Abstract: The present disclosure is directed to an electronic component mounting structure including: a circuit board provided on a surface thereof with a first electrode containing Cu as a main component; and an electronic component mounted on the circuit board, the electronic component including a second electrode on a surface thereof; wherein the second electrode includes a first plating containing Ni as a main component and a second plating containing Sn as a main component formed on a surface of the first plating, and an intermediate bonding layer is provided between the first plating and the first electrode, and the intermediate bonding layer includes a first region containing an alloy of Cu and Sn as a main component and a second region containing Sn as a main component.

Abstract: An electronic component package includes: a resin portion having a first surface; one or more electronic components each having a plurality of external electrodes; and a plurality of extraction electrodes electrically connected to the plurality of external electrodes. Only each of the plurality of extraction electrodes is exposed from the resin portion on the first surface. The plurality of external electrodes are covered with the resin portion.

Abstract: The present disclosure is directed to an electronic component mounting structure including: a circuit board provided on a surface thereof with a first electrode containing Cu as a main component; and an electronic component mounted on the circuit board, the electronic component including a second electrode on a surface thereof; wherein the second electrode includes a first plating containing Ni as a main component and a second plating containing Sn as a main component formed on a surface of the first plating, and an intermediate bonding layer is provided between the first plating and the first electrode, and the intermediate bonding layer includes a first region containing an alloy of Cu and Sn as a main component and a second region containing Sn as a main component.

Abstract: An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

Abstract: A problem addressed by the present invention is to reduce the influence of stray light incident on each light-receiving element in the case of receiving each wavelength of light using a plurality of light-receiving elements.

Abstract: A problem addressed by the present invention is to reduce the influence of stray light incident on each light-receiving element in the case of receiving each wavelength of light using a plurality of light-receiving elements.