Patents by Inventor Kensuke Okumura
Kensuke Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11764278Abstract: Provided is a semiconductor device, including: a compound semiconductor layer; a first insulating film provided on the compound semiconductor layer; a second insulating film, which is formed of a material different from the first insulating film, provided on the first insulating film; and a gate electrode provided above the second insulating film. The first insulating film may include tantalum oxynitride, and the second insulating film may include a material with a larger band gap than tantalum oxynitride. The second insulating film may include aluminum oxynitride.Type: GrantFiled: March 17, 2021Date of Patent: September 19, 2023Assignee: ADVANTEST CORPORATIONInventors: Kensuke Okumura, Tomoo Yamanouchi
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Patent number: 11607824Abstract: A method for drying a honeycomb formed body, the honeycomb formed body being an unfired honeycomb formed body including a raw material composition containing a ceramic raw material and water, the method including: a dielectric drying process of obtaining a primary dried honeycomb formed body from which 30 to 70% of entire moisture contained in the unfired honeycomb formed body before the drying is removed by performing dielectric drying on the unfired honeycomb formed body while maintaining a temperature of a central portion of the unfired honeycomb formed body at 100° C. or less; and a microwave drying process of obtaining a honeycomb dried body from which residual moisture is removed by performing microwave drying on the primary dried honeycomb formed body obtained in the dielectric drying process.Type: GrantFiled: August 21, 2018Date of Patent: March 21, 2023Assignee: NGK Insulators, Ltd.Inventors: Kensuke Okumura, Norihiro Asakura
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Patent number: 11573052Abstract: A method for manufacturing a honeycomb structure, includes: a step of manufacturing a honeycomb formed body to manufacture a non-fired honeycomb formed body having volume of 7 L or more; a drying step of drying the manufactured non-fired honeycomb formed body to obtain a honeycomb dried body; and a firing step of firing the obtained honeycomb dried body to obtain a honeycomb structure. The drying step includes: an induction drying step to obtain a first dried honeycomb formed body by removing 20 to 80% of the entire water that the non-fired honeycomb formed body contained before drying, and a microwave drying step to obtain a honeycomb dried body by removing the residual water. The honeycomb dried body subjected to this microwave drying step is obtained by removing 90% or more of the entire water that the non-fired honeycomb formed body contained before drying.Type: GrantFiled: March 15, 2018Date of Patent: February 7, 2023Assignee: NGK Insulators, Ltd.Inventor: Kensuke Okumura
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Patent number: 11478953Abstract: A manufacturing method of a honeycomb structure, including a vertical extrusion process, wherein the vertical extrusion process includes: an extrusion step of extruding the molding compound in the vertically downward direction from an extrusion die attached to an extruder; a honeycomb formed body receiving step in which a transfer pallet is placed at a position near the extrusion die, and a honeycomb formed body formed by continuously extruding the molding compound in the extrusion step is received and supported from below by the transfer pallet; and a pallet lowering step of lowering the transfer pallet while receiving and supporting the honeycomb formed body in synchronization with an extrusion speed of the molding compound from the extrusion die, and the transfer pallet is constituted of a laminate structure including: a pallet substrate; and a tabular mesh plate.Type: GrantFiled: February 13, 2019Date of Patent: October 25, 2022Assignee: NGK Insulators, Ltd.Inventor: Kensuke Okumura
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Publication number: 20220234964Abstract: A dielectric drying method for ceramic formed bodies includes drying a plurality of ceramic formed bodies placed side by side in a direction perpendicular to a conveying direction on upper surfaces of drying tables by conveying the ceramic formed bodies between electrodes of an upper electrode and a lower electrode, and applying a high frequency between the electrodes. In the direction perpendicular to the conveying direction of the ceramic formed body, a distance between the electrodes in two end regions between which a central region is interposed is shorter than a distance between the electrodes in the central region.Type: ApplicationFiled: April 13, 2022Publication date: July 28, 2022Applicant: NGK Insulators, Ltd.Inventors: Yoshimasa FUMA, Yuichi TAJIMA, Yoshimasa KONDO, Kensuke OKUMURA
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Publication number: 20220074658Abstract: A dielectric drying method for ceramic formed bodies includes drying a plurality of ceramic formed bodies placed side by side in an arrangement direction Y perpendicular to a conveying direction X on an upper surface of a drying table by conveying the ceramic formed bodies between electrodes of an upper electrode and a lower electrode, and applying a high frequency between the electrodes. The upper electrode includes: a central region; and two end regions between which the central region is located, in the arrangement direction Y. The central region has a flat surface portion parallel to an upper end surface of the ceramic formed body.Type: ApplicationFiled: June 28, 2021Publication date: March 10, 2022Applicant: NGK INSULATORS, LTD.Inventors: Yoshimasa FUMA, Yuichi TAJIMA, Yoshimasa KONDO, Kensuke OKUMURA
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Patent number: 11156400Abstract: A method for manufacturing a honeycomb structure, includes: a step of manufacturing a honeycomb formed body to manufacture a non-fired honeycomb formed body, the non-fired honeycomb formed body including a raw material composition containing a ceramic raw material, 0.5 to 5.0 mass % of pore former and water; an induction drying step of drying the manufactured non-fired honeycomb formed body by induction drying to obtain a honeycomb dried body; and a firing step of firing the obtained honeycomb dried body to obtain a honeycomb structure. The induction drying step is to remove 20 to 80% of the entire water that the non-fired honeycomb formed body contained before drying by induction drying to obtain a first dried honeycomb formed body, then turn the first dried honeycomb formed body upside down and remove the residual water by further induction drying to obtain the honeycomb dried body.Type: GrantFiled: March 15, 2018Date of Patent: October 26, 2021Assignee: NGK Insulators, Ltd.Inventor: Kensuke Okumura
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Publication number: 20210320184Abstract: Provided is a semiconductor device, including: a compound semiconductor layer; a first insulating film provided on the compound semiconductor layer; a second insulating film, which is formed of a material different from the first insulating film, provided on the first insulating film; and a gate electrode provided above the second insulating film. The first insulating film may include tantalum oxynitride, and the second insulating film may include a material with a larger band gap than tantalum oxynitride. The second insulating film may include aluminum oxynitride.Type: ApplicationFiled: March 17, 2021Publication date: October 14, 2021Inventors: Kensuke OKUMURA, Tomoo YAMANOUCHI
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Patent number: 11110628Abstract: A method for producing a honeycomb structure including producing an unfired pillar shaped honeycomb body; placing the unfired pillar shaped honeycomb body on a receiving table such that the unfired pillar shaped honeycomb body stands thereon; conveying the unfired pillar shaped honeycomb body placed on the receiving table; drying the unfired pillar shaped honeycomb body after the conveying step, or drying the unfired pillar shaped honeycomb body during the conveying to obtain a honeycomb dried body; and firing the honeycomb dried body to obtain a honeycomb structure. The receiving table includes at least one protrusion. In the honeycomb formed body conveying step, the unfired pillar shaped honeycomb body is conveyed while supporting it by inserting the at least one protrusion of the receiving table into a bottom surface of the unfired pillar shaped honeycomb body placed on the receiving table.Type: GrantFiled: January 21, 2020Date of Patent: September 7, 2021Assignee: NGK Insulators, Ltd.Inventors: Kensuke Okumura, Hirotada Nakamura
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Publication number: 20200312968Abstract: Planar transistors are integrated on a semiconductor apparatus. Each planar transistor includes a source electrode, a gate electrode, a drain electrode, and a field plate. The source electrode and the field plate are coupled on the outside of an active region of the planar transistor.Type: ApplicationFiled: January 14, 2020Publication date: October 1, 2020Inventors: Kiyotaka KASAHARA, Kensuke OKUMURA, Tomoo YAMANOUCHI
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Publication number: 20200238569Abstract: A method for producing a honeycomb structure including producing an unfired pillar shaped honeycomb body; placing the unfired pillar shaped honeycomb body on a receiving table such that the unfired pillar shaped honeycomb body stands thereon; conveying the unfired pillar shaped honeycomb body placed on the receiving table; drying the unfired pillar shaped honeycomb body after the conveying step, or drying the unfired pillar shaped honeycomb body during the conveying to obtain a honeycomb dried body; and firing the honeycomb dried body to obtain a honeycomb structure. The receiving table includes at least one protrusion. In the honeycomb formed body conveying step, the unfired pillar shaped honeycomb body is conveyed while supporting it by inserting the at least one protrusion of the receiving table into a bottom surface of the unfired pillar shaped honeycomb body placed on the receiving table.Type: ApplicationFiled: January 21, 2020Publication date: July 30, 2020Applicant: NGK INSULATORS, LTD.Inventors: Kensuke OKUMURA, Hirotada NAKAMURA
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Patent number: 10633297Abstract: A method of applying a circumferential coating material on a circumferential surface of a ceramic honeycomb structure to form a circumferential coat layer. The method includes vertically aligning the longitudinal axis of the ceramic honeycomb structure, rotating the ceramic honeycomb structure around the vertically-aligned longitudinal axis, and applying the circumferential coating material on the circumferential surface of the rotating honeycomb structure at a discharge speed of 50 to 120 mm/s, calculated by Discharge speed V [mm/s]=Supplied amount q [g/s] of circumferential coating material÷(Density ? [g/mm3] of circumferential coating material×Area S [mm2] of discharge opening).Type: GrantFiled: February 28, 2019Date of Patent: April 28, 2020Assignee: NGK Insulators, Ltd.Inventors: Kensuke Okumura, Tomoya Taguchi
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Publication number: 20190284105Abstract: A method of manufacturing a honeycomb structure, the method including: a circumferential coat layer forming process of applying a circumferential coating material on a circumferential surface of a ceramic honeycomb structure to form a circumferential coat layer, the circumferential coat layer forming process including: a rotating process of matching an axial direction of the honeycomb structure; and an applying process of discharging the circumferential coating material to apply the circumferential coating material on the circumferential surface of the honeycomb structure that rotates, wherein in the applying process, a discharge speed of the circumferential coating material, calculated by Equation (1), discharged from the discharge nozzle is 50 to 120 mm/s, and Discharge speed V [mm/s]=Supplied amount q [g/s] of circumferential coating material÷(Density ? [g/mm3] of circumferential coating material×Area S [mm2] of discharge opening)??(1).Type: ApplicationFiled: February 28, 2019Publication date: September 19, 2019Applicant: NGK Insulators, Ltd.Inventors: Kensuke OKUMURA, Tomoya Taguchi
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Publication number: 20190275699Abstract: A manufacturing method of a honeycomb structure, including a vertical extrusion process, wherein the vertical extrusion process includes: an extrusion step of extruding the molding compound in the vertically downward direction from an extrusion die attached to an extruder; a honeycomb formed body receiving step in which a transfer pallet is placed at a position near the extrusion die, and a honeycomb formed body formed by continuously extruding the molding compound in the extrusion step is received and supported from below by the transfer pallet; and a pallet lowering step of lowering the transfer pallet while receiving and supporting the honeycomb formed body in synchronization with an extrusion speed of the molding compound from the extrusion die, and the transfer pallet is constituted of a laminate structure including: a pallet substrate; and a tabular mesh plate.Type: ApplicationFiled: February 13, 2019Publication date: September 12, 2019Applicant: NGK Insulators, Ltd.Inventor: Kensuke OKUMURA
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Patent number: 10252442Abstract: A manufacturing method includes: a dry mixing step of dry mixing a raw material by batch processing; a wet mixing step of adding liquid to a dry mixture obtained at the dry mixing step, the liquid including at least one type of water, surfactant, lubricant and plasticizer, while wet mixing; a kneading step of kneading a wet mixture obtained at the wet mixing step; and a forming step of extruding a kneaded mixture (forming raw material) obtained at the kneading step to make a ceramic formed body. In the kneading step, the liquid is further added during kneading of the wet mixture.Type: GrantFiled: March 25, 2016Date of Patent: April 9, 2019Assignee: NGK Insulators, Ltd.Inventors: Yuichi Tajima, Kensuke Okumura, Seiichiro Hayashi
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Patent number: 10174996Abstract: A method of drying a ceramic formed body comprising the step of performing dielectric drying on an unfired honeycomb formed body formed with a ceramic material as a main raw material under a condition that a power density is 5 to 20 [kW/kg (water)].Type: GrantFiled: February 24, 2011Date of Patent: January 8, 2019Assignee: NGK Insulators, Ltd.Inventors: Kensuke Okumura, Shuichi Takagi
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Publication number: 20180354157Abstract: A method for drying a honeycomb formed body, the honeycomb formed body being an unfired honeycomb formed body including a raw material composition containing a ceramic raw material and water, the method including: a dielectric drying process of obtaining a primary dried honeycomb formed body from which 30 to 70% of entire moisture contained in the unfired honeycomb formed body before the drying is removed by performing dielectric drying on the unfired honeycomb formed body while maintaining a temperature of a central portion of the unfired honeycomb formed body at 100° C. or less; and a microwave drying process of obtaining a honeycomb dried body from which residual moisture is removed by performing microwave drying on the primary dried honeycomb formed body obtained in the dielectric drying process.Type: ApplicationFiled: August 21, 2018Publication date: December 13, 2018Applicant: NGK INSULATORS, LTD.Inventors: Kensuke OKUMURA, Norihiro Asakura
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Publication number: 20180283784Abstract: A method for manufacturing a honeycomb structure, includes: a step of manufacturing a honeycomb formed body to manufacture a non-fired honeycomb formed body, the non-fired honeycomb formed body including a raw material composition containing a ceramic raw material and water; an induction drying step of drying the manufactured non-fired honeycomb formed body by induction drying to obtain a honeycomb dried body; and a firing step of firing the obtained honeycomb dried body to obtain a honeycomb structure. The induction drying step is to remove 10 to 50% of the entire water that the non-fired honeycomb formed body contained before drying by induction drying to obtain a first dried honeycomb formed body, then turn the first dried honeycomb formed body upside down and remove the residual water by further induction drying to obtain the honeycomb dried body.Type: ApplicationFiled: March 15, 2018Publication date: October 4, 2018Applicant: NGK Insulators, Ltd.Inventor: Kensuke Okumura
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Publication number: 20180283785Abstract: A method for manufacturing a honeycomb structure, includes: a step of manufacturing a honeycomb formed body to manufacture a non-fired honeycomb formed body having volume of 7 L or more; a drying step of drying the manufactured non-fired honeycomb formed body to obtain a honeycomb dried body; and a firing step of firing the obtained honeycomb dried body to obtain a honeycomb structure. The drying step includes: an induction drying step to obtain a first dried honeycomb formed body by removing 20 to 80% of the entire water that the non-fired honeycomb formed body contained before drying, and a microwave drying step to obtain a honeycomb dried body by removing the residual water. The honeycomb dried body subjected to this microwave drying step is obtained by removing 90% or more of the entire water that the non-fired honeycomb formed body contained before drying.Type: ApplicationFiled: March 15, 2018Publication date: October 4, 2018Applicant: NGK INSULATORS, LTD.Inventor: Kensuke OKUMURA
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Publication number: 20180283783Abstract: A method for manufacturing a honeycomb structure, includes: a step of manufacturing a honeycomb formed body to manufacture a non-fired honeycomb formed body, the non-fired honeycomb formed body including a raw material composition containing a ceramic raw material, 0.5 to 5.0 mass % of pore former and water; an induction drying step of drying the manufactured non-fired honeycomb formed body by induction drying to obtain a honeycomb dried body; and a firing step of firing the obtained honeycomb dried body to obtain a honeycomb structure. The induction drying step is to remove 20 to 80% of the entire water that the non-fired honeycomb formed body contained before drying by induction drying to obtain a first dried honeycomb formed body, then turn the first dried honeycomb formed body upside down and remove the residual water by further induction drying to obtain the honeycomb dried body.Type: ApplicationFiled: March 15, 2018Publication date: October 4, 2018Applicant: NGK Insulators, Ltd.Inventor: Kensuke OKUMURA