Abstract: An electronic device includes: a substrate having a circuit pattern; heating elements disposed on a top of the substrate, and that have upper surface heat dissipating portions that are located on an opposite side of the substrate; thermal conductive members that are disposed on a top of the upper surface heat dissipating portions; metallic plates that are disposed on a top of the thermal conductive members; thermal conductive insulators that are disposed on a top of the metallic plates, and a heat sink that is disposed on a top of the thermal conductive insulators.

Abstract: A semiconductor module includes: a plurality of semiconductor switching elements; a resin mold having a side surface and surrounding the plurality of the semiconductor switching elements; a terminal member having a plurality of inner terminals electrically connected to the plurality of the semiconductor switching elements inside the resin mold and a plurality of outer terminals protruding from the side surface of the resin mold; and a support member disposed at a position apart from the side surface of the resin mold, the support member extending in a direction in which the plurality of the outer terminals are arrayed, the support member covering a part of an outer-periphery of each of the plurality of the outer terminals, the support member fixing the plurality of the outer terminals such that the plurality of the outer terminals are spaced from each other.

Abstract: This semiconductor module includes: a base plate formed in a plate shape; a terminal member; an electronic component joined to one surface of the base plate; and mold resin sealing the base plate, the terminal member, and the electronic component. The base plate and the terminal member are conductive members and are arranged with an interval therebetween on the same plane. Each of the base plate and the terminal member has a body portion and a terminal portion exposed to outside from the mold resin. The base plate has a through hole at an extension part which is a part extending toward the terminal portion and connected to the terminal portion, in the body portion.

Abstract: A determination device that determines a tendency of a driver who selects a parking space includes an acquisition unit configured to acquire information regarding an attribute of the parking space in a parking lot, information regarding behavior of a vehicle driven by the driver in the parking lot, and information regarding behavior of the driver when the driver is driving the vehicle in the parking lot, and a determination unit configured to determine the tendency of the driver when the driver selects the parking space, based on the information regarding the behavior of the vehicle or the information regarding the behavior of the driver and the information regarding the attribute of the parking space.

Abstract: A shared base plate includes a plurality of base portions to which a plurality of electronic components including semiconductor switching elements are to be mounted, and a terminal formed portion formed so as to extend from the base portion to the outer side. The terminal formed portion includes a discrimination terminal which is used as a terminal in one of a first semiconductor module and a second semiconductor module and which is not used as a terminal in the other one. If the discrimination terminal that is not used as a terminal is cut to be short, it becomes possible to easily discriminate the semiconductor module from another semiconductor module having the shared base plate by outer appearances.

Abstract: A semiconductor module includes a semiconductor switching element, a multiple of bases, on at least one of which the semiconductor switching element is mounted, a molded resin that seals the semiconductor switching element and the multiple of bases, a multiple of terminals formed integrally with each one of the multiple of bases and provided extending from an outer periphery side face of the molded resin, and a recessed portion or a protruding portion having a depth or a height such that creepage distance between the multiple of terminals is secured, and formed so as to cross an interval between the multiple of terminals, in one portion of the outer periphery side face of the molded resin between the multiple of terminals.

Abstract: The present disclosure includes: a base plate having a shape of a sheet; a relay plate having a shape of a sheet; a terminal member; and an electronic component joined to one surface of the base plate. The base plate, the relay plate, and the terminal member are electrically conductive members and arranged on a same plane with gaps between the electrically conductive members. The electronic component and one surface of the relay plate are connected to each other by a bonding wire. The one surface of the relay plate and one surface of the terminal member are connected to each other by a bonding wire.

Abstract: In a wiring member, an element connection portion, a plate connection portion, and an upper surface portion are at height positions different from one another. The element connection portion has a through hole, and the plate connection portion has a through hole and a chamfer. The upper surface portion which is not connected to another portion, has projections asymmetrically disposed on both side surfaces thereof. Owing to these features, the type, the orientation, and the front and the back of the wiring member can be easily distinguished. Accordingly, it is possible to prevent incorrect assembling of the wiring member in a semiconductor module.

Abstract: A semiconductor module such that warping or distortion is prevented, and reliability can be increased, is obtained. The semiconductor module includes a base configuring a multiple of terminals or wires, a semiconductor switching element mounted on a mounting portion of the terminal, and a molded resin that seals the semiconductor switching element, wherein a wide portion having a width greater than that of the terminal or the wire is formed in one portion of the terminal or the wire in an outer peripheral side end portion of the molded resin, and the wide portion is embedded and fixed in an interior of the molded resin in a state extended toward the interior from the outer peripheral side end portion of the molded resin.

Abstract: In an information processing device, an acquisition unit acquires current position information of a vehicle. A route search unit searches for a route from a departure place via the current position of the vehicle to a destination based on the current position information of the vehicle acquired by the acquisition unit.

Abstract: An information processing apparatus includes an in-vehicle device mounted on a vehicle. The in-vehicle device includes a display device and a processor. The in-vehicle device outputs, on the display device, weather information of a point designated by a user on a map, displays a travel route along which the vehicle travels on the map on the display device, and in a case where the travel route is not included in the area including the point designated by the user on the map among a plurality of areas obtained by dividing the map and the processor determines that the point designated by the user is within a predetermined range from the travel route, outputs, on the display device, the weather information of an area closest to the point designated by the user among the areas including the travel route.

Abstract: An information processing apparatus includes an in-vehicle device mounted on a vehicle. The in-vehicle device includes a display device and a processor. The in-vehicle device outputs, on the display device, weather information of a point designated by a user on a map, displays a travel route along which the vehicle travels on the map on the display device, and in a case where the travel route is not included in the area including the point designated by the user on the map among a plurality of areas obtained by dividing the map and the processor determines that the point designated by the user is within a predetermined range from the travel route, outputs, on the display device, the weather information of an area closest to the point designated by the user among the areas including the travel route.

Abstract: A determination device that determines a tendency of a driver who selects a parking space includes an acquisition unit configured to acquire information regarding an attribute of the parking space in a parking lot, information regarding behavior of a vehicle driven by the driver in the parking lot, and information regarding behavior of the driver when the driver is driving the vehicle in the parking lot, and a determination unit configured to determine the tendency of the driver when the driver selects the parking space, based on the information regarding the behavior of the vehicle or the information regarding the behavior of the driver and the information regarding the attribute of the parking space.

Abstract: A determination device determines a tendency of a driver who selects a parking space and includes an acquisition unit and a determination unit. The acquisition unit is configured to acquire information regarding an attribute of the parking space in a parking lot, information regarding behavior of a vehicle driven by the driver in the parking lot, and information regarding behavior of the driver when the driver is driving the vehicle in the parking lot. The determination unit is configured to determine the tendency of the driver when the driver selects the parking space, based on the information regarding the behavior of the vehicle or the information regarding the behavior of the driver and the information regarding the attribute of the parking space.

Abstract: A determination device determines a tendency of a driver who selects a parking space and includes an acquisition unit and a determination unit. The acquisition unit is configured to acquire information regarding an attribute of the parking space in a parking lot, information regarding behavior of a vehicle driven by the driver in the parking lot, and information regarding behavior of the driver when the driver is driving the vehicle in the parking lot. The determination unit is configured to determine the tendency of the driver when the driver selects the parking space, based on the information regarding the behavior of the vehicle or the information regarding the behavior of the driver and the information regarding the attribute of the parking space.

Abstract: A semiconductor module includes a semiconductor switching element, a multiple of bases, on at least one of which the semiconductor switching element is mounted, a molded resin that seals the semiconductor switching element and the multiple of bases, a multiple of terminals formed integrally with each one of the multiple of bases and provided extending from an outer periphery side face of the molded resin, and a recessed portion or a protruding portion having a depth or a height such that creepage distance between the multiple of terminals is secured, and formed so as to cross an interval between the multiple of terminals, in one portion of the outer periphery side face of the molded resin between the multiple of terminals.

Abstract: A semiconductor module (1) such that warping or distortion is prevented, and reliability can be increased, is obtained. The semiconductor module (1) includes a base (10a) configuring a multiple of terminals (C1 to C6, B1, B2, M1, M2) or wires (G1, G2), a semiconductor switching element (T1 to T4) mounted on a mounting portion (21) of the terminal (C1 to C6, B1, B2, M1, M2), and a molded resin (20) that seals the semiconductor switching element (T1 to T4), wherein a wide portion (G10, G20) having a width greater than that of the terminal (C1 to C6, B1, B2, M1, M2) or the wire (G1, G2) is formed in one portion of the terminal (C1 to C6, B1, B2, M1, M2) or the wire (G1, G2) in an outer peripheral side end portion of the molded resin (20), and the wide portion (G10, G20) is embedded and fixed in an interior of the molded resin (20) in a state extended toward the interior from the outer peripheral side end portion of the molded resin (20).

Abstract: Lands (11c and 11d) are parts of base plates (104c and 104d), and electrodes of a shunt resistor (103U) are put on and connected to the lands (11c and 11d). Slits (130 and 131) are formed in the lands (11c and 11d) to separate a main electric circuit in which a main current flows and control terminals (123 and 124) with which the electric potentials of the electrodes of the shunt resistor (103U) are detected. Leading end portions of the slits (130 and 131) extend to the vicinity of the electrodes of the shunt resistor (103U).

Abstract: In a wiring member, an element connection portion, a plate connection portion, and an upper surface portion are at height positions different from one another. The element connection portion has a through hole, and the plate connection portion has a through hole and a chamfer. The upper surface portion which is not connected to another portion, has projections asymmetrically disposed on both side surfaces thereof. Owing to these features, the type, the orientation, and the front and the back of the wiring member can be easily distinguished. Accordingly, it is possible to prevent incorrect assembling of the wiring member in a semiconductor module.

Abstract: A shared base plate includes a plurality of base portions to which a plurality of electronic components including semiconductor switching elements are to be mounted, and a terminal formed portion formed so as to extend from the base portion to the outer side. The terminal formed portion includes a discrimination terminal which is used as a terminal in one of a first semiconductor module and a second semiconductor module and which is not used as a terminal in the other one. If the discrimination terminal that is not used as a terminal is cut to be short, it becomes possible to easily discriminate the semiconductor module from another semiconductor module having the shared base plate by outer appearances.