Patents by Inventor Kensuke Tsunesa

Kensuke Tsunesa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devicse, a semicinductor module loaded with said semiconductor device and a method of manufacturing said semicoductor device
    Publication number: 20010026009
    Abstract: A memory TCP loaded with four chips (1-bank 16-bit type) is constructed by a tape of one two-layer wiring layer structure, four chips mounted to this tape, etc. Common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side. The common signal terminals on the two sides are electrically connected to each other common signal wiring. Further, in a DIMM in which this memory TCP is mounted to front and rear sides of a substrate, plural external terminals are formed on one long side of the rectangular substrate, and the memory TCP is mounted such that the independent signal terminal of the memory TCP is arranged along an arranging direction of these external terminals.
    Type: Application
    Filed: March 8, 2001
    Publication date: October 4, 2001
    Inventors: Kensuke Tsunesa, Toshio Sugano, Seiichiro Tsukui, Kouji Nagaoka, Tomohiko Sato