Patents by Inventor Kensuke Takeuchi

Kensuke Takeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11476224
    Abstract: In a wiring member, an element connection portion, a plate connection portion, and an upper surface portion are at height positions different from one another. The element connection portion has a through hole, and the plate connection portion has a through hole and a chamfer. The upper surface portion which is not connected to another portion, has projections asymmetrically disposed on both side surfaces thereof. Owing to these features, the type, the orientation, and the front and the back of the wiring member can be easily distinguished. Accordingly, it is possible to prevent incorrect assembling of the wiring member in a semiconductor module.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: October 18, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kensuke Takeuchi, Takashi Nagao
  • Patent number: 11410911
    Abstract: A semiconductor module such that warping or distortion is prevented, and reliability can be increased, is obtained. The semiconductor module includes a base configuring a multiple of terminals or wires, a semiconductor switching element mounted on a mounting portion of the terminal, and a molded resin that seals the semiconductor switching element, wherein a wide portion having a width greater than that of the terminal or the wire is formed in one portion of the terminal or the wire in an outer peripheral side end portion of the molded resin, and the wide portion is embedded and fixed in an interior of the molded resin in a state extended toward the interior from the outer peripheral side end portion of the molded resin.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: August 9, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kensuke Takeuchi, Masayuki Funakoshi, Takashi Nagao
  • Patent number: 11408742
    Abstract: In an information processing device, an acquisition unit acquires current position information of a vehicle. A route search unit searches for a route from a departure place via the current position of the vehicle to a destination based on the current position information of the vehicle acquired by the acquisition unit.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: August 9, 2022
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, AISIN AW CO., LTD.
    Inventors: Hiroaki Takeyama, Xin Jin, Norihiro Nakamura, Hideki Kasezawa, Kensuke Takeuchi, Hajime Morikawa, Yoko Sakurai
  • Publication number: 20220090936
    Abstract: An information processing apparatus includes an in-vehicle device mounted on a vehicle. The in-vehicle device includes a display device and a processor. The in-vehicle device outputs, on the display device, weather information of a point designated by a user on a map, displays a travel route along which the vehicle travels on the map on the display device, and in a case where the travel route is not included in the area including the point designated by the user on the map among a plurality of areas obtained by dividing the map and the processor determines that the point designated by the user is within a predetermined range from the travel route, outputs, on the display device, the weather information of an area closest to the point designated by the user among the areas including the travel route.
    Type: Application
    Filed: December 6, 2021
    Publication date: March 24, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroaki Takeyama, Motohiro Nakamura, Norihiro Nakamura, Hideki Kasezawa, Kensuke Takeuchi, Hajime Morikawa, Yoko Sakurai
  • Patent number: 11226210
    Abstract: An information processing apparatus includes an in-vehicle device mounted on a vehicle. The in-vehicle device includes a display device and a processor. The in-vehicle device outputs, on the display device, weather information of a point designated by a user on a map, displays a travel route along which the vehicle travels on the map on the display device, and in a case where the travel route is not included in the area including the point designated by the user on the map among a plurality of areas obtained by dividing the map and the processor determines that the point designated by the user is within a predetermined range from the travel route, outputs, on the display device, the weather information of an area closest to the point designated by the user among the areas including the travel route.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: January 18, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroaki Takeyama, Motohiro Nakamura, Norihiro Nakamura, Hideki Kasezawa, Kensuke Takeuchi, Hajime Morikawa, Yoko Sakurai
  • Publication number: 20210319698
    Abstract: A determination device that determines a tendency of a driver who selects a parking space includes an acquisition unit configured to acquire information regarding an attribute of the parking space in a parking lot, information regarding behavior of a vehicle driven by the driver in the parking lot, and information regarding behavior of the driver when the driver is driving the vehicle in the parking lot, and a determination unit configured to determine the tendency of the driver when the driver selects the parking space, based on the information regarding the behavior of the vehicle or the information regarding the behavior of the driver and the information regarding the attribute of the parking space.
    Type: Application
    Filed: May 5, 2021
    Publication date: October 14, 2021
    Applicants: Toyota Jidosha Kabushiki Kaisha, Aisin AW Co., Ltd.
    Inventors: Hiroaki Takeyama, Motohiro Nakamura, Norihiro Nakamura, Hideki Kasezawa, Kensuke Takeuchi, Hajime Morikawa, Yoko Sakurai
  • Patent number: 11127293
    Abstract: A determination device determines a tendency of a driver who selects a parking space and includes an acquisition unit and a determination unit. The acquisition unit is configured to acquire information regarding an attribute of the parking space in a parking lot, information regarding behavior of a vehicle driven by the driver in the parking lot, and information regarding behavior of the driver when the driver is driving the vehicle in the parking lot. The determination unit is configured to determine the tendency of the driver when the driver selects the parking space, based on the information regarding the behavior of the vehicle or the information regarding the behavior of the driver and the information regarding the attribute of the parking space.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: September 21, 2021
    Assignees: Toyota Jidosha Kabushiki Kaisha, Aisin AW Co., Ltd.
    Inventors: Hiroaki Takeyama, Motohiro Nakamura, Norihiro Nakamura, Hideki Kasezawa, Kensuke Takeuchi, Hajime Morikawa, Yoko Sakurai
  • Patent number: 11074815
    Abstract: A determination device determines a tendency of a driver who selects a parking space and includes an acquisition unit and a determination unit. The acquisition unit is configured to acquire information regarding an attribute of the parking space in a parking lot, information regarding behavior of a vehicle driven by the driver in the parking lot, and information regarding behavior of the driver when the driver is driving the vehicle in the parking lot. The determination unit is configured to determine the tendency of the driver when the driver selects the parking space, based on the information regarding the behavior of the vehicle or the information regarding the behavior of the driver and the information regarding the attribute of the parking space.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: July 27, 2021
    Assignees: Toyota Jidosha Kabushiki Kaisha, Aisin AW Co., Ltd.
    Inventors: Hiroaki Takeyama, Motohiro Nakamura, Norihiro Nakamura, Hideki Kasezawa, Kensuke Takeuchi, Hajime Morikawa, Yoko Sakurai
  • Publication number: 20210217687
    Abstract: A semiconductor module includes a semiconductor switching element, a multiple of bases, on at least one of which the semiconductor switching element is mounted, a molded resin that seals the semiconductor switching element and the multiple of bases, a multiple of terminals formed integrally with each one of the multiple of bases and provided extending from an outer periphery side face of the molded resin, and a recessed portion or a protruding portion having a depth or a height such that creepage distance between the multiple of terminals is secured, and formed so as to cross an interval between the multiple of terminals, in one portion of the outer periphery side face of the molded resin between the multiple of terminals.
    Type: Application
    Filed: August 20, 2018
    Publication date: July 15, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kensuke TAKEUCHI, Masayuki FUNAKOSHI, Takashi NAGAO
  • Publication number: 20210151362
    Abstract: A semiconductor module (1) such that warping or distortion is prevented, and reliability can be increased, is obtained. The semiconductor module (1) includes a base (10a) configuring a multiple of terminals (C1 to C6, B1, B2, M1, M2) or wires (G1, G2), a semiconductor switching element (T1 to T4) mounted on a mounting portion (21) of the terminal (C1 to C6, B1, B2, M1, M2), and a molded resin (20) that seals the semiconductor switching element (T1 to T4), wherein a wide portion (G10, G20) having a width greater than that of the terminal (C1 to C6, B1, B2, M1, M2) or the wire (G1, G2) is formed in one portion of the terminal (C1 to C6, B1, B2, M1, M2) or the wire (G1, G2) in an outer peripheral side end portion of the molded resin (20), and the wide portion (G10, G20) is embedded and fixed in an interior of the molded resin (20) in a state extended toward the interior from the outer peripheral side end portion of the molded resin (20).
    Type: Application
    Filed: August 2, 2018
    Publication date: May 20, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kensuke TAKEUCHI, Masayuki FUNAKOSHI, Takashi NAGAO
  • Patent number: 10950560
    Abstract: Lands (11c and 11d) are parts of base plates (104c and 104d), and electrodes of a shunt resistor (103U) are put on and connected to the lands (11c and 11d). Slits (130 and 131) are formed in the lands (11c and 11d) to separate a main electric circuit in which a main current flows and control terminals (123 and 124) with which the electric potentials of the electrodes of the shunt resistor (103U) are detected. Leading end portions of the slits (130 and 131) extend to the vicinity of the electrodes of the shunt resistor (103U).
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: March 16, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Katsuhiko Omae, Masayuki Funakoshi, Kensuke Takeuchi
  • Publication number: 20200395329
    Abstract: In a wiring member, an element connection portion, a plate connection portion, and an upper surface portion are at height positions different from one another. The element connection portion has a through hole, and the plate connection portion has a through hole and a chamfer. The upper surface portion which is not connected to another portion, has projections asymmetrically disposed on both side surfaces thereof. Owing to these features, the type, the orientation, and the front and the back of the wiring member can be easily distinguished. Accordingly, it is possible to prevent incorrect assembling of the wiring member in a semiconductor module.
    Type: Application
    Filed: May 8, 2018
    Publication date: December 17, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kensuke TAKEUCHI, Takashi NAGAO
  • Publication number: 20200395271
    Abstract: A shared base plate includes a plurality of base portions to which a plurality of electronic components including semiconductor switching elements are to be mounted, and a terminal formed portion formed so as to extend from the base portion to the outer side. The terminal formed portion includes a discrimination terminal which is used as a terminal in one of a first semiconductor module and a second semiconductor module and which is not used as a terminal in the other one. If the discrimination terminal that is not used as a terminal is cut to be short, it becomes possible to easily discriminate the semiconductor module from another semiconductor module having the shared base plate by outer appearances.
    Type: Application
    Filed: April 25, 2018
    Publication date: December 17, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takashi NAGAO, Kensuke TAKEUCHI
  • Patent number: 10724866
    Abstract: An information processing device includes a server. The server is configured to receive start information and positional information of a vehicle from the vehicle when the vehicle is started, acquire schedule information on a user's earliest schedule of the vehicle, the schedule information including information of a start time of the schedule and a destination as a place relating to the schedule, calculate an estimated arrival time at which the vehicle arrives at the destination when the vehicle heads for the destination from a position of the vehicle specified by the positional information of the vehicle, based on a current time, determine whether or not a user has started the vehicle to head for the destination according to a difference between the estimated arrival time and the start time of the schedule, and transmit a determination result of the determination to the vehicle.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: July 28, 2020
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, AISIN AW CO., LTD.
    Inventors: Hiroaki Takeyama, Norihiro Nakamura, Hideki Kasezawa, Kensuke Takeuchi, Hajime Morikawa, Yoko Sakurai
  • Patent number: 10629521
    Abstract: An object of this invention is to obtain a molded module with which improvements are achieved in the packaging ability and heat dissipation performance of an inverter module itself, and in the mounting capacity of a peripheral mounting component such as a substrate, which must be taken into consideration in relation to the shape of the module. Provided is a molded module for use in power electronics, having an inbuilt semiconductor element used to supply and control a large amount of power, the molded module including at least one semiconductor switching element provided in the module and a lead frame that dissipates heat from the switching element and electrically connects an element packaged in the module to an external circuit, wherein at least one end of the module is molded in a curved shape or a polygonal shape.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: April 21, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takahiro Okanoue, Masaaki Tanigawa, Kensuke Takeuchi
  • Patent number: 10523091
    Abstract: A frame has upper and lower surfaces that extend in a perpendicular direction to a motor output shaft, donut-shaped conductive plates are mounted respectively on the upper and lower surfaces, and the conductive plates both include connection-forming terminal portions provided on inner and outer peripheral sides thereof. An inverter circuit is constituted by a power module formed from a plurality of switching elements, a power supply terminal is provided on one side of a package forming the power module, while an output terminal connected to a winding terminal for supplying power to a motor and a control terminal connected to a control signal are provided on an opposing side. The terminal portions on the inner peripheral sides of the conductive plates are connected to the power supply terminal of the power module, and the control board is connected to the control terminal of the power module.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: December 31, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kensuke Takeuchi, Takahiro Okanoue, Masaaki Tanigawa, Akira Kaneko
  • Publication number: 20190371745
    Abstract: Lands (11c and 11d) are parts of base plates (104c and 104d), and electrodes of a shunt resistor (103U) are put on and connected to the lands (11c and 11d). Slits (130 and 131) are formed in the lands (11c and 11d) to separate a main electric circuit in which a main current flows and control terminals (123 and 124) with which the electric potentials of the electrodes of the shunt resistor (103U) are detected. Leading end portions of the slits (130 and 131) extend to the vicinity of the electrodes of the shunt resistor (103U).
    Type: Application
    Filed: May 6, 2019
    Publication date: December 5, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Katsuhiko OMAE, Masayuki FUNAKOSHI, Kensuke TAKEUCHI
  • Publication number: 20190221124
    Abstract: A determination device that determines a tendency of a driver who selects a parking space includes an acquisition unit configured to acquire information regarding an attribute of the parking space in a parking lot, information regarding behavior of a vehicle driven by the driver in the parking lot, and information regarding behavior of the driver when the driver is driving the vehicle in the parking lot, and a determination unit configured to determine the tendency of the driver when the driver selects the parking space, based on the information regarding the behavior of the vehicle or the information regarding the behavior of the driver and the information regarding the attribute of the parking space.
    Type: Application
    Filed: January 11, 2019
    Publication date: July 18, 2019
    Applicants: Toyota Jidosha Kabushiki Kaisha, Aisin AW Co., Ltd.
    Inventors: Hiroaki Takeyama, Motohiro Nakamura, Norihiro Nakamura, Hideki Kasezawa, Kensuke Takeuchi, Hajime Morikawa, Yoko Sakurai
  • Publication number: 20190212166
    Abstract: An information processing apparatus includes an in-vehicle device mounted on a vehicle. The in-vehicle device includes a display device and a processor. The in-vehicle device outputs, on the display device, weather information of a point designated by a user on a map, displays a travel route along which the vehicle travels on the map on the display device, and in a case where the travel route is not included in the area including the point designated by the user on the map among a plurality of areas obtained by dividing the map and the processor determines that the point designated by the user is within a predetermined range from the travel route, outputs, on the display device, the weather information of an area closest to the point designated by the user among the areas including the travel route.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 11, 2019
    Applicants: Toyota Jidosha Kabushiki Kaisha, Aisin AW Co., Ltd.
    Inventors: Hiroaki Takeyama, Motohiro Nakamura, Norihiro Nakamura, Hideki Kasezawa, Kensuke Takeuchi, Hajime Morikawa, Yoko Sakurai
  • Publication number: 20190178647
    Abstract: An information processing device includes a server. The server is configured to receive start information and positional information of a vehicle from the vehicle when the vehicle is started, acquire schedule information on a user's earliest schedule of the vehicle, the schedule information including information of a start time of the schedule and a destination as a place relating to the schedule, calculate an estimated arrival time at which the vehicle arrives at the destination when the vehicle heads for the destination from a position of the vehicle specified by the positional information of the vehicle, based on a current time, determine whether or not a user has started the vehicle to head for the destination according to a difference between the estimated arrival time and the start time of the schedule, and transmit a determination result of the determination to the vehicle.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 13, 2019
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, AISIN AW CO., LTD.
    Inventors: Hiroaki TAKEYAMA, Norihiro NAKAMURA, Hideki KASEZAWA, Kensuke TAKEUCHI, Hajime MORIKAWA, Yoko SAKURAI