative 50% particle diameter D50 than the magnetic particles, in which the resin composition for forming a magnetic member is solid at 25° C.
    Type: Application
    Filed: April 8, 2020
    Publication date: July 7, 2022
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Masato YOSHIDA, Wakana NOBE, Kensuke NOTSU
  • Publication number: 20220177694
    Abstract: The resin composition for forming a magnetic member of the present invention, which is used for a transfer molding, includes a thermosetting resin and iron-based particles, in which the iron-based particles include iron-based amorphous particles.
    Type: Application
    Filed: April 8, 2020
    Publication date: June 9, 2022
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Wakana NOBE, Masato YOSHIDA, Kensuke NOTSU