Abstract: A lens unit includes a first optical element including a first principal surface that is an incident surface; and including a first glass substrate and a first resin, the first glass substrate including a frame-shaped cutout at an outer edge of the first principal surface, the first resin being disposed only in the cutout.

Abstract: A stacked lens includes: a first optical device; a second optical device disposed on an optical axis of the first optical device; and an adhesive layer bonding the first optical device and the second optical device and including a projection projecting outside a side surface of the first optical device and a side surface of the second optical device.

Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

Abstract: An image pickup apparatus includes a cover glass including a first principal surface and a second principal surface, an image pickup member which includes a light receiving surface and a rear surface and in which the light receiving surface is disposed on the second principal surface which is larger than the light receiving surface, and a first resin disposed around the image pickup member of the second principal surface, having the same external size of a cross-section orthogonal to an optical axis as an external size of a cross-section of the second principal surface, and including a trench parallel to the optical axis on a side surface, and a second resin disposed in the trench.

Abstract: An image pickup apparatus includes an imager, cover glass and a circuit element, the image pickup apparatus includes a first space filled with a first resin and a second space filled with a second resin, a thermal expansion coefficient of the second resin being smaller than a thermal expansion coefficient of the first resin, and when the image pickup apparatus is virtually divided into a plurality of unit columns, a ratio of the second space is larger in the unit columns in which a ratio of a space filled with resins is large than in the unit columns in which the ratio of the space filled with the resins is small.

Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

Abstract: An image pickup apparatus disposed in an endoscope includes: an image pickup unit including an image pickup device, a stacked element and a plurality of rear electrodes; an interposer having a recessed portion in which the image pickup unit is housed, wherein a plurality of connection electrodes which are connected with the plurality of rear electrodes are disposed on a bottom surface of the recessed portion, and a plurality of bonding electrodes which are connected with the plurality of connection electrodes are disposed on an outer surface of the interposer; a sealing resin; and a plurality of electric cables connected to the plurality of bonding electrodes of the interposer. An arrangement interval between the plurality of bonding electrodes is set larger than an arrangement interval between the plurality of connection electrodes.

Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.

Abstract: An image pickup apparatus includes an imager, cover glass and a circuit element, the image pickup apparatus includes a first space filled with a first resin and a second space filled with a second resin, a thermal expansion coefficient of the second resin being smaller than a thermal expansion coefficient of the first resin, and when the image pickup apparatus is virtually divided into a plurality of unit columns, a ratio of the second space is larger in the unit columns in which a ratio of a space filled with resins is large than in the unit columns in which the ratio of the space filled with the resins is small.

Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.

Abstract: An endoscope includes: an insertion section including a rigid distal end portion in which a first through hole and a second through hole are formed; an image pickup unit inserted in the first through hole, the image pickup unit including a first block and a second block having an area in a direction orthogonal to an optical axis that is smaller than an area of the first block in the direction orthogonal to the optical axis; and a water feeding and air feeding tube having a distal end portion that is inserted in the second through hole, a part of the tube being arranged in an accommodation space in which a space obtained by extending the first block in an optical axis direction and a space obtained by extending the second block in the direction orthogonal to the optical axis are superimposed on each other.

Abstract: An image pickup unit for endoscope includes: an image pickup portion having a rectangular parallelepiped shape on which a plurality of semiconductor devices including a first semiconductor device and a second semiconductor device are stacked, the image pickup portion including an image pickup device, a device stack bonded to a rear surface of the image pickup device, and a reinforcing member formed by resin covering an outer peripheral surface of the device stack; and a signal cable connected to the image pickup portion, in which: the first semiconductor device on a rear end side is smaller than the second semiconductor device on an image pickup device side; and the reinforcing member has a thickness on the rear end side that is thicker than a thickness on the image pickup device side.

Abstract: The disclosed technology is directed to an imaging module of an endoscope comprises a plurality of semiconductor devices includes first and second semiconductor devices being electrically stacked to one another with a sealing layer interposed therebetween to transmit signals via a signal cable connected to a rear wall of the plurality of semiconductor devices. The first semiconductor device includes respective opposed first and second major surfaces having a first central region. The first major surface includes a semiconductor circuit portion disposed in the central region thereof. A through-silicon via is disposed in an intermediate region surrounding the first central region and is connected to the semiconductor circuit portion. The second major surface includes a first electrode located in the first central region thereof. The first electrode is connected to the through-silicon via. The second semiconductor device includes respective opposed third and fourth major surfaces having a second central region.